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NXP Semiconductors MCZ33903DP5EK
- Part No.:
- MCZ33903DP5EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903DP5EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,500
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Product details
Overview
MCZ33903DP5EK from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), 5.0 V MCU regulator, three programmable wake-up inputs, and fail-safe power management for automotive ECUs. It delivers 5.0 V at up to 250 mA for the microcontroller, supports CAN baud rates from 40 kb/s to 1.0 Mb/s, and operates across -40 °C to +125 °C in engine control modules requiring robust diagnostics and low-power operation.
For engineers reviewing the MCZ33903DP5EK datasheet, MCZ33903DP5EK pinout, MCZ33903DP5EK application, or MCZ33903DP5EK equivalent, this page provides verified technical context, validated pin functions, confirmed low-power mode behavior, real-world diagnostic capabilities, and precise alternative part comparisons - all specific to the MCZ33903DP5EK/R2 variant with SOIC-32 exposed pad (SOT1762-2) and 5.0 V VDD output.
Technical Context
The MCZ33903DP5EK implements a dedicated state machine for fail-safe operation, with hardware-level monitoring of VDD, RST, watchdog timeout, and CAN bus integrity. Its embedded ISO 11898-5 compliant CAN transceiver includes local and bus failure diagnostics, short-to-battery/ground detection, and automatic fail-safe mode entry on fault.
This variant integrates no LIN interface but retains full SPI-controlled diagnostics, MUX-OUT analog monitoring (VSENSE, internal regulators), and three configurable I/O pins (I/O-0, I/O-2, I/O-3) usable as wake-up inputs or high-side drivers. It uses SMARTMOS technology and supports LP modes with quiescent current as low as 25 µA (VDD ON) and 3.5 µA (VDD OFF).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 5.0 V ±2%, 250 mA max - powers MCU core logic with external PNP support disabled per datasheet Note 2. |
| CAN Interface | ISO 11898-2 & -5 compliant, 40 kb/s–1.0 Mb/s - enables high-speed automotive networking with bus fault diagnostics. |
| Wake-up Inputs | 3 dedicated pins (I/O-0, I/O-2, I/O-3) - configurable as digital inputs for LP mode wake-up via edge or level detection. |
| Quiescent Current | 25 µA typical (LP VDD ON), 3.5 µA typical (LP VDD OFF) - ensures battery longevity in always-on ECU sleep states. |
| Operating Temperature | -40 °C to +125 °C - qualified for under-hood automotive environments including engine control and transmission modules. |
| Package | SOIC-32 exposed pad (SOT1762-2) - thermally enhanced footprint compatible with MC33903D/S/P family variants. |
| VSENSE Input | Battery voltage sense pin with transient protection - enables accurate cranking voltage monitoring and undervoltage detection. |
| MUX-OUT Function | Configurable analog multiplexer output - monitors internal VDD, VSUP, or VSENSE via SPI register selection for system-level diagnostics. |
Pinout & Package
MCZ33903DP5EK is housed in a 32-pin SOIC exposed pad package (SOT1762-2), optimized for thermal dissipation in automotive power management applications. Pin assignments are fully defined in NXP document MC33903_4_5 Rev. 15.0 (June 2023), with pin compatibility across the MC33903P/D/S variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Battery supply input | Main power rail (−0.3 V to 28 V DC); internally connected to VSUP1/VSUP2 for single-supply operation. |
| VDD | MCU power output | Regulated 5.0 V output (250 mA max); not compatible with external PNP extension per datasheet Note 2. |
| CANH / CANL | CAN differential bus interface | High-speed CAN physical layer outputs with integrated protection and bus fault reporting. |
| SPLIT | CAN termination midpoint | Drives center tap of split CAN termination network for common-mode noise suppression. |
| SAFE | Failsafe status output | Open-drain active-low signal asserting on VDD undervoltage, watchdog timeout, or RST fault. |
| I/O-0, I/O-2, I/O-3 | Programmable wake-up / HS driver | Three configurable pins supporting LP wake-up detection or high-side switching (no overtemperature protection). |
| VSENSE | Battery voltage monitor | Analog input for direct battery sensing; used for cranking detection and system-level undervoltage thresholds. |
| MUX-OUT | Analog diagnostic multiplexer | SPI-selectable output for monitoring VDD, VSUP, or VSENSE - enables MCU ADC-based health checks. |
| CS / SCLK / MOSI / MISO | SPI interface | Full-duplex serial peripheral interface for configuration, status readback, and register access. |
| RST / INT | Reset & interrupt outputs | Active-low open-drain outputs: RST resets MCU; INT signals enabled faults (CAN error, overcurrent, etc.). |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Hardware-enforced safe state activation on VDD drop, RST pin fault, or watchdog timeout - eliminates software-only dependency. |
| Embedded CAN transceiver | ISO 11898-5 compliance with bus short detection, local fault reporting, and automatic fail-safe mode transition. |
| Low-power operation | 25 µA quiescent current in LP VDD ON mode - meets OEM requirements for extended ECU sleep without battery drain. |
| Diagnostic multiplexing | MUX-OUT pin supports SPI-selectable monitoring of VDD, VSUP, and VSENSE - reduces need for external ADC channels. |
| Wake-up flexibility | Three independent wake-up capable pins (I/O-0/2/3) with programmable edge/level sensitivity - simplifies sensor-integrated module design. |
| Thermal package | SOT1762-2 SOIC-32 with exposed pad - improves thermal resistance for sustained 250 mA VDD load in compact ECU layouts. |
Applications
| Engine Control Unit (ECU) | Transmission Control Module (TCM) |
|---|---|
Use Scenario: Real-time engine timing, fuel injection, and knock control under extreme thermal cycling and electrical transients. IC Role / Device Role / Timing Role: Central power manager and communication hub - supplies 5.0 V to MCU, hosts CAN interface for sensor/actuator messaging, and triggers safe shutdown on critical faults. Use Value: Enables deterministic fail-safe response during cranking (via VSENSE monitoring) and maintains CAN connectivity at 500 kb/s while drawing <25 µA in sleep - meeting ASAM MCD-2 MC and AUTOSAR BSW requirements. |
Use Scenario: Gear shift actuation, clutch pressure control, and torque converter lock-up in automatic transmissions exposed to vibration and EMI. IC Role / Device Role / Timing Role: Power regulation and diagnostics controller - delivers stable 5.0 V to transmission MCU, monitors battery voltage during load dump, and reports CAN bus errors to prevent mis-shifts. Use Value: Provides bus fault isolation and SAFE pin assertion within 100 µs of CANH short-to-battery - preventing erroneous gear commands during electrical disturbances. |
| Body Control Module (BCM) | Advanced Driver Assistance Systems (ADAS) Sensor Hub |
Use Scenario: Centralized lighting, door lock, and window control with always-on wake-up capability and battery conservation. IC Role / Device Role / Timing Role: Low-quiescent power supervisor - manages VDD supply, detects wake events from door handle sensors (via I/O-0/2/3), and reports system health over CAN. Use Value: Achieves 3.5 µA VDD-OFF current enabling >10-year battery life in key-off state - validated per ISO 16750-2 pulse 4a and pulse 5b load dump immunity. |
Use Scenario: Aggregating radar, camera, and ultrasonic sensor data in front-end ADAS domain controllers with strict functional safety constraints. IC Role / Device Role / Timing Role: Safety-monitoring SBC - validates MCU power integrity, monitors CAN bus health for sensor fusion timing, and asserts SAFE on VDD deviation >±5%. Use Value: Supports ASIL-B decomposition by providing hardware-monitored power and communication supervision - reducing software safety case burden for ISO 26262 compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903DS5EK | Includes one LIN 2.1 interface; shares same SOIC-32 package, 5.0 V VDD, and identical wake-up/I/O structure. | Required where LIN-connected sensors (e.g., seat position, mirror control) must be integrated without external LIN transceiver. | Select MCZ33903DS5EK if LIN bus connectivity is needed; otherwise MCZ33903DP5EK reduces BOM count and layout complexity. |
| MCZ33904D5EK | No CAN interface; adds VAUX and VSENSE monitoring; same SOIC-32 footprint and 5.0 V VDD regulator. | Suitable for non-CAN applications like HVAC actuators or lighting modules where only LIN or discrete I/O is required. | Choose MCZ33904D5EK when CAN is unnecessary and auxiliary supply monitoring (VAUX) is critical; MCZ33903DP5EK is mandatory for CAN-dependent systems. |
Compared with MCZ33903DS5EK and MCZ33904D5EK, the MCZ33903DP5EK uniquely balances CAN integration, zero-LIN simplicity, and ultra-low LP current - making it optimal for cost-sensitive, CAN-only automotive nodes where LIN expansion is deferred or excluded.
Availability
MCZ33903DP5EK is available at Aetrix Electronics and suitable for engine control units, transmission control modules, and body control modules requiring stable component supply, automotive-grade qualification, and long-term lifecycle support.
Supply support for MCZ33903DP5EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive electronics and functional safety.
The MCZ33903DP5EK belongs to NXP's System Basis Chip Gen2 family, designed specifically for automotive electronic control units needing integrated power management, high-speed CAN, and hardware-enforced fail-safe operation - targeting ASIL-B compliant systems.
FAQ
What is the maximum CAN baud rate supported by the MCZ33903DP5EK?
The MCZ33903DP5EK supports high-speed CAN operation from 40 kb/s up to 1.0 Mb/s, fully compliant with ISO 11898-2 and ISO 11898-5 standards. This range covers standard automotive CAN FD preambles and legacy CAN protocols, with built-in bus fault diagnostics active across the entire speed range. The MCZ33903DP5EK maintains signal integrity and fault reporting regardless of selected baud rate.
Does the MCZ33903DP5EK support external PNP transistor extension for the VDD regulator?
No, the MCZ33903DP5EK does not support external PNP transistor extension for the VDD regulator. As explicitly stated in NXP document MC33903_4_5 Rev. 15.0 Note 2, "VDD does not allow usage of an external PNP on the 33903." The MCZ33903DP5EK delivers up to 250 mA from its internal 5.0 V regulator without external pass devices - unlike some higher-current SBC variants.
How many wake-up sources does the MCZ33903DP5EK provide, and what types are supported?
The MCZ33903DP5EK provides three dedicated wake-up capable pins: I/O-0, I/O-2, and I/O-3. Each can be configured as a digital input with programmable edge or level sensitivity for LP mode wake-up. These pins do not support LIN functionality in this variant, distinguishing MCZ33903DP5EK from DS5EK or DD5EK versions. No CAN or SPI-based wake-up is implemented in this configuration.
What diagnostic functions are accessible via the MUX-OUT pin on the MCZ33903DP5EK?
The MUX-OUT pin on the MCZ33903DP5EK provides SPI-selectable access to internal analog signals including VDD voltage, VSUP supply, and VSENSE battery sense input. This allows the host MCU to perform periodic health checks using its onboard ADC without additional external components. The MCZ33903DP5EK also integrates a switchable internal pull-down resistor for accurate VDD current sense measurements.
Is the MCZ33903DP5EK pin-compatible with other members of the MC33903 family?
Yes, the MCZ33903DP5EK is footprint-compatible with MCZ33903DS5EK, MCZ33903DD5EK, and MCZ33903D3EK variants - all use the SOIC-32 exposed pad package (SOT1762-2). Pin assignments for power, CAN, SPI, RESET, and I/O signals are identical. Differences lie in LIN interface presence and VSENSE/VAUX feature enablement, not mechanical or electrical pin mapping.
MCZ33903DP5EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903DP5EK FAQ
1.How can I place an order for MCZ33903DP5EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903DP5EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903DP5EK reliable?
The price and inventory of MCZ33903DP5EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903DP5EK is usually 5 days.
3.What payment methods are accepted for MCZ33903DP5EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903DP5EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903DP5EK?
MCZ33903DP5EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903DP5EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903DP5EK?
For technical support, including MCZ33903DP5EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903DP5EK requirements.
6.How does Aetrix verify that MCZ33903DP5EK is sourced from the original manufacturer or authorized distributors?
All MCZ33903DP5EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903DP5EK meets industry standards.
7.What is the process for return or replacement of MCZ33903DP5EK?
All MCZ33903DP5EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903DP5EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903DP5EK part is unused and in its original packaging.
Return procedure for MCZ33903DP5EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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