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NXP Semiconductors MCZ33903DP3EKR2

Part No.:
MCZ33903DP3EKR2
Manufacturer:
NXP Semiconductors
Category:
Specialized
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Datasheet:
AetrixMCZ33903DP3EKR2.pdf
Description:
IC INTERFACE SPECIALIZED 32SOIC
Quantity:
Payment:
Payment
Shipping:
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Inventory:1,097

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Product details

Overview

MCZ33903DP3EKR2 from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), 3.3 V MCU power regulator, three wake-up inputs, and fail-safe state machine - designed for automotive ECU power management in battery-supplied systems with diagnostics and low-power operation.

For engineers reviewing the MCZ33903DP3EKR2 datasheet, MCZ33903DP3EKR2 pinout, MCZ33903DP3EKR2 application, or MCZ33903DP3EKR2 equivalent, this device serves as a compact, diagnostic-rich SBC for CAN-based ECUs requiring robust supply regulation, bus wake-up, and safe-state control under cranking and transient conditions.

Technical Context

The MCZ33903DP3EKR2 implements a SMARTMOS-based power management architecture with dual-supply inputs (VSUP1/VSUP2 internally connected), a 3.3 V VDD regulator (non-PNP extendable), and an embedded 5 V-CAN transceiver compliant with ISO 11898-5 up to 1 Mb/s. It supports LP modes with ultra-low quiescent current and multiple wake-up sources including CAN bus activity, I/O transitions, and SPI messages.

Its fail-safe state machine monitors VDD, RST, watchdog timeout, and critical pin states, asserting the open-drain SAFE pin low on fault. The device lacks LIN interfaces and VAUX/VSENSE/MUX-OUT functionality - confirmed by Table 3 and Figure 12 for the DP variant - distinguishing it from DS/DD/P5 variants.

Key Specifications

ParameterValue and Actual Design Meaning
VDD Output3.3 V ±2%, fixed output for MCU core supply; no external PNP support per datasheet note.
CAN InterfaceISO 11898-5 compliant high-speed CAN transceiver (40 kb/s–1 Mb/s); includes bus fault diagnostics and fail-safe operation.
Wake-up Inputs3 dedicated wake-up pins (I/O-0, I/O-2, I/O-3), configurable as inputs in LP mode; no LIN termination capability.
LP Mode Current< 30 µA typical in VDD-ON LP mode; enables extended battery life in always-on automotive modules.
Supply RangeVSUP1/VSUP2: -0.3 V to 28 V DC, 40 V transient (load dump); supports 12 V/24 V battery systems.
SAFE PinOpen-drain active-low fault indicator; asserts on VDD undervoltage, RST pin fault, or watchdog timeout.
Operating Temp-40 °C to +125 °C ambient; qualified for under-hood automotive applications.

Pinout & Package

MCZ33903DP3EKR2 uses a 32-pin SOIC exposed pad package (SOT1762-2), footprint-compatible with other MC33903 variants. Pin assignments are validated per Figure 12 and Table 4 of Rev. 15.0 datasheet.

Pin/TerminalCircuit RoleDesign Meaning
VSUPBattery InputMain supply input (VSUP1/VSUP2 internally tied); accepts 12 V/24 V battery with load-dump tolerance up to 40 V.
VDDMCU Power Rail3.3 V regulated output for microcontroller; not extensible with external PNP per datasheet note.
CANH / CANLCAN Bus InterfaceDifferential high-speed CAN physical layer outputs; integrated bus protection and fault detection.
SAFEFault IndicatorOpen-drain output asserted LOW on VDD undervoltage, RST fault, or watchdog timeout - triggers system safe state.
I/O-0 / I/O-2 / I/O-3Wake-up InputsThree programmable wake-up inputs in LP mode; no HS switching or LIN termination capability in DP variant.
RST / INT / CS / SCLK / MOSI / MISOSPI & Reset InterfaceStandard SPI interface (4-wire) plus active-low reset output; CS transition wakes device from LP mode.
GND / GND-CAN / EX PADGround PlanesSeparate digital, CAN, and thermal ground connections; exposed pad enhances thermal dissipation.

Key Features

FeatureDesign Value
Fail-Safe State MachineMonitors VDD, RST, watchdog, and critical pins; asserts SAFE pin to initiate ECU shutdown or limp-home mode.
ISO 11898-5 CAN ComplianceSupports baud rates from 40 kb/s to 1 Mb/s with bus short-circuit, overvoltage, and dominant-timeout diagnostics.
VDD Undervoltage DetectionMultiple thresholds (including cranking mode) ensure MCU reset before brownout; prevents erratic firmware execution.
Low-Power Wake-up FlexibilityThree independent wake-up inputs plus CAN bus activity enable selective ECU activation without full system wake.
SMARTMOS TechnologyEnables integrated high-voltage protection, thermal shutdown, and current limiting across all power domains.

Applications

Body Control Module (BCM)Door Module

Use Scenario: Centralized vehicle body electronics managing locks, windows, mirrors, and lighting via CAN backbone.

IC Role / Device Role / Timing Role: MCZ33903DP3EKR2 provides regulated 3.3 V MCU supply, CAN physical layer, and wake-up on door handle LIN/CAN activity.

Use Value: Enables ultra-low quiescent current (<30 µA) in sleep mode while maintaining reliable CAN bus wake-up and safe-state response during battery drain events.

Use Scenario: Distributed module controlling window lift, mirror fold, and interior lighting in automotive door assemblies.

IC Role / Device Role / Timing Role: MCZ33903DP3EKR2 acts as power manager and CAN node - supplying MCU, interfacing to main CAN bus, and waking on key-fob signal or door-open event.

Use Value: Integrates supply regulation, CAN transceiver, and wake-up logic into single 32-pin SOIC, reducing BOM count and PCB area versus discrete solutions.

Seat Control UnitRoof Module

Use Scenario: Motor-driven seat position memory and heating control linked to vehicle CAN network.

IC Role / Device Role / Timing Role: MCZ33903DP3EKR2 delivers stable 3.3 V power to seat MCU, handles CAN communication, and wakes on seat switch press or ignition ON.

Use Value: Built-in VDD monitoring and SAFE pin assertion prevent unsafe motor actuation during supply faults - critical for ASIL-B adjacent functions.

Use Scenario: Sunroof, panoramic roof, or ambient lighting control module communicating over CAN.

IC Role / Device Role / Timing Role: MCZ33903DP3EKR2 supplies MCU, terminates CAN bus, and detects wake events from rain sensor or user switch via I/O pins.

Use Value: Eliminates need for external CAN transceiver and LDO, while providing diagnostic coverage (bus fault, VDD UVLO, watchdog) required for OEM functional safety compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCZ33903DP5EKR2Same package and pinout; VDD output is 5.0 V instead of 3.3 V; identical wake-up count and CAN functionality.Used where MCU requires 5 V supply; not suitable for 3.3 V-only MCUs without level-shifting.Select MCZ33903DP5EKR2 only if target MCU is 5 V tolerant and system design accommodates higher VDD rail power loss.
MCZ33903DS3EKR2Same 3.3 V VDD and 32-pin SOIC package; adds one LIN 2.1 interface and VSENSE/MUX-OUT capability; retains 3 wake-up inputs.Required when LIN communication (e.g., to seat sensors or ambient light ICs) is needed alongside CAN; increases diagnostic visibility.Choose MCZ33903DS3EKR2 if LIN bus integration is mandatory; note that LIN pins replace two I/Os and add routing complexity.

Compared with MCZ33903DP5EKR2 and MCZ33903DS3EKR2, the MCZ33903DP3EKR2 offers minimal BOM cost and layout simplicity for pure CAN-based 3.3 V ECUs - trading LIN capability and 5 V flexibility for lower component count and guaranteed 3.3 V compatibility.

Availability

MCZ33903DP3EKR2 is available at Aetrix Electronics and suitable for automotive body control modules, door modules, seat control units, and roof modules requiring stable component supply across extended temperature and harsh electrical environments.

Supply support for MCZ33903DP3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications.

The MC33903 family is part of NXP's System Basis Chip portfolio, engineered specifically for automotive electronic control units needing integrated power management, CAN/LIN interfaces, and functional safety-aware diagnostics.

FAQ

What is the primary function of the MCZ33903DP3EKR2 in an automotive ECU?

The MCZ33903DP3EKR2 serves as a System Basis Chip (SBC) that integrates a 3.3 V MCU power regulator, ISO 11898-5 high-speed CAN transceiver, three wake-up inputs, and a fail-safe state machine. In an automotive ECU, the MCZ33903DP3EKR2 manages power sequencing, enables CAN communication, detects wake events, and asserts the SAFE pin during faults - all within a single 32-pin SOIC package.

Does the MCZ33903DP3EKR2 support LIN communication?

No, the MCZ33903DP3EKR2 does not include any LIN interface. Per Table 3 and Figure 12 of the Rev. 15.0 datasheet, the "DP" variant is defined as having zero LIN channels. Its pinout omits LIN-T1, LIN-T2, RXD-L1, TXD-L1, and related signals - confirming it is a CAN-only SBC optimized for cost-sensitive, LIN-free ECUs.

Can an external PNP transistor be used to increase the current capability of the VDD regulator in the MCZ33903DP3EKR2?

No. The datasheet explicitly states in Table 3 footnote 2: "VDD does not allow usage of an external PNP on the 33903." This applies to all MC33903 variants, including the MCZ33903DP3EKR2. The 3.3 V VDD regulator is self-contained with internal current limiting and thermal protection, and no VE or VB pins are routed for external pass transistor support in this variant.

What wake-up sources are available in low-power mode for the MCZ33903DP3EKR2?

The MCZ33903DP3EKR2 supports three dedicated wake-up inputs (I/O-0, I/O-2, I/O-3), all configurable as digital inputs in LP mode. It also supports wake-up via CAN bus activity (RXD/CANH/CANL transitions), SPI chip select (CS) edge, and internal timer - but not LIN or VDD overcurrent, as those require LIN-capable or VAUX-equipped variants.

Is the MCZ33903DP3EKR2 pin-compatible with other MC33903 variants in the same package?

Yes - the MCZ33903DP3EKR2 uses the SOT1762-2 32-pin SOIC exposed pad package and shares identical pinout with MCZ33903DS3EKR2, MCZ33903DS5EKR2, and MCZ33903DP5EKR2. All share VSUP, VDD, CANH/CANL, SAFE, RST, INT, SPI, and I/O-0/I/O-2/I/O-3 assignments; differences lie only in internal feature enablement (e.g., LIN, VSENSE, MUX-OUT), not pin function or placement.

MCZ33903DP3EKR2 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
System Basis Chip
Interface:
CAN, LIN
Voltage - Supply:
5.5V ~ 28V
Supplier Device Package:
32-SSOP-EP
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

MCZ33903DP3EKR2 FAQ

1.How can I place an order for MCZ33903DP3EKR2 through Aetrix?

Please submit a Request for Quotation (RFQ) for MCZ33903DP3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCZ33903DP3EKR2 reliable?

The price and inventory of MCZ33903DP3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903DP3EKR2 is usually 5 days.

3.What payment methods are accepted for MCZ33903DP3EKR2?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903DP3EKR2 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCZ33903DP3EKR2?

MCZ33903DP3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCZ33903DP3EKR2 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCZ33903DP3EKR2?

For technical support, including MCZ33903DP3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903DP3EKR2 requirements.

6.How does Aetrix verify that MCZ33903DP3EKR2 is sourced from the original manufacturer or authorized distributors?

All MCZ33903DP3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903DP3EKR2 meets industry standards.

7.What is the process for return or replacement of MCZ33903DP3EKR2?

All MCZ33903DP3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903DP3EKR2, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCZ33903DP3EKR2 part is unused and in its original packaging.

Return procedure for MCZ33903DP3EKR2:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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