NXP Semiconductors MCZ33903D3EK
- Part No.:
- MCZ33903D3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903D3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MCZ33903D3EK from NXP Semiconductors is a second-generation System Basis Chip (SBC) integrating a 3.3 V MCU power regulator, high-speed CAN transceiver (ISO 11898-2/5 compliant), and no LIN interface - configured as a single-wake-up-input variant in 32-pin SOIC exposed pad (SOT1746-3). It delivers fail-safe operation, ultra-low quiescent current in LP modes, and embedded diagnostics for automotive ECU power management.
For engineers reviewing the MCZ33903D3EK datasheet, MCZ33903D3EK pinout, MCZ33903D3EK application, or MCZ33903D3EK equivalent, this device serves as a dedicated low-LIN-count SBC for cost-optimized, diagnostics-enabled body control modules and sensor nodes requiring robust CAN communication, precise supply monitoring, and wake-up flexibility without LIN bus support.
Technical Context
The MCZ33903D3EK implements a state-machine-driven fail-safe architecture with multiple Low-Power (LP) modes, including VDD-ON and VDD-OFF states, enabling sub-10 µA quiescent current during sleep. Its integrated CAN physical layer supports baud rates from 40 kb/s to 1.0 Mb/s and includes bus fault detection, local failure diagnostics, and ISO 11898-5 partial networking capability.
Power management centers on a SMARTMOS-based 3.3 V VDD regulator (non-external-PNP configurable), a fully protected 5 V-CAN regulator, and programmable undervoltage detection for cranking scenarios. Wake-up sources include CAN bus activity, I/O transition, SPI message, and internal timer - all configurable via SPI registers without MCU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±2%, fixed output; powers MCU core directly without external PNP support per datasheet note. |
| CAN Interface | ISO 11898-2 & -5 compliant; supports 40 kb/s–1.0 Mb/s; includes bus fault, short-to-battery/ground, and overtemperature diagnostics. |
| Quiescent Current (LP Mode) | <10 µA typical in VDD-OFF LP mode; enables long-term battery-powered ECU sleep without drain concerns. |
| Wake-up Inputs | 1 dedicated wake-up pin (I/O-0); supports edge-triggered wake from CAN, SPI, timer, or I/O transition events. |
| Package | 32-pin SOIC with exposed thermal pad (SOT1746-3); footprint-compatible with MC33904/MC33905S variants. |
| Operating Temp | −40 °C to +125 °C ambient; qualified for under-hood automotive applications per AEC-Q100. |
| VSUP Input Range | −0.3 V to 28 V DC (transient up to 40 V); withstands load dump and cold-crank conditions without external protection. |
Pinout & Package
MCZ33903D3EK uses a 32-pin SOIC package with exposed thermal pad (SOT1746-3), optimized for thermal dissipation in automotive environments. Pin layout matches MC33904 and MC33905S footprints for design reuse.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Battery Supply Input | Main input (−0.3 V to 28 V); powers internal regulators, reset circuitry, and VDD stage; internally connected to VSUP2. |
| VDD | MCU Power Output | 3.3 V regulated output; supplies microcontroller core; no external PNP support per datasheet note (2). |
| CANH / CANL | CAN Bus Differential Outputs | Direct connection to CAN bus; integrated termination and fault protection eliminate need for discrete transceiver components. |
| SAFE | Fail-Safe Output | Open-drain active-low signal asserted during watchdog timeout, VDD undervoltage, or RST pin fault - triggers system-level safe state. |
| I/O-0 | Configurable Wake-up Pin | Programmable as input (wake source) or HS output; supports cyclic sense in LP mode; no overtemperature protection when used as driver. |
| INT / RST / CS / SCLK / MOSI / MISO | SPI & Control Interface | Standard 4-wire SPI (CS/SCLK/MOSI/MISO) with interrupt and reset outputs; CS transition wakes device from LP VDD-ON mode. |
Key Features
| Feature | Design Value |
|---|---|
| Fail-Safe State Machine | Hardware-enforced safe state activation on critical faults (e.g., watchdog timeout, VDD UVLO, RST pin anomaly), independent of MCU firmware. |
| Embedded CAN Transceiver | Meets ISO 11898-2/5; includes bus short detection, local failure diagnostics, and partial networking (PN) support for ECU wake-up efficiency. |
| Low-Power Operation | Sub-10 µA quiescent current in VDD-OFF LP mode; enables >10-year battery life in always-on vehicle modules. |
| Supply Monitoring | MUX-OUT pin provides SPI-selectable analog monitoring of VDD, VSUP, and internal reference voltages - eliminates need for external ADC inputs. |
| Robust Wake-up Flexibility | Single I/O-0 pin supports wake on CAN frame, SPI command, timer expiry, or digital edge - reduces BOM count vs. discrete wake controllers. |
Applications
| Body Control Module (BCM) | Door Module Controller |
|---|---|
|
Use Scenario: Centralized power and communication hub for door locks, window lifts, mirror controls, and interior lighting in modern vehicles. IC Role / Device Role / Timing Role: SBC provides regulated 3.3 V MCU supply, CAN interface for body network messaging, and wake-up response to key fob or door handle signals. Use Value: Eliminates discrete CAN transceiver, LDO, and wake-up controller; reduces PCB area by 35% and component count by ≥7 vs. discrete solution. |
Use Scenario: Localized control unit inside vehicle door assembly managing motor drivers, sensors, and LIN-connected switches. IC Role / Device Role / Timing Role: Delivers fail-safe power sequencing, CAN diagnostics, and low-current sleep mode while supporting wake-up from CAN or local I/O events. Use Value: Enables <10 µA standby current for multi-year battery-backed operation; built-in SAFE pin simplifies ASIL-B-compliant fail-safe design. |
| Engine Bay Sensor Node | Industrial Actuator Control |
|
Use Scenario: Remote temperature/pressure sensor node mounted near engine block, communicating via CAN to main ECU. IC Role / Device Role / Timing Role: Provides ruggedized 3.3 V supply, transient-hardened CAN interface, and cranking-aware undervoltage detection during start-stop cycles. Use Value: Withstands 40 V load dump transients and −40 °C to +125 °C operation without derating; eliminates need for external TVS and voltage supervisors. |
Use Scenario: Motorized valve or hydraulic actuator controller in agricultural or construction equipment requiring CAN-based remote commands and diagnostics. IC Role / Device Role / Timing Role: Manages MCU power, executes CAN protocol stack, monitors supply integrity, and asserts SAFE signal on detected overcurrent or thermal fault. Use Value: Integrated current/voltage/temperature protection reduces external sensing components; MUX-OUT enables real-time supply health reporting over CAN. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33904D3EK/R2 | Same 32-pin SOIC package, 3.3 V VDD, zero-LIN, but includes VSENSE, VAUX, and MUX-OUT features absent in MCZ33903D3EK. | Supports battery voltage monitoring and auxiliary rail generation - suitable where supply telemetry or extra regulation is required. | Select MCZ33904D3EK/R2 if VSENSE input, VAUX output, or MUX-OUT analog monitoring are needed; otherwise MCZ33903D3EK offers lower cost and identical core SBC functionality. |
| MCZ33903DP3EK/R2 | Same family, same package, 3.3 V VDD, zero-LIN, but provides three wake-up inputs (vs. one) and includes VSENSE and MUX-OUT. | Enables multi-sensor wake-up (e.g., motion + CAN + timer) and supply monitoring - ideal for complex node-level autonomy. | Choose MCZ33903DP3EK/R2 when >1 wake-up source or VSENSE capability is required; MCZ33903D3EK remains optimal for minimal-wake, cost-sensitive designs. |
Compared with MCZ33904D3EK/R2 and MCZ33903DP3EK/R2, the MCZ33903D3EK trades auxiliary monitoring and multi-wake capability for lowest BOM cost and smallest feature set - making it the most streamlined choice for basic CAN-node power management without telemetry overhead.
Availability
MCZ33903D3EK is available at Aetrix Electronics and suitable for automotive body control modules, engine bay sensor nodes, industrial actuator controllers, and door module applications requiring stable component supply across extended product lifecycles.
Supply support for MCZ33903D3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient silicon solutions with deep system-level expertise.
The MCZ33903D3EK belongs to NXP's System Basis Chip Gen2 family, designed specifically for automotive electronic control units needing integrated power regulation, CAN communication, fail-safe operation, and ultra-low-power sleep - without LIN bus overhead.
FAQ
What is the primary function of the MCZ33903D3EK in an automotive ECU?
The MCZ33903D3EK serves as a System Basis Chip that integrates a 3.3 V MCU power regulator, ISO 11898-2/5-compliant CAN transceiver, fail-safe state machine, and wake-up logic into a single 32-pin SOIC package. In an automotive ECU, the MCZ33903D3EK manages power sequencing, enables robust CAN communication, monitors supply integrity, and ensures safe shutdown on critical faults - reducing reliance on discrete support components.
Does the MCZ33903D3EK support external PNP transistor augmentation for its VDD regulator?
No, the MCZ33903D3EK does not support external PNP transistor augmentation for its VDD regulator. Per datasheet Note 2 in Table 3, "VDD does not allow usage of an external PNP on the 33903." This distinguishes it from other family members like MC33905, where external PNP support is explicitly enabled. The MCZ33903D3EK's 3.3 V VDD output is self-contained and rated for its specified load current without external pass devices.
How many wake-up sources does the MCZ33903D3EK support, and how are they configured?
The MCZ33903D3EK supports exactly one dedicated wake-up input pin: I/O-0. This pin is configurable via SPI as either a wake-up input (edge-triggered) or a high-side output driver. Wake-up events can be generated by CAN bus activity, SPI message reception, internal timer expiry, or digital transitions on I/O-0 - all managed autonomously by the device's state machine without MCU involvement during low-power modes.
Is the MCZ33903D3EK pin-compatible with other devices in the 33903/4/5 family?
Yes, the MCZ33903D3EK is footprint-compatible with MC33904 and MC33905S variants in the same 32-pin SOIC exposed-pad package (SOT1746-3). Pin assignments for core functions - including VSUP, VDD, CANH/CANL, INT, RST, SPI interface, and I/O-0 - match across these parts. This allows hardware reuse across different SBC configurations (e.g., zero-LIN vs. single-LIN) without PCB redesign.
What diagnostic capabilities does the MCZ33903D3EK provide for CAN bus health monitoring?
The MCZ33903D3EK provides comprehensive CAN bus diagnostics including detection of bus shorts (to battery or ground), open circuits, dominant/recessive time violations, and local failure conditions such as TXD short-to-ground. These diagnostics are reported via SPI-accessible status registers and can trigger the SAFE pin assertion. All diagnostics operate independently of MCU firmware, ensuring reliability even during software hangs or resets - a critical capability for ASIL-B functional safety compliance.
MCZ33903D3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SOIC-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903D3EK FAQ
1.How can I place an order for MCZ33903D3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903D3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903D3EK reliable?
The price and inventory of MCZ33903D3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903D3EK is usually 5 days.
3.What payment methods are accepted for MCZ33903D3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903D3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903D3EK?
MCZ33903D3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903D3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903D3EK?
For technical support, including MCZ33903D3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903D3EK requirements.
6.How does Aetrix verify that MCZ33903D3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33903D3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903D3EK meets industry standards.
7.What is the process for return or replacement of MCZ33903D3EK?
All MCZ33903D3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903D3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903D3EK part is unused and in its original packaging.
Return procedure for MCZ33903D3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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