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NXP Semiconductors MCZ33903D3EKR2
- Part No.:
- MCZ33903D3EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903D3EKR2.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,257
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Product details
Overview
MCZ33903D3EKR2 from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), 3.3 V MCU power regulator, fail-safe state machine, SPI interface, and one wake-up input - designed for automotive ECU power management in harsh environments. It operates from -40 °C to 125 °C, supports baud rates up to 1 Mb/s, and features embedded diagnostics including VDD undervoltage detection and cyclic sense capability.
For engineers reviewing the MCZ33903D3EKR2 datasheet, MCZ33903D3EKR2 pinout, MCZ33903D3EKR2 application, or MCZ33903D3EKR2 equivalent, this page delivers verified technical context, validated pin functions, real-world use cases in automotive ECUs, and two confirmed alternative parts with documented functional and packaging differences - all grounded in NXP's official MC33903_4_5 Rev. 15.0 datasheet.
Technical Context
The MCZ33903D3EKR2 implements a dedicated fail-safe state machine that monitors watchdog refresh, RST pin integrity, and VDD voltage to assert SAFE (active-low) on fault. Its CAN physical layer complies with ISO 11898-5 for partial networking, enabling selective wake-up at 40 kb/s–1 Mb/s without bus disturbance.
This variant belongs to the 33903D subfamily: it has zero LIN interfaces, no VAUX/VSENSE/MUX-OUT functionality, and uses only one wake-up input (I/O-0). Unlike 33903D variants with LIN, it omits LIN-T1/I/O-2 and LIN-T2/I/O-3 pins - confirmed by Figure 12 and Table 4 pin definitions for 32-pin 33903D.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±2%, supplies MCU core logic; not compatible with external PNP extension per datasheet Note 2. |
| CAN Interface | High-speed ISO 11898-2/5 compliant; supports 40 kb/s–1 Mb/s baud rates with local/bus failure diagnostics. |
| Operating Temp | -40 °C to +125 °C ambient; qualified for automotive underhood and ECU module applications. |
| Supply Range | VSUP1/VSUP2: -0.3 V to 28 V DC (40 V transient); enables direct battery connection with load-dump resilience. |
| LP Mode Current | <30 µA typical in VDD-ON LP mode; enables ultra-low-power ECU sleep states with wake-up via CAN or I/O-0. |
| Wake-up Inputs | 1 dedicated wake-up pin (I/O-0); configurable as HS output or transition-sensitive input in low-power modes. |
| Package | 32-pin SOIC exposed pad (SOT1746-3); footprint-compatible with MC33904, MC33905S, and other 33903 variants. |
Pinout & Package
MCZ33903D3EKR2 uses a 32-pin SOIC exposed pad package (SOT1746-3), thermally enhanced for automotive underhood operation. Pin layout matches MC33904 and MC33905S footprints per Figure 11 and Figure 12 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP/1 | Battery supply input | Main power rail for internal regulators and POR circuitry; internally connected to VSUP2 in this variant. |
| VDD | MCU supply output | 3.3 V regulated output; powers microcontroller core; no external PNP support per datasheet Note 2. |
| CANH / CANL | CAN differential pair | Direct connection to vehicle CAN bus; integrated protection per ISO 11898-5; supports partial networking. |
| SAFE | Fault indicator output | Open-drain active-low signal asserting on VDD undervoltage, watchdog timeout, or RST pin fault. |
| I/O-0 | Configurable I/O | Sole wake-up source; programmable as input (edge-triggered) or HS output in LP mode for cyclic sensing. |
| INT / RST / CS / SCLK / MOSI / MISO | SPI & control interface | Full SPI slave interface (4-wire) plus reset and interrupt signaling; CS transition wakes device from LP mode. |
| GND / GND-CAN / EX PAD | Ground terminals | Dedicated CAN ground (GND-CAN) and thermal pad (EX PAD) ensure noise isolation and thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Hardware-monitored watchdog, VDD, and RST integrity - triggers SAFE assertion without MCU intervention. |
| ISO 11898-5 CAN | Enables selective wake-up at 40 kb/s–1 Mb/s while maintaining bus dominance; critical for ECU low-power operation. |
| VDD undervoltage detection | Multiple thresholds address cranking conditions and MCU-specific reset requirements - no external components needed. |
| Low-power modes | VDD-ON LP mode draws <30 µA; wake-up sources include CAN activity, I/O-0 transition, and SPI message reception. |
| SMARTMOS technology | Enables integrated high-voltage protection (±40 V transients), current limiting, and thermal shutdown on all I/Os. |
Applications
| Automotive Body Control Module (BCM) | Engine Control Unit (ECU) Power Management |
|---|---|
|
Use Scenario: Centralized power sequencing and fault monitoring for door modules, lighting, and HVAC actuators in 12 V vehicle architectures. IC Role / Device Role / Timing Role: Primary SBC managing MCU VDD, CAN communication, and safe-state response during battery transients. Use Value: Eliminates discrete LDOs, reset supervisors, and CAN transceivers - reducing BOM count and PCB area while ensuring ASIL-B–compatible fail-safe behavior. |
Use Scenario: Powering and supervising engine control microcontrollers in under-hood environments subject to wide temperature swings and load-dump events. IC Role / Device Role / Timing Role: Regulates 3.3 V MCU supply, monitors VDD stability, and asserts SAFE on undervoltage or watchdog timeout to initiate controlled shutdown. Use Value: Guarantees deterministic reset behavior during cranking (6–8 V battery dips) and meets OEM requirements for diagnostic coverage and functional safety. |
| Industrial Motor Drive Controller | Off-Highway Vehicle Telematics Node |
|
Use Scenario: Controlling DC brush motors in agricultural machinery with integrated diagnostics for overcurrent, overtemperature, and CAN bus faults. IC Role / Device Role / Timing Role: Provides regulated MCU power, CAN physical layer, and wake-up via I/O-0 from sensor interrupts - enabling responsive motor control loops. Use Value: Enables single-chip power + communication solution with built-in cyclic sense for current monitoring - reducing external ADC and shunt resistor count. |
Use Scenario: Telematics gateway in construction equipment requiring robust CAN connectivity, low quiescent current in standby, and reliable wake-up from GPS or cellular events. IC Role / Device Role / Timing Role: Acts as system basis chip for ARM-based telematics processor - delivering 3.3 V power, CAN interface, and fail-safe reset coordination. Use Value: Achieves <30 µA sleep current with CAN bus wake-up capability - extending battery life in always-on tracking applications without compromising responsiveness. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33904D3EK/R2 | Same 32-pin SOIC package, 3.3 V VDD, zero LIN, but includes VSENSE and MUX-OUT - absent in MCZ33903D3EKR2. | Supports battery voltage monitoring and analog signal multiplexing; suitable where VDD supervision alone is insufficient. | Select MCZ33904D3EK/R2 if VSENSE-based diagnostics or MUX-OUT for MCU ADC monitoring are required. |
| MCZ33903DP3EK/R2 | Same family, 3.3 V VDD, zero LIN, but provides three wake-up inputs (I/O-0, I/O-2, I/O-3) versus one in MCZ33903D3EKR2. | Enables multi-sensor wake-up (e.g., from door switch, seat belt, and ignition sense) without external logic. | Choose MCZ33903DP3EK/R2 when multiple independent wake-up sources are needed in LP mode. |
Compared with MCZ33903D3EKR2, MCZ33904D3EK/R2 adds VSENSE/MUX-OUT for enhanced diagnostics, while MCZ33903DP3EK/R2 expands wake-up flexibility - both retain identical CAN performance, fail-safe architecture, and thermal SOIC packaging for drop-in compatibility in non-LIN systems.
Availability
MCZ33903D3EKR2 is available at Aetrix Electronics and suitable for automotive body control modules, engine control units, industrial motor drives, and off-highway telematics nodes requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCZ33903D3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communications solutions, with deep expertise in functional safety and automotive-grade reliability.
The MC33903 family is part of NXP's System Basis Chip portfolio, engineered specifically for automotive electronic control units requiring integrated power regulation, high-speed CAN, fail-safe monitoring, and ultra-low-power operation in demanding environments.
FAQ
Does MCZ33903D3EKR2 support external PNP transistor extension for the VDD regulator?
No, MCZ33903D3EKR2 does not support external PNP transistor extension for the VDD regulator. Per datasheet Note 2 in Table 3, "VDD does not allow usage of an external PNP on the 33903." This restriction applies specifically to all MC33903 variants, including MCZ33903D3EKR2 - unlike some 33905 family members which permit PNP sharing.
What is the maximum CAN baud rate supported by MCZ33903D3EKR2?
MCZ33903D3EKR2 supports CAN baud rates from 40 kb/s up to 1 Mb/s, fully compliant with ISO 11898-2 and ISO 11898-5 standards. Its high-speed CAN physical layer enables partial networking and selective wake-up - essential for low-power ECU operation in modern automotive networks.
How many wake-up sources does MCZ33903D3EKR2 provide, and which pins are used?
MCZ33903D3EKR2 provides exactly one wake-up source: the I/O-0 pin. As confirmed in Table 3 and Figure 12 of the datasheet, this variant (33903D with zero LIN) is specified for "1 Wake-up" only. I/O-0 is configurable as a transition-sensitive input in low-power modes and can also serve as a high-side output for cyclic sensing.
Is MCZ33903D3EKR2 pin-compatible with other 33903 variants like MCZ33903DP3EK/R2?
Yes, MCZ33903D3EKR2 is footprint-compatible with MCZ33903DP3EK/R2 and other 32-pin 33903 variants (e.g., 33903S, 33903D), all using the SOT1746-3 SOIC exposed pad package. However, pin functions differ: MCZ33903D3EKR2 leaves I/O-2 and I/O-3 as no-connects, while MCZ33903DP3EK/R2 assigns them as additional wake-up inputs.
Does MCZ33903D3EKR2 include LIN interface functionality?
No, MCZ33903D3EKR2 has zero LIN interfaces. Per Table 3 in the datasheet, this part number is explicitly listed under "MC33903" (not "MC33903D" or "MC33903S") with "LIN interface(s): 0". Pins LIN-T1/I/O-2 and LIN-T2/I/O-3 are designated as no-connects in this variant, confirming absence of LIN transceiver or master logic.
MCZ33903D3EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SOIC-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903D3EKR2 FAQ
1.How can I place an order for MCZ33903D3EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903D3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903D3EKR2 reliable?
The price and inventory of MCZ33903D3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903D3EKR2 is usually 5 days.
3.What payment methods are accepted for MCZ33903D3EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903D3EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903D3EKR2?
MCZ33903D3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903D3EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903D3EKR2?
For technical support, including MCZ33903D3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903D3EKR2 requirements.
6.How does Aetrix verify that MCZ33903D3EKR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33903D3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903D3EKR2 meets industry standards.
7.What is the process for return or replacement of MCZ33903D3EKR2?
All MCZ33903D3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903D3EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903D3EKR2 part is unused and in its original packaging.
Return procedure for MCZ33903D3EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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