My Inquiry
My Account
NXP Semiconductors MCZ33903DS3EK
- Part No.:
- MCZ33903DS3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903DS3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,379
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCZ33903DS3EK from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), one LIN 2.1 interface, 3.3 V MCU supply regulator, fail-safe state machine, and four configurable wake-up/I/O pins. It operates across -40 °C to 125 °C and targets automotive ECU power management with diagnostics in space-constrained modules.
For engineers reviewing the MCZ33903DS3EK datasheet, MCZ33903DS3EK pinout, MCZ33903DS3EK application, or MCZ33903DS3EK equivalent, this device serves as a single-chip solution for CAN/LIN-based ECUs requiring low-quiescent-current LP modes, SPI-controlled diagnostics, bus fault detection, and flexible I/O wake-up configuration - all in a 32-pin SOIC exposed-pad package.
Technical Context
The MCZ33903DS3EK implements a SMARTMOS-based power management architecture with dual-supply inputs (VSUP1/VSUP2), an integrated 3.3 V VDD regulator for MCU core supply, and a dedicated 5 V-CAN regulator compliant with ISO 11898-5. Its fail-safe state machine monitors watchdog, RST, VDD, and CAN bus integrity to assert SAFE (active-low) on fault.
It supports LIN 2.1 master operation via RXD-L/TXD-L pins with programmable termination (LIN-T1/I/O-2), offers cyclic sense capability on I/O-0/I/O-1 during LP modes, and enables analog monitoring (VSENSE, MUX-OUT) via SPI-configurable multiplexing - all while maintaining ≤ 30 µA quiescent current in VDD-ON LP mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±2%, 250 mA max - powers MCU core; no external PNP support per datasheet note. |
| CAN Interface | ISO 11898-2 & -5 compliant, 40 kb/s–1 Mb/s baud rate - supports high-speed automotive bus with local/bus failure diagnostics. |
| LIN Interface | Single LIN 2.1 master with TXD-L/RXD-L and LIN-T1/I/O-2 termination switch - J2602-2 compatible, no slave mode. |
| LP Mode Current | ≤30 µA (VDD-ON LP mode) - enables always-on ECU wake-up without battery drain. |
| Wake-up Inputs | 2–3 configurable wake sources: CAN/LIN activity, I/O transition, SPI message, or timer - supports flexible low-power entry/exit. |
| Operating Temp | -40 °C to +125 °C - qualified for under-hood automotive environments per AEC-Q100 stress test requirements. |
| Package | 32-pin SOIC with exposed pad (SOT1762-2) - thermally enhanced footprint compatible with MC33903D/S/P variants. |
Pinout & Package
MCZ33903DS3EK uses a 32-pin SOIC package with exposed thermal pad (SOT1762-2), footprint-compatible with other MC33903 variants (D/S/P). Pin functions are validated per NXP datasheet Rev. 15.0 (June 2023), Figure 12 and Table 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP / VSUP1 | Battery Supply Input | Main input for internal supplies, POR, and VDD regulator; internally connected to VSUP2 in this variant. |
| VDD | MCU Core Supply Output | 3.3 V regulated output (250 mA max); no external PNP support per datasheet note (2). |
| CANH / CANL | CAN Physical Layer | Differential high-speed CAN transceiver outputs compliant with ISO 11898-2/5; includes SPLIT pin for common-mode termination. |
| RXD-L / TXD-L | LIN 2.1 Data Interface | Receive/transmit data pins for single LIN bus; internal pull-up on TXD-L enables open-drain master operation. |
| LIN-T1 / I/O-2 | Configurable I/O or LIN Termination | Programmable as LIN master termination resistor output or HS wake-up input; no overtemperature protection when used as HS driver. |
| I/O-0 / I/O-1 | Flexible Wake-up / Cyclic Sense | Configurable as input (wake source) or HS/LS output; supports cyclic sense function in LP mode with I/O-0/I/O-1 pairing. |
| MUX-OUT | Analog Monitoring Output | SPI-selectable analog monitor (VDD, VSENSE, internal temp); includes switchable pull-down for VDD current sensing. |
| SAFE | Failsafe Alert Output | Open-drain active-low signal asserted on watchdog timeout, VDD undervoltage, RST fault, or CAN bus failure. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN Transceiver | ISO 11898-5 compliant with bus fault diagnostics, short-to-battery/ground detection, and fail-safe shutdown - eliminates need for discrete CAN PHY. |
| Single LIN 2.1 Master | Full J2602-2 and LIN 2.1 compliance with programmable termination (LIN-T1/I/O-2) and cyclic wake-up - reduces BOM count for body control modules. |
| VDD Regulator w/ Diagnostics | 3.3 V output with undervoltage lockout, overcurrent detection, and SPI-accessible status flags - enables real-time MCU supply health monitoring. |
| Fail-Safe State Machine | Hardware-enforced safety logic that asserts SAFE on watchdog timeout, RST pin fault, VDD collapse, or CAN bus error - meets ASIL-B functional safety intent. |
| Low-Power Operation | ≤30 µA quiescent current in VDD-ON LP mode with multiple wake sources (CAN/LIN/I/O/SPI/timer) - extends battery life in always-on vehicle networks. |
Applications
| Body Control Module (BCM) | Door Module ECU |
|---|---|
|
Use Scenario: Centralized control of lighting, window lifts, mirrors, and locks in modern vehicles. IC Role / Device Role / Timing Role: System Basis Chip providing MCU power, CAN communication backbone, LIN sub-network control, and wake-up management. Use Value: Reduces component count by integrating CAN PHY, LIN master, 3.3 V regulator, and fail-safe monitoring - simplifies PCB layout and improves reliability in harsh automotive environments. |
Use Scenario: Distributed door electronics managing power windows, central locking, and anti-pinch sensors. IC Role / Device Role / Timing Role: Power management and communication hub enabling low-power sleep/wake cycles via LIN and CAN, with diagnostic-ready I/Os. Use Value: Enables <30 µA quiescent current in LP mode while supporting cyclic sense on I/O-0/I/O-1 for sensor polling - critical for meeting OEM battery drain specifications. |
| Seat Control Module | Roof Module (Sunroof/Blind) |
|
Use Scenario: Motorized seat position adjustment with memory, heating, and lumbar support. IC Role / Device Role / Timing Role: High-side switch controller and communication interface for motor drivers, sensors, and MCU via CAN/LIN. Use Value: Configurable I/O-0/I/O-1 pins serve as HS drivers for small loads (e.g., seat heater relays) with built-in short-to-GND detection - eliminates discrete protection circuitry. |
Use Scenario: Sunroof or power blind actuation with obstacle detection and position feedback. IC Role / Device Role / Timing Role: Integrated CAN interface for vehicle network integration and LIN for local sensor/actuator communication. Use Value: MUX-OUT enables real-time monitoring of VDD, VSENSE, and internal temperature via MCU ADC - supports thermal derating and safe motor shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903DD3EK | Dual-LIN variant (2x LIN interfaces) in same 32-pin SOIC (SOT1762-2); adds LIN-T2/I/O-3 pin; identical VDD, CAN, and LP specs. | Required where two independent LIN subnets (e.g., HVAC + lighting) must be managed from one ECU. | Select MCZ33903DD3EK only if dual-LIN topology is needed; pinout differs on LIN-T2/I/O-3 and RXD-L2/TXD-L2 - not drop-in compatible. |
| MCZ33903DP3EK | No LIN interface; adds third wake-up input (3x wake sources); retains same 32-pin SOIC (SOT1762-2) and 3.3 V VDD regulator. | Suitable for CAN-only ECUs (e.g., sensor fusion units) requiring maximum wake flexibility without LIN overhead. | Choose MCZ33903DP3EK when LIN is unnecessary and additional wake-up capability is prioritized over bus interface count. |
Compared with MCZ33903DS3EK, MCZ33903DD3EK adds LIN2 functionality at the cost of pin reassignment, while MCZ33903DP3EK removes LIN entirely to free pins for wake-up expansion - both share identical thermal, electrical, and packaging characteristics but serve distinct network architecture needs.
Availability
MCZ33903DS3EK is available at Aetrix Electronics and suitable for automotive body control modules, door ECUs, seat control units, and roof modules requiring stable component supply, AEC-Q100-compliant operation, and long-term industrial lifecycle support.
Supply support for MCZ33903DS3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade mixed-signal ICs.
The MCZ33903DS3EK belongs to NXP's System Basis Chip Gen2 family, designed specifically for automotive electronic control units needing integrated power management, high-speed CAN, LIN, diagnostics, and fail-safe operation in compact footprints.
FAQ
What is the VDD output voltage and current capability of the MCZ33903DS3EK?
The MCZ33903DS3EK provides a fixed 3.3 V ±2% VDD output rated for up to 250 mA continuous current. Unlike some variants in the family, this part does not support external PNP transistor augmentation for extended current capability, as explicitly stated in datasheet note (2). The regulator includes undervoltage lockout, overcurrent detection, and SPI-accessible status reporting for robust MCU power supervision.
Does the MCZ33903DS3EK support ISO 11898-5 high-speed CAN with fault diagnostics?
Yes, the MCZ33903DS3EK integrates a fully compliant ISO 11898-5 high-speed CAN transceiver supporting baud rates from 40 kb/s to 1.0 Mb/s. It delivers local and bus-level fault diagnostics including short-to-battery, short-to-ground, and open-circuit detection on CANH/CANL, plus fail-safe shutdown and SAFE pin assertion upon detected faults - all implemented in hardware without MCU intervention.
How many LIN interfaces does the MCZ33903DS3EK include, and what version is supported?
The MCZ33903DS3EK includes exactly one LIN 2.1 interface configured as a master node, compliant with SAE J2602-2. It provides dedicated RXD-L and TXD-L pins with internal pull-up on TXD-L, and supports programmable LIN termination via the LIN-T1/I/O-2 pin. No LIN slave mode or dual-LIN capability is present - that requires the MCZ33903DD3EK variant.
What wake-up sources are available in low-power (LP) mode for the MCZ33903DS3EK?
In VDD-ON LP mode, the MCZ33903DS3EK supports up to three programmable wake-up sources: CAN bus activity (RXD edge), LIN bus activity (RXD-L edge), and transitions on I/O-0 or I/O-1 pins. Additionally, SPI message reception and internal timer expiration can trigger wake-up - all configurable via SPI registers without requiring MCU firmware changes.
Is the MCZ33903DS3EK pin-compatible with other members of the MC33903 family?
The MCZ33903DS3EK uses the SOT1762-2 32-pin SOIC package and shares identical pinout with MCZ33903DD3EK and MCZ33903DP3EK per datasheet Figure 12. However, functional pin assignments differ: LIN-T1/I/O-2 is used for LIN termination in MCZ33903DS3EK but repurposed for LIN-T2 in the dual-LIN variant, making them not functionally interchangeable without PCB modification.
MCZ33903DS3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903DS3EK FAQ
1.How can I place an order for MCZ33903DS3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903DS3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903DS3EK reliable?
The price and inventory of MCZ33903DS3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903DS3EK is usually 5 days.
3.What payment methods are accepted for MCZ33903DS3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903DS3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903DS3EK?
MCZ33903DS3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903DS3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903DS3EK?
For technical support, including MCZ33903DS3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903DS3EK requirements.
6.How does Aetrix verify that MCZ33903DS3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33903DS3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903DS3EK meets industry standards.
7.What is the process for return or replacement of MCZ33903DS3EK?
All MCZ33903DS3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903DS3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903DS3EK part is unused and in its original packaging.
Return procedure for MCZ33903DS3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCZ33903DS3EK Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
