NXP Semiconductors MCZ33904B3EKR2

Overview

The MCZ33904B3EKR2 from NXP (formerly Freescale) is an automotive System Basis Chip (SBC) integrating a 3.3 V/150 mA MCU power regulator, high-speed CAN transceiver (ISO 11898-2/5 compliant), and four configurable wake-up I/Os - with no LIN interface. It delivers fail-safe state machine control, secured SPI with watchdog, and ultra-low sleep current (15 µA) for body control modules in 12 V vehicle systems.

For engineers reviewing the MCZ33904B3EKR2 datasheet, MCZ33904B3EKR2 pinout, MCZ33904B3EKR2 application, or MCZ33904B3EKR2 equivalent, key selection criteria include its 3.3 V VDD output without external ballast support, absence of LIN, SOIC-32EP package, integrated 5 V CAN regulator, and cranking pulse management capability in automotive ECU power architectures.

Technical Context

This SBC implements a deterministic fail-safe state machine linked to the SAFE pin, enabling hardware-configurable default behavior during fault conditions. Its CAN physical layer supports data rates from 40 kB/s to 1 MB/s and includes bus failure diagnostics, local/remote wake-up detection, and split termination support.

The device integrates high-precision VSUP sensing (±1.5% accuracy), analog MUX with multiple monitoring inputs (VSENSE, VB, VAUX), and debug mode via DBG pin to disable watchdog during development. Power management includes under-voltage detection for cranking events and dual low-power modes (VDD OFF at 15 µA, VDD ON at 25 µA).

Key Specifications

Pinout & Package

MCZ33904B3EKR2 uses a 32-pin SOIC Wide-body package with exposed thermal pad (98ASA10556D footprint). Pin functions are validated per MC33904 datasheet Rev. 6.0 and schematic reference designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SBC applications.

Compared with MCZ33904B3EKR2, MCZ33903B3EKR2 reduces wake-up flexibility and monitoring capability, while TLE9471-2ES trades fail-safe hardware signaling and cranking adaptation for enhanced ESD tolerance and Grade 0 qualification - requiring external circuitry for safe-state enforcement.

Availability

MCZ33904B3EKR2 is available at Aetrix Electronics and suitable for body control modules, door modules, seat modules, and lighting control modules requiring stable component supply across automotive production lifecycles.

Supply support for MCZ33904B3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductor solutions, specializing in SMARTMOS-based analog, power management, and system basis chips for safety-critical vehicle subsystems.

The MC33904 belongs to NXP's second-generation System Basis Chip family designed specifically for cost-optimized, CAN-only automotive ECUs where LIN integration is unnecessary - emphasizing fail-safe operation, ultra-low sleep current, and cranking resilience.

FAQ

What is the maximum output current of the VDD regulator in MCZ33904B3EKR2?

The MCZ33904B3EKR2 provides a fixed 3.3 V VDD output with a maximum continuous current of 150 mA. Unlike MC33904 variants with "D" suffix, this part does not support external PNP ballast transistor implementation - limiting scalability beyond internal LDO capability. This rating is sufficient for most 32-bit automotive MCUs in body domain applications.

Does MCZ33904B3EKR2 support LIN communication?

No, MCZ33904B3EKR2 does not integrate any LIN transceiver. It is a CAN-only SBC variant within the MC33903/4/5 family. The "4" designation explicitly indicates zero LIN interfaces - distinguishing it from MC33903D/S (dual/single LIN) and MC33905D/S (dual/single LIN). Systems requiring LIN must select MCZ33903 or MCZ33905 variants instead.

What package type and pin count does MCZ33904B3EKR2 use?

MCZ33904B3EKR2 uses a 32-pin SOIC Wide-body package with exposed thermal pad (footprint 98ASA10556D). This is identical to MCZ33903B3EKR2 and MCZ33905BS3EK/R2, enabling layout reuse across the family. The exposed pad improves thermal dissipation and must be soldered to PCB ground plane for optimal performance and reliability.

How does MCZ33904B3EKR2 handle battery cranking events?

MCZ33904B3EKR2 implements innovative cranking pulse management that maintains CAN bus monitoring and wake-up functionality during battery dips to 3–5 V. It achieves this without external capacitors by dynamically adjusting internal regulation and state machine timing - preserving network presence and reducing need for costly bulk capacitance in space-constrained modules.

Is MCZ33904B3EKR2 qualified for automotive applications?

Yes, MCZ33904B3EKR2 is AEC-Q100 qualified for automotive use. It operates across −40 °C to +125 °C ambient temperature, withstands 40 V load dump per ISO 7637-2 Pulse 5a, and meets system-level ±8 kV ESD per ISO 10605. These qualifications are documented in Freescale's MC33903_4_5FS Rev. 6.0 datasheet and supporting EMC/ESD conformance reports.