NXP Semiconductors MCZ33903CS3EKR2

Overview

MCZ33903CS3EKR2 from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN transceiver, dual LIN 2.1/J2602-2 interfaces, 5.0 V MCU supply regulator (VDD), internal 5.0 V CAN regulator (VCAN), and fail-safe state machine. It delivers 150 mA VDD output, supports 40 kB/s–1.0 MB/s CAN data rates and 10.4–20 kB/s LIN data rates, and operates from 5.5–28 V input across –40 °C to 125 °C - deployed in body control modules and door modules with S12x or MPC560x MCUs.

For engineers reviewing the MCZ33903CS3EKR2 datasheet, MCZ33903CS3EKR2 pinout, MCZ33903CS3EKR2 application, or MCZ33903CS3EKR2 equivalent, key selection criteria include its dual-LIN capability, 5.0 V VDD output without external ballast transistor, SOIC-32 exposed pad package, ISO11898-2/5 and LIN 2.1 compliance, and 15 µA ultra-low sleep current with active wake-up.

Technical Context

The MCZ33903CS3EKR2 implements an integrated high-speed CAN physical layer compliant with ISO11898-2 and ISO11898-5, featuring bus failure diagnostics, local/remote wake-up detection, and fail-safe operation triggered via the SAFE pin. Its dual LIN transceivers support full LIN 2.1 and SAE J2602-2 conformance with configurable master termination outputs.

Power management includes a fixed 5.0 V linear regulator for VDD (150 mA max, no external PNP support), dedicated 5.0 V regulator for CAN drivers, and precision VSUP sensing with analog MUX for battery monitoring. The secured SPI interface includes watchdog functionality and parity checking, while the fail-safe state machine enables hardware-configurable default behavior during fault conditions.

Key Specifications

Pinout & Package

MCZ33903CS3EKR2 is housed in a Pb-free 32-pin SOIC wide-body package with exposed thermal pad (98ASA10556D), optimized for automotive thermal and EMC performance. Pin count and layout align with MC33903 family SOIC-32 footprint.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Compared with MCZ33903CS3EKR2, MCZ33903BS3EKR2 offers identical dual-LIN functionality but targets 3.3 V MCU systems, whereas MCZ33904C3EKR2 removes LIN entirely to provide enhanced analog monitoring and VAUX regulation - making it suitable for CAN-centric gateway designs needing broader system supervision.

Availability

MCZ33903CS3EKR2 is available at Aetrix Electronics and suitable for door modules, body control modules, seat modules, and column modules requiring stable component supply, automotive-grade reliability, and long-term lifecycle support.

Supply support for MCZ33903CS3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive power management and communication ICs.

The MC33903 family is part of NXP's System Basis Chip portfolio designed specifically for automotive electronic control units requiring integrated power, high-speed CAN, and LIN communication - targeting body, safety, and powertrain domains.

FAQ

What is the VDD output capability of MCZ33903CS3EKR2?

The MCZ33903CS3EKR2 provides a fixed 5.0 V VDD output rated for up to 150 mA. Unlike higher-current variants (e.g., MCZ33903D), this version does not support external ballast transistor augmentation. It is intended for direct powering of automotive MCUs such as S12x or MPC560x that operate at 5.0 V and require ≤150 mA supply current. The regulator features under-voltage management during cranking events.

Does MCZ33903CS3EKR2 support both CAN and LIN communication simultaneously?

Yes, MCZ33903CS3EKR2 integrates one high-speed CAN transceiver compliant with ISO11898-2 and ISO11898-5, plus two independent LIN 2.1/J2602-2 transceivers. All three interfaces operate concurrently, enabling the device to serve as a multi-protocol hub - for example, relaying CAN messages to LIN-attached actuators in a door module while maintaining diagnostic connectivity over CAN.

What package type and pin count does MCZ33903CS3EKR2 use?

MCZ33903CS3EKR2 uses a Pb-free 32-pin SOIC wide-body package with exposed thermal pad (document number 98ASA10556D). This SOIC-32 EP footprint ensures mechanical and thermal compatibility across the MC33903 family, simplifying board design reuse between variants such as MCZ33903BS3EKR2 and MCZ33903CS3EKR2.

How does the fail-safe state machine function in MCZ33903CS3EKR2?

The MCZ33903CS3EKR2 implements a hardware-based fail-safe state machine that activates on critical faults (e.g., overtemperature, VDD undervoltage, CAN bus failure). Upon triggering, it asserts the open-drain SAFE pin and transitions internal regulators and interfaces into predefined safe states - such as disabling non-critical outputs while preserving wake-up capability. Configuration is done via hardware strapping or SPI, supporting ASIL-B system-level safety goals.

Is MCZ33903CS3EKR2 qualified for automotive temperature and EMC requirements?

Yes, MCZ33903CS3EKR2 is qualified per AEC-Q100 Grade 1 (–40 °C to +125 °C) and certified for stringent automotive EMC/ESD standards including ±8 kV module-level ESD on CAN and LIN buses. It has passed OEM-specific conformance tests for ISO11898-2/5 and LIN 2.1, and supports robust operation under load dump (40 V transient) and cold-crank (5.5 V minimum) conditions.