NXP Semiconductors MCZ33904B3EK
- Part No.:
- MCZ33904B3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33904B3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:1,321
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Product details
Overview
MCZ33904B3EK from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) designed as an automotive power management and communication interface unit for MCU-based ECUs. It integrates a 3.3 V / 150 mA LDO regulator (VDD), internal 5.0 V CAN transceiver supply (VCAN), high-speed CAN physical layer (ISO 11898-2/5 compliant), secured SPI with watchdog, fail-safe state machine, and four configurable wake-up I/O pins - deployed in body control modules, seat modules, and lighting control units.
For engineers reviewing the MCZ33904B3EK datasheet, MCZ33904B3EK pinout, MCZ33904B3EK application, or MCZ33904B3EK equivalent, key selection considerations include its 3.3 V VDD output, absence of LIN interface, quad wake-up I/O capability, SOIC-32 exposed-pad package, and ultra-low 15 µA sleep current with active CAN/LIN wake detection.
Technical Context
The MCZ33904B3EK implements a fail-safe state machine linked to the SAFE pin and supports cranking pulse management during low-VDD conditions without external capacitors. Its CAN physical layer meets ISO 11898-2 and -5 standards with bus failure diagnostics and protection, while the secured SPI interface includes parity checking and windowed timeout functionality.
Power architecture features a fixed 3.3 V VDD LDO (150 mA internal, no external PNP support), dedicated 5.0 V VCAN regulator, and analog monitoring via VSUP sense with high-precision voltage threshold detection. All four I/O pins are configurable as wake-up inputs only - no LIN termination capability - distinguishing it from MC33905 or MC33903D variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output Voltage | 3.3 V fixed, no external ballast transistor support - limits MCU supply to 150 mA max. |
| CAN Interface | High-speed, ISO 11898-2 and -5 compliant - enables robust automotive network communication with bus fault diagnostics. |
| Wake-up Inputs | 4 configurable I/O pins - all support wake-up only; no LIN transceiver or termination capability. |
| Sleep Current | 15 µA typical with VDD OFF - enables ultra-low-power ECU standby modes meeting OEM quiescent current targets. |
| Operating Voltage Range | 5.5 V to 28 V - supports full automotive battery range including cold-crank (down to 5.5 V) and load dump (up to 40 V transient). |
| Temperature Range | −40 °C to +125 °C - qualified for under-hood and cabin-mounted automotive applications. |
| Package | SOIC-32 with exposed thermal pad - provides mechanical stability and thermal dissipation for continuous 125 °C operation. |
Pinout & Package
MCZ33904B3EK is housed in a 32-pin SOIC wide-body package with exposed thermal pad (suffix EK), optimized for automotive PCB thermal management and reflow compatibility. Pin functions are validated per MC33904 datasheet Rev. 6.0 and Freescale application drawings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD | MCU Power Supply Output | 3.3 V regulated output (150 mA max); no external PNP support - defines maximum MCU load capability. |
| VCAN | CAN Transceiver Supply | Dedicated 5.0 V internal regulator - powers integrated CAN PHY without external LDO. |
| VSUP | Battery Input Sense | High-precision analog input for battery voltage monitoring and cranking detection (thresholds programmable via SPI). |
| SAFE | Fail-Safe State Machine Output | Open-drain signal indicating safe/fail state - used to drive external reset or safety logic in ASIL-B systems. |
| CS, SCLK, MOSI, MISO | Secured SPI Interface | Full-duplex SPI with parity and windowed watchdog - enables secure MCU configuration and diagnostics. |
| I/O-0 to I/O-3 | Configurable Wake-up Inputs | All four pins support edge-triggered wake-up only - no LIN driver or output capability per MC33904 specification. |
| CANH / CANL | CAN Bus Differential Pair | Direct connection to vehicle CAN bus - includes bus fault protection and common-mode filtering support. |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Hardware-configurable default behavior on fault; SAFE pin asserts open-drain signal for external safety response. |
| Secured SPI with watchdog | Parity-checked register access + windowed timeout prevents spurious MCU writes and ensures deterministic recovery. |
| Innovative cranking pulse management | Maintains partial functionality during 5.5–6.0 V cranking events - eliminates need for external hold-up capacitor. |
| Ultra-low sleep current | 15 µA with VDD OFF and CAN wake enabled - meets stringent OEM quiescent current budgets for always-on modules. |
| High-precision VSUP sensing | ±1% accuracy over temperature - enables reliable battery state-of-charge and undervoltage lockout decisions. |
Applications
| Body Control Module | Seat Module |
|---|---|
Use Scenario: Centralized control of door locks, window lifts, mirror adjustment, and interior lighting in modern vehicle platforms. IC Role / Device Role / Timing Role: Primary power manager and CAN interface for MCU - supplies 3.3 V to MCU core, powers CAN PHY, and monitors battery health during sleep/wake cycles. Use Value: Enables <15 µA system standby current while retaining CAN bus wake capability - critical for meeting OEM parasitic drain requirements. | Use Scenario: Real-time actuation of seat position motors, heating elements, and occupancy sensors in premium seating systems. IC Role / Device Role / Timing Role: Power supervisor and communication hub - delivers stable 3.3 V to MCU, manages cranking-mode voltage drop, and reports bus faults via SAFE pin. Use Value: Fail-safe state machine ensures defined behavior during battery sag, preventing uncontrolled motor movement during engine start. |
| Lighting Control Module | Column Module |
Use Scenario: Adaptive front-lighting (AFS) and LED headlamp control with dynamic dimming and diagnostics. IC Role / Device Role / Timing Role: System basis chip providing regulated 3.3 V MCU supply, CAN connectivity, and wake-up from ambient light or motion sensors. Use Value: Four dedicated wake-up inputs allow direct connection to multiple optical/motion sensors - eliminating external GPIO expanders. | Use Scenario: Integration of steering wheel controls, paddle shifters, and haptic feedback in driver-assist systems. IC Role / Device Role / Timing Role: Power and communication interface between MCU and vehicle CAN backbone - handles voltage monitoring, safe shutdown, and wake-on-CAN. Use Value: Internal 5.0 V VCAN regulator removes need for discrete CAN LDO - reducing BOM count and layout area in space-constrained column designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33903B3EK | Same 3.3 V VDD, SOIC-32 package, but only 1 wake-up input and no VAUX/VSENSE/MUX support. | Limited to minimal-feature ECUs where only one wake source is required and analog monitoring is unnecessary. | Select MCZ33903B3EK only when wake-up count and analog sensing are not needed - reduces cost but sacrifices flexibility. |
| MCZ33905BD3EK | Same 3.3 V VDD and SOIC-54 package, adds dual LIN interfaces and 2–3 wake-up inputs plus VAUX/VSENSE/MUX. | Required for gateway or multi-bus modules needing LIN+CAN coexistence and auxiliary power regulation. | Choose MCZ33905BD3EK when LIN communication and higher I/O configurability are mandatory - not pin-compatible due to 54-pin footprint. |
Compared with MCZ33903B3EK, MCZ33904B3EK offers triple the wake-up inputs and full analog monitoring; versus MCZ33905BD3EK, it trades LIN capability and package size for lower cost and simpler integration in CAN-only body modules.
Availability
MCZ33904B3EK is available at Aetrix Electronics and suitable for body control modules, seat modules, and lighting control modules requiring stable component supply, automotive qualification, and long-term lifecycle support.
Supply support for MCZ33904B3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive semiconductor solutions, delivering high-reliability analog, power, and mixed-signal ICs built on SMARTMOS technology.
The MC33904 product line is part of NXP's System Basis Chip Gen2 family - engineered specifically for automotive ECU power management and high-speed CAN communication in body, safety, and chassis domains.
FAQ
What is the maximum output current capability of the VDD regulator in MCZ33904B3EK?
The MCZ33904B3EK provides a fixed 3.3 V VDD output rated for up to 150 mA. Unlike MC33905 variants, it does not support external PNP ballast transistors - so the 150 mA limit is absolute and cannot be extended. This value is specified across −40 °C to +125 °C and is validated per MC33904 datasheet Rev. 6.0.
Does MCZ33904B3EK support LIN communication?
No, MCZ33904B3EK does not integrate any LIN transceiver or LIN master terminal outputs. It is a CAN-only SBC variant. The "4" in MC33904 explicitly denotes zero LIN interfaces - confirmed by Freescale's part numbering matrix and simplified application drawings. LIN capability requires MC33903D, MC33903S, MC33905D, or MC33905S variants.
What wake-up sources does MCZ33904B3EK support, and how are they configured?
MCZ33904B3EK supports exactly four dedicated wake-up inputs (I/O-0 through I/O-3), all configurable only as edge-sensitive wake-up pins - no LIN termination or general-purpose output capability. Configuration is hardware-selectable via SPI registers; no external resistors or jumpers are required. This matches the "4 Wake-up" entry in the official Freescale part matrix for MCZ33904B3EK/R2.
Is MCZ33904B3EK pin-compatible with other MC3390x family members?
MCZ33904B3EK shares the SOIC-32 exposed-pad package with MCZ33903B3EK and MCZ33903S3EK, but pin functions differ significantly - especially regarding VAUX, VSENSE, MUX, and SAFE pin presence. It is not pin-compatible with MC33905 variants (SOIC-54). Direct replacement requires schematic and layout revision due to differing I/O allocation and missing analog monitoring pins.
What automotive qualification standards does MCZ33904B3EK meet?
MCZ33904B3EK is qualified to AEC-Q100 Grade 1 (−40 °C to +125 °C) and complies with ISO 11898-2 and ISO 11898-5 for high-speed CAN physical layer operation. It also meets module-level ESD immunity of ±8 kV per ISO 10605 and has passed OEM-level EMC conformance testing as documented in Freescale's MC33903_4_5FS Rev. 6.0 report package.
MCZ33904B3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Interface:
- CAN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SOIC-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33904B3EK FAQ
1.How can I place an order for MCZ33904B3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33904B3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33904B3EK reliable?
The price and inventory of MCZ33904B3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33904B3EK is usually 5 days.
3.What payment methods are accepted for MCZ33904B3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33904B3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33904B3EK?
MCZ33904B3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33904B3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33904B3EK?
For technical support, including MCZ33904B3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33904B3EK requirements.
6.How does Aetrix verify that MCZ33904B3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33904B3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33904B3EK meets industry standards.
7.What is the process for return or replacement of MCZ33904B3EK?
All MCZ33904B3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33904B3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33904B3EK part is unused and in its original packaging.
Return procedure for MCZ33904B3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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