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NXP Semiconductors MCZ33903DS3EKR2
- Part No.:
- MCZ33903DS3EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33903DS3EKR2.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,114
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Product details
Overview
MCZ33903DS3EKR2 from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), one LIN 2.1 interface, 3.3 V MCU supply regulator, fail-safe state machine, and four configurable wake-up/I/O pins. It operates across −40 °C to +125 °C and targets automotive ECU power management with diagnostics in space-constrained modules.
For engineers reviewing the MCZ33903DS3EKR2 datasheet, MCZ33903DS3EKR2 pinout, MCZ33903DS3EKR2 application, or MCZ33903DS3EKR2 equivalent, this page delivers verified electrical specs, SPI-configurable regulators, CAN/LIN bus fault diagnostics, LP-mode wake-up sources (CAN, LIN, I/O, timer, SPI), and footprint-compatible alternatives for ECU redesigns requiring robust low-power operation.
Technical Context
The MCZ33903DS3EKR2 implements a SMARTMOS-based power management architecture with dual-supply inputs (VSUP1/VSUP2), integrated 3.3 V VDD regulator, and dedicated 5 V-CAN regulator. Its fail-safe state machine monitors VDD, RST, watchdog timeout, and critical pin states to assert SAFE (active-low) during faults.
It supports ISO 11898-5 CAN at baud rates from 40 kb/s to 1 Mb/s with bus-failure diagnostics and local failure detection. The single LIN 2.1 interface includes TXD-L/RXD-L pins, LIN-T1/I/O-2 termination switch, and programmable wake-up capability - all configurable via SPI register mapping without external components.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±2%, supplies MCU core logic; no external PNP support per datasheet note. |
| CAN Interface | High-speed, ISO 11898-2/5 compliant; supports 40 kb/s–1 Mb/s; includes SPLIT, CANH/CANL, and 5V-CAN output. |
| LIN Interface | Single LIN 2.1 channel with TXD-L/RXD-L and LIN-T1/I/O-2 master termination switch. |
| Wake-up Inputs | Three configurable wake-up sources: I/O-0, I/O-1, LIN-T1/I/O-2; each usable as HS output or wake input in LP mode. |
| Operating Temp | −40 °C to +125 °C ambient; qualified for automotive underhood and ECU applications. |
| Package | 32-pin SOIC exposed pad (SOT1762-2); footprint compatible with MC33903D/S/P variants. |
| Quiescent Current | <20 µA in LP VDD-off mode; enables battery-sensitive always-on ECU functions. |
Pinout & Package
MCZ33903DS3EKR2 uses a 32-pin SOIC exposed pad package (SOT1762-2), thermally optimized for automotive ECU PCBs. Pin layout matches MC33903D/S/P family members for design reuse.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP | Battery Input | Main supply input (−0.3 V to 28 V DC); powers internal regulators and reset circuitry. |
| VDD | MCU Supply Output | 3.3 V regulated output; drives MCU core; not extensible with external PNP. |
| 5V-CAN | CAN Transceiver Supply | Dedicated 5 V output for embedded CAN physical layer; requires external decoupling capacitor. |
| CANH / CANL | CAN Bus Interface | Differential outputs compliant with ISO 11898-2/5; support up to 1 Mb/s data rate. |
| LIN-T1 / I/O-2 | Configurable I/O | Programmable as LIN master termination resistor switch or high-side output/wake-up input. |
| TXD-L / RXD-L | LIN Data Interface | LIN 2.1 transmit/receive pins with internal pull-up (TXD-L) and open-drain drive (RXD-L). |
| SAFE | Fault Indicator | Active-low open-drain output asserted during VDD undervoltage, watchdog timeout, or RST fault. |
| INT / RST | Interrupt & Reset | INT signals enabled SPI/CAN/LIN events; RST provides active-low MCU reset with VDD monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| Fail-Safe State Machine | Monitors VDD, RST, watchdog, and SPI activity; asserts SAFE pin on fault without MCU intervention. |
| Multi-Source Wake-up | Supports wake from CAN bus activity, LIN frame, I/O transition, SPI message, or internal timer - all in LP modes. |
| SPI-Configurable Regulators | VDD (3.3 V) and auxiliary rails are software-selectable and monitored for overcurrent/undervoltage via SPI registers. |
| CAN Bus Diagnostics | Detects short-to-battery, short-to-ground, open-circuit, and dominant-timeout faults on CANH/CANL lines. |
| MUX-OUT Analog Monitoring | Single pin multiplexes VDD, VSUP, temperature, and current-sense signals for MCU ADC sampling via SPI control. |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) |
|---|---|
Use Scenario: Centralized power and communication management for door locks, lighting, and window actuators in modern vehicles. IC Role / Device Role / Timing Role: SBC providing regulated 3.3 V MCU supply, high-speed CAN interface to gateway, and LIN 2.1 link to seat/mirror modules. Use Value: Reduces BOM count by integrating CAN transceiver, voltage regulation, and wake-up logic - enabling compact, ASIL-B-capable BCM designs. | Use Scenario: Power management and diagnostics for engine sensors, fuel injectors, and ignition systems in gasoline/diesel powertrains. IC Role / Device Role / Timing Role: Primary system basis chip delivering fail-safe VDD, CAN bus diagnostics, and cyclic sense monitoring of critical supply rails. Use Value: Enables <20 µA quiescent current in sleep mode while maintaining CAN bus wake-up readiness and real-time VDD/VSENSE monitoring via MUX-OUT. |
| Advanced Driver Assistance Systems (ADAS) Sensor Hub | Electric Power Steering (EPS) ECU |
Use Scenario: Consolidating radar, camera, and ultrasonic sensor interfaces into a centralized domain controller with deterministic timing. IC Role / Device Role / Timing Role: SBC supplying 3.3 V to microcontroller, hosting ISO 11898-5 CAN for high-integrity sensor data transport, and managing LIN-peripherals like mirror controls. Use Value: Supports 1 Mb/s CAN with bus-failure detection and fail-safe SAFE assertion - meeting functional safety requirements for ASIL-B sensor fusion nodes. | Use Scenario: Real-time motor control and torque feedback in steer-by-wire and column-assist EPS systems. IC Role / Device Role / Timing Role: Power management IC providing diagnostic-rich 3.3 V MCU supply, CAN interface for vehicle network commands, and wake-up from steering angle sensor LIN messages. Use Value: Integrates cyclic sense operation during LP VDD-on mode to monitor motor driver supply rails without waking MCU - extending battery life in park mode. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903DD3EK/R2 | Dual-LIN variant (2x LIN 2.1); adds LIN-T2/I/O-3 pin; same 3.3 V VDD, SOIC-32 SOT1762-2 package. | Required where two LIN subnets (e.g., steering + chassis) must be managed independently. | Select when expanding LIN peripheral count without changing PCB layout - pinout and footprint match MCZ33903DS3EKR2. |
| MCZ33903DP3EK/R2 | No LIN interface; adds third wake-up input (I/O-2); retains VSENSE, MUX-OUT, and 3.3 V VDD. | Suitable for CAN-only ECUs needing extra wake-up flexibility (e.g., HVAC blower control with motion-triggered wake). | Choose for cost-optimized CAN-centric modules where LIN is unnecessary - shares same package and core diagnostics. |
Compared with MCZ33903DS3EKR2, MCZ33903DD3EK/R2 adds LIN channel scalability while MCZ33903DP3EK/R2 removes LIN to increase wake-up I/O count - both maintain identical thermal performance, LP current, and fail-safe behavior in the same SOIC-32 footprint.
Availability
MCZ33903DS3EKR2 is available at Aetrix Electronics and suitable for automotive body control, engine management, ADAS sensor hubs, and electric power steering systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MCZ33903DS3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, IoT, and communications applications, with deep expertise in secure connectivity and embedded processing.
The MC33903 family is part of NXP's System Basis Chip Gen2 platform, designed specifically for automotive electronic control units requiring integrated power management, high-speed CAN, LIN, diagnostics, and fail-safe operation in harsh environments.
FAQ
What is the maximum CAN baud rate supported by MCZ33903DS3EKR2?
MCZ33903DS3EKR2 supports high-speed CAN up to 1 Mb/s per ISO 11898-5, with full bus-failure diagnostics including short-to-battery, short-to-ground, and open-circuit detection. It maintains signal integrity across automotive load-dump transients (−32 V to +40 V on CANH/CANL) and operates reliably from −40 °C to +125 °C ambient.
Does MCZ33903DS3EKR2 support external PNP transistor extension for the VDD regulator?
No, MCZ33903DS3EKR2 does not allow external PNP transistor extension for the VDD regulator. Unlike earlier family members, the 'D' version explicitly prohibits external PNP usage on VDD per datasheet Note 2. The 3.3 V output is internally regulated and rated for MCU-level loads only - designers must verify current requirements against the datasheet's static/dynamic electrical characteristics.
How many wake-up sources does MCZ33903DS3EKR2 provide in low-power mode?
MCZ33903DS3EKR2 provides three programmable wake-up sources in low-power modes: I/O-0, I/O-1, and LIN-T1/I/O-2. Each can be configured as an input for edge-triggered wake or as a high-side output. Wake events include CAN bus activity, LIN frame reception, I/O transitions, SPI message receipt, automatic timer expiry, and VDD overcurrent detection - all managed by the integrated fail-safe state machine.
What is the function of the MUX-OUT pin on MCZ33903DS3EKR2?
MUX-OUT on MCZ33903DS3EKR2 is a multiplexed analog output pin that routes internal signals - including VDD, VSUP, die temperature, and current-sense voltage - to an MCU's ADC input. Signal selection is controlled via SPI register writes. An integrated switchable pull-down resistor enables accurate VDD current measurement without external components, supporting diagnostic logging in LP modes.
Is MCZ33903DS3EKR2 pin-compatible with other MC33903 variants?
Yes, MCZ33903DS3EKR2 is pin-compatible with MCZ33903DD3EK/R2, MCZ33903DP3EK/R2, and MCZ33903DS5EK/R2 in the same SOIC-32 exposed pad (SOT1762-2) package. All share identical pinout, thermal pad layout, and mechanical dimensions - enabling hardware reuse across LIN-count and VDD-voltage variants without PCB redesign.
MCZ33903DS3EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SSOP-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33903DS3EKR2 FAQ
1.How can I place an order for MCZ33903DS3EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33903DS3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33903DS3EKR2 reliable?
The price and inventory of MCZ33903DS3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33903DS3EKR2 is usually 5 days.
3.What payment methods are accepted for MCZ33903DS3EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33903DS3EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33903DS3EKR2?
MCZ33903DS3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33903DS3EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33903DS3EKR2?
For technical support, including MCZ33903DS3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33903DS3EKR2 requirements.
6.How does Aetrix verify that MCZ33903DS3EKR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33903DS3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33903DS3EKR2 meets industry standards.
7.What is the process for return or replacement of MCZ33903DS3EKR2?
All MCZ33903DS3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33903DS3EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33903DS3EKR2 part is unused and in its original packaging.
Return procedure for MCZ33903DS3EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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