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NXP Semiconductors MCZ33903DD3EK
- Part No.:
- MCZ33903DD3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903DD3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,800
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Product details
Overview
MCZ33903DD3EK from NXP Semiconductors is a second-generation System Basis Chip (SBC) integrating high-speed CAN (ISO 11898-2/5), dual LIN 2.1 interfaces, 3.3 V MCU supply regulator, wake-up input configuration (1–3 pins), and fail-safe state machine - designed for automotive ECU power management in engine control, body electronics, and chassis modules.
For engineers reviewing the MCZ33903DD3EK datasheet, MCZ33903DD3EK pinout, MCZ33903DD3EK application, or MCZ33903DD3EK equivalent, this page delivers verified electrical specs, SPI-configurable regulators, LIN termination flexibility, CAN bus fault diagnostics, and footprint-compatible alternatives within the 33903 family.
Technical Context
The MCZ33903DD3EK implements a SMARTMOS-based power management architecture with integrated 5 V-CAN regulator, dual LIN transceivers (J2602-2/LIN 2.1 compliant), and configurable wake-up inputs supporting cyclic sense and SPI-triggered wake events. Its fail-safe state machine monitors VDD, RST, watchdog timeout, and CAN/LIN bus integrity to assert SAFE (active-low) on fault detection.
It supports ISO 11898-5 high-speed CAN at baud rates from 40 kb/s to 1.0 Mb/s, includes MUX-OUT for analog monitoring (VSENSE, internal voltage rails), and enables LIN master termination via LIN-T1/LIN-T2 pins - all while maintaining ≤ 100 µA quiescent current in LP modes with VDD ON.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CAN Interface | ISO 11898-2 and -5 compliant; supports 40 kb/s–1.0 Mb/s; includes bus fault diagnostics and fail-safe operation |
| LIN Interfaces | Dual LIN 2.1 channels with programmable master termination on LIN-T1/LIN-T2 pins |
| VDD Regulator Output | 3.3 V ±2%, 250 mA typical; no external PNP support per datasheet Note 2 |
| Quiescent Current (LP Mode) | ≤100 µA with VDD ON; enables ultra-low-power ECU sleep states |
| Wake-up Inputs | Configurable as 1–3 dedicated wake sources: CAN/LIN activity, I/O transition, SPI message, or timer |
| Package | 32-pin SOIC exposed pad (SOT1762-2); Pb-free (EK suffix); footprint compatible with MC33903S/P |
| Operating Temperature | −40 °C to +125 °C ambient; qualified for automotive underhood applications |
Pinout & Package
MCZ33903DD3EK uses a 32-pin SOIC exposed pad package (SOT1762-2), optimized for thermal dissipation in automotive ECUs. Pin layout is footprint-compatible with MC33903S and MC33903P variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Battery supply input | Primary 12 V battery rail connection; powers internal regulators and reset circuitry |
| VDD | MCU supply output | 3.3 V regulated output for microcontroller core logic; not extensible with external PNP |
| CANH / CANL | CAN physical layer outputs | Differential high-speed CAN bus interface with integrated protection and SPLIT pin support |
| LIN-T1 / LIN-T2 | LIN master termination outputs | Configurable as HS drivers to enable 1 kΩ LIN bus termination resistors; also usable as wake-up inputs |
| I/O-0 / I/O-1 | Programmable I/O | Supports cyclic sense, wake-up, or HS/LS switching in LP mode; monitored via SPI and MUX-OUT |
| MUX-OUT | Analog multiplexed output | Connects to MCU ADC; selectable internal signals include VSENSE, VDD, VAUX, and current sense voltages |
| SAFE | Fault indicator output | Open-drain active-low signal asserting on VDD undervoltage, watchdog timeout, RST fault, or CAN/LIN failure |
| INT / RST | Interrupt & reset control | INT signals SPI-accessible faults; RST provides active-low MCU reset with external reset monitoring |
Key Features
| Feature | Design Value |
|---|---|
| Dual LIN 2.1 interface with termination control | Enables two independent LIN subnetworks (e.g., door module + seat control) without external transceivers or resistors |
| Integrated 5 V-CAN regulator with protection | Eliminates need for external 5 V LDO; includes overcurrent, short-circuit, and thermal shutdown for CAN PHY |
| Configurable wake-up I/O (LIN-T1/LIN-T2/I/O-0) | Reduces external wake circuitry count; supports flexible ECU sleep/wake strategies across multiple buses and sensors |
| MUX-OUT analog monitoring | Provides real-time visibility into VSENSE (battery), VDD, and internal rail health via single MCU ADC channel |
| Fail-safe state machine with SAFE output | Automatically asserts SAFE on critical failures (e.g., VDD collapse, watchdog stall, RST pin fault), enabling system-level safety response |
Applications
| Engine Control Unit (ECU) | Body Control Module (BCM) |
|---|---|
|
Use Scenario: Centralized power management and communication for gasoline/diesel engine controllers with CAN diagnostics and LIN-sensor networks. IC Role / Device Role / Timing Role: Primary SBC managing MCU VDD, CAN/LIN physical layers, wake-up coordination, and fail-safe monitoring. Use Value: Reduces BOM count by integrating CAN transceiver, dual LIN drivers, and regulators - validated for cranking voltage (6 V–16 V) and load dump (40 V transient) conditions. |
Use Scenario: Power and communication hub for door modules, lighting controls, and HVAC actuators in modern vehicle body electronics. IC Role / Device Role / Timing Role: Dual-LIN master coordinating window lift, mirror fold, and interior lamp nodes; CAN gateway to main vehicle network. Use Value: LIN-T1/T2 pins directly drive 1 kΩ termination resistors, eliminating discrete components; MUX-OUT enables battery voltage supervision without extra ADC channels. |
| Chassis Control System | Electric Power Steering (EPS) |
|
Use Scenario: Safety-critical subsystem managing ABS, ESC, and suspension control units requiring robust wake-up, diagnostics, and fail-safe behavior. IC Role / Device Role / Timing Role: Fault-tolerant SBC providing VDD regulation, CAN bus integrity checks, and SAFE assertion on detected anomalies. Use Value: Fail-safe state machine meets ASIL-B readiness requirements; SAFE output triggers redundant controller shutdown or limp-home mode activation. |
Use Scenario: High-reliability motor control unit interfacing torque sensor, motor driver, and vehicle CAN backbone. IC Role / Device Role / Timing Role: Power manager for EPS MCU, CAN interface for steering angle reporting, and LIN interface for sensor calibration data exchange. Use Value: ≤100 µA LP-mode current extends battery life during vehicle standby; VSENSE monitoring detects low-battery conditions before EPS functional degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903DS3EK | Single LIN 2.1 interface; same 3.3 V VDD, 32-pin SOIC (SOT1762-2), and LP current spec | Suitable for cost-sensitive modules needing only one LIN subnetwork (e.g., HVAC control) | Select when dual-LIN capability is unnecessary; shares identical footprint and SPI register map |
| MCZ33903DP3EK | No LIN interface; adds third wake-up input; retains VSENSE, MUX-OUT, and CAN functionality | Optimized for CAN-only gateways or high-reliability systems where LIN is unused (e.g., ADAS camera ECU) | Choose for simplified design with no LIN transceivers required; maintains full CAN diagnostics and fail-safe features |
Compared with MCZ33903DD3EK, MCZ33903DS3EK reduces LIN channel count but preserves full CAN and power management capability, while MCZ33903DP3EK removes LIN entirely to maximize wake-up flexibility and reduce pin count overhead - both maintain identical package, temperature rating, and fail-safe architecture.
Availability
MCZ33903DD3EK is available at Aetrix Electronics and suitable for automotive engine control, body electronics, chassis systems, and electric power steering applications requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCZ33903DD3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal ICs.
The MCZ33903DD3EK belongs to NXP's System Basis Chip Gen2 family, engineered specifically for automotive electronic control units requiring integrated power management, high-speed CAN, and scalable LIN connectivity in harsh environments.
FAQ
What is the maximum CAN baud rate supported by the MCZ33903DD3EK?
The MCZ33903DD3EK supports high-speed CAN up to 1.0 Mb/s, fully compliant with ISO 11898-2 and ISO 11898-5 standards. It operates reliably across the full range of 40 kb/s to 1.0 Mb/s, with built-in bus fault diagnostics and fail-safe behavior activated on CANH/CANL short or open conditions - all verified in the MC33903_4_5 Rev. 15.0 datasheet.
Does the MCZ33903DD3EK support external PNP transistor extension for its VDD regulator?
No, the MCZ33903DD3EK does not support external PNP transistor extension for its VDD regulator. Per datasheet Note 2 in Table 3, "VDD does not allow usage of an external PNP on the 33903." This restriction applies specifically to all MC33903 variants including MCZ33903DD3EK, distinguishing it from MC33905 devices which do support external PNP augmentation.
How many wake-up sources does the MCZ33903DD3EK support, and what are they?
The MCZ33903DD3EK supports up to three configurable wake-up sources: CAN bus activity, LIN bus activity, I/O pin transitions (on I/O-0, LIN-T1, or LIN-T2), automatic timer expiration, SPI message reception, and VDD overcurrent detection. Configuration is done via SPI registers, and wake-up behavior is retained across LP modes - confirmed in Section 7.2 and Table 3 of the MC33903_4_5 datasheet.
What is the function of the MUX-OUT pin on the MCZ33903DD3EK?
The MUX-OUT pin on the MCZ33903DD3EK is a multiplexed analog output that connects to an MCU's ADC input. Via SPI commands, users select internal signals including VSENSE (battery voltage), VDD, internal reference voltages, or current-sense measurements. It includes an integrated switchable pull-down resistor for accurate VDD current sensing - detailed in Section 4.2 and Figure 10 of the MC33903_4_5 datasheet.
Is the MCZ33903DD3EK pin-compatible with other members of the 33903 family?
Yes, the MCZ33903DD3EK is pin-compatible with MCZ33903DS3EK and MCZ33903DP3EK, all using the same 32-pin SOIC exposed pad package (SOT1762-2). The pin definitions for VSUP, VDD, CANH/CANL, INT, RST, SPI, and SAFE are identical; only LIN-related pins (LIN-T1/LIN-T2) differ in function between variants - explicitly confirmed in Figure 12 and Table 4 of the MC33903_4_5 datasheet.
MCZ33903DD3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903DD3EK FAQ
1.How can I place an order for MCZ33903DD3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903DD3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903DD3EK reliable?
The price and inventory of MCZ33903DD3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903DD3EK is usually 5 days.
3.What payment methods are accepted for MCZ33903DD3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903DD3EK transactions.
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4.How is shipping managed for MCZ33903DD3EK?
MCZ33903DD3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903DD3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903DD3EK?
For technical support, including MCZ33903DD3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903DD3EK requirements.
6.How does Aetrix verify that MCZ33903DD3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33903DD3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903DD3EK meets industry standards.
7.What is the process for return or replacement of MCZ33903DD3EK?
All MCZ33903DD3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903DD3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903DD3EK part is unused and in its original packaging.
Return procedure for MCZ33903DD3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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