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NXP Semiconductors MCZ33904C3EK

Part No.:
MCZ33904C3EK
Manufacturer:
NXP Semiconductors
Category:
Specialized
Package:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Datasheet:
AetrixMCZ33904C3EK.pdf
Description:
IC INTERFACE SPECIALIZED 32SOIC
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,631

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Product details

Overview

MCZ33904C3EK from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN transceiver (ISO 11898-2/5), 5.0 V MCU supply regulator (VDD), 5.0 V auxiliary regulator (VAUX), internal 5.0 V CAN driver supply (VCAN), analog sensing MUX, and four configurable wake-up I/Os - used as power management unit in body control modules and door modules with S12x or MPC560x MCUs.

For engineers reviewing the MCZ33904C3EK datasheet, MCZ33904C3EK pinout, MCZ33904C3EK application, or MCZ33904C3EK equivalent, key selection criteria include its 5.0 V VDD output, ISO 11898-2/5 CAN compliance, 15 µA sleep current, SOIC-32EP package, and absence of LIN interface - distinguishing it from MC33905 and MC33903D variants.

Technical Context

The MCZ33904C3EK implements a fail-safe state machine linked to the SAFE pin, secured SPI with watchdog capability, and cranking pulse management that maintains degraded functionality during low-VSUP events. It supports ultra-low-power modes (15 µA with VDD off) and includes high-precision VSUP sense monitoring plus analog MUX for battery voltage, temperature, and input signal monitoring.

Unlike MC33905 variants, MCZ33904C3EK provides no LIN interface but delivers quad wake-up I/Os configurable as inputs or drivers. Its power architecture supplies VDD (5.0 V, up to 150 mA internal or 300 mA with external PNP), VAUX (5.0 V), and dedicated VCAN (5.0 V), all operating across 5.5–28 V input with 40 V load dump tolerance.

Key Specifications

ParameterValue and Actual Design Meaning
VDD Output Voltage5.0 V - powers MCU core logic; fixed output, no 3.3 V option on this variant.
Max VDD Output Current150 mA internal - sufficient for S12x/MPC560x MCUs; scalable to 300 mA using external PNP transistor.
CAN InterfaceHigh-speed, ISO 11898-2 and 11898-5 compliant - enables robust communication in automotive networks up to 1 Mbps.
Sleep Current (VDD OFF)15 µA typical - meets stringent automotive quiescent current requirements for always-on ECU nodes.
Operating Voltage Range5.5 V to 28 V - supports full vehicle battery range including cold-crank (5.5 V) and load dump (40 V transient tolerant).
PackageSOIC-32 with exposed pad - thermally enhanced surface-mount package for automotive under-hood environments.
Wake-up Inputs4 configurable I/Os - each can serve as wake-up source or LIN master termination (though LIN not implemented here).

Pinout & Package

MCZ33904C3EK is housed in a 32-pin SOIC wide-body package with exposed thermal pad (98ASA10556D footprint). Pin functions are validated per MC33904 Simplified Application Drawing and Freescale MC33903_4_5FS Rev. 6.0.

Pin/TerminalCircuit RoleDesign Meaning
VDDMCU Supply Output5.0 V regulated output; powers connected MCU; max 150 mA internal, extendable to 300 mA with external PNP.
VAUXAuxiliary Regulator Output5.0 V output for sensors or peripheral ICs; independent of VDD regulation path.
VCANCAN Transceiver SupplyDedicated 5.0 V LDO for internal CAN physical layer; ensures stable bus signaling.
CANH / CANLCAN Bus TerminalsDifferential high-speed CAN interface compliant with ISO 11898-2/5; integrated termination and diagnostics.
I/O-0 to I/O-3Configurable Wake-up I/OsFour bidirectional pins supporting wake-up detection or output drive; no LIN transceiver function enabled on MCZ33904C3EK.
SAFEFail-Safe State Machine OutputOpen-drain output signaling safe state entry; drives external reset or safety circuitry during fault conditions.
SPI Pins (CS, SCLK, MOSI, MISO)Configuration InterfaceSecured SPI bus for register access, watchdog control, and diagnostic readback; supports parity checking.
VSUP1 / VSUP2Battery Sense InputsHigh-precision analog inputs for monitoring battery voltage; used for under-voltage detection and cranking management.

Key Features

FeatureDesign Value
Fail-Safe State MachineHardware-configurable default behavior triggered via SAFE pin; enables deterministic response to overtemperature, undervoltage, or CAN bus failure.
Secured SPI with WatchdogRegister-level parity protection and optional advanced watchdog (time-out + window + closed-loop detection) prevents MCU lockup.
Innovative Cranking Pulse ManagementMaintains VDD regulation and CAN wake-up capability down to 5.5 V without external capacitor buffering - reduces BOM cost and PCB area.
High-Precision Analog SensingIntegrated MUX with VSUP1/VSUP2 inputs enables real-time battery monitoring and system health diagnostics without external ADC.
Ultra-Low Sleep Current15 µA typical with VDD off and CAN/LIN wake-up active - meets OEM requirements for gateway and body module standby modes.

Applications

Body Control ModuleDoor Module

Use Scenario: Centralized control of power windows, locks, mirrors, and interior lighting in passenger vehicles.

IC Role / Device Role / Timing Role: Primary power management and communication hub - supplies MCU, monitors battery, wakes system on CAN/LIN activity, and manages fail-safe shutdown.

Use Value: Eliminates discrete regulators and CAN transceivers; reduces component count by 7+ parts while meeting ISO 11898-2/5 and OEM quiescent current specs.

Use Scenario: Integrated door electronics managing window lift, anti-pinch, keyless entry, and mirror folding.

IC Role / Device Role / Timing Role: Power supervisor and network interface - delivers stable 5.0 V to MCU, enables CAN-based diagnostics, and detects wake events from door handle switches or RF receivers.

Use Value: Supports <15 µA sleep current requirement for Class 3/4 door modules; eliminates need for external CAN bus protector or voltage supervisor ICs.

Seat ModuleLighting Control Module

Use Scenario: Motorized seat position memory, heating, and lumbar support controlled via CAN or LIN.

IC Role / Device Role / Timing Role: Power domain controller - regulates VDD for seat MCU, senses battery voltage during cranking, and asserts SAFE during overtemperature faults.

Use Value: Enables cranking-mode operation without MCU brownout; built-in VSUP monitoring replaces external voltage supervisor, saving board space.

Use Scenario: Adaptive front-lighting (AFS) and LED headlamp control with CAN-based calibration and diagnostics.

IC Role / Device Role / Timing Role: System basis chip providing regulated 5.0 V supply, CAN physical layer, and wake-up capability from light sensor or ambient input.

Use Value: Integrates CAN HS PHY and power regulation into single SOIC-32EP package - simplifies EMC layout and reduces BOM cost vs. discrete solution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar automotive SBC applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MCZ33904B3EKSame 5.0 V VDD, SOIC-32EP, no LIN; "B" revision adds improved oscillator stability and lower sleep current vs. "C".Identical use cases; preferred for new designs due to enhanced VSUP ramp-up behavior and reduced current consumption.Select MCZ33904B3EK when designing new platforms requiring latest silicon errata fixes and optimized power performance.
MCZ33903C5EK5.0 V VDD, SOIC-32EP, no LIN, only 1 wake-up I/O (vs. 4 on MCZ33904C3EK); lacks VAUX and analog MUX.Suitable for simpler nodes like lamp controllers where minimal wake sources and no auxiliary regulation are acceptable.Choose MCZ33903C5EK only if system requires just one wake-up source and no VAUX/VSUP monitoring - otherwise insufficient feature set.

Compared with MCZ33904C3EK, MCZ33904B3EK offers verified improvements in oscillator jitter and sleep current, while MCZ33903C5EK sacrifices wake-up flexibility and analog monitoring to reduce cost and complexity - making MCZ33904C3EK optimal for mid-tier body modules needing four wake sources and full diagnostic capability.

Availability

MCZ33904C3EK is available at Aetrix Electronics and suitable for body control modules, door modules, seat modules, and lighting control modules requiring stable component supply, automotive-grade reliability, and long-term lifecycle support.

Supply support for MCZ33904C3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductor solutions, delivering high-reliability analog, power management, and microcontroller products based on SMARTMOS technology.

The MC33904 belongs to NXP's System Basis Chip Gen2 family - designed specifically for automotive body, safety, and powertrain ECUs requiring integrated power regulation, high-speed CAN, and fail-safe supervision without LIN.

FAQ

What is the VDD output voltage and maximum current capability of the MCZ33904C3EK?

The MCZ33904C3EK provides a fixed 5.0 V VDD output with 150 mA internal current capability. It supports scalable power delivery up to 300 mA when an external PNP ballast transistor is added - enabling compatibility with higher-current S12x and MPC560x MCUs without redesigning the power stage. This dual-mode operation is confirmed in the MC33903_4_5FS datasheet Rev. 6.0.

Does the MCZ33904C3EK include a LIN interface?

No, the MCZ33904C3EK does not integrate any LIN transceiver. It is part of the MC33904 series, which is defined by single high-speed CAN and zero LIN channels - unlike MC33905 (dual LIN) or MC33903S (single LIN). The four I/O pins are configurable as wake-up inputs or LIN terminations, but LIN functionality is disabled in this variant.

What package type and pin count does the MCZ33904C3EK use?

The MCZ33904C3EK uses a 32-pin SOIC wide-body package with exposed thermal pad (footprint 98ASA10556D), as specified in Freescale documentation. This RoHS-compliant, Pb-free package supports automotive thermal and mechanical requirements, and is pin-compatible with other MC3390x variants in the same SOIC-32EP family.

What is the minimum operating supply voltage and how does the MCZ33904C3EK handle cranking conditions?

The MCZ33904C3EK operates down to 5.5 V, enabling reliable function during engine cranking. Its cranking pulse management circuitry maintains VDD regulation and CAN wake-up capability without external hold-up capacitors - reducing BOM cost and PCB area. This behavior is documented in the "Innovative Cranking Pulse Management" feature section of the MC33903_4_5FS datasheet.

How many wake-up sources does the MCZ33904C3EK support, and are they configurable?

The MCZ33904C3EK supports four dedicated wake-up I/Os (I/O-0 through I/O-3), all configurable as either wake-up inputs or output drivers. Unlike MC33903 variants with only one wake pin, this quad-wake capability enables flexible system-level event detection - such as door handle touch, key fob RF, or ambient light change - without adding external wake controllers. This is confirmed in the MC33904 Simplified Application Drawing.

MCZ33904C3EK Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
32-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging:
Tube
Product Status:
Obsolete
Applications:
System Basis Chip
Interface:
CAN
Voltage - Supply:
5.5V ~ 28V
Supplier Device Package:
32-SOIC-EP
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount

MCZ33904C3EK FAQ

1.How can I place an order for MCZ33904C3EK through Aetrix?

Please submit a Request for Quotation (RFQ) for MCZ33904C3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MCZ33904C3EK reliable?

The price and inventory of MCZ33904C3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33904C3EK is usually 5 days.

3.What payment methods are accepted for MCZ33904C3EK?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33904C3EK transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MCZ33904C3EK?

MCZ33904C3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MCZ33904C3EK order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MCZ33904C3EK?

For technical support, including MCZ33904C3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33904C3EK requirements.

6.How does Aetrix verify that MCZ33904C3EK is sourced from the original manufacturer or authorized distributors?

All MCZ33904C3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33904C3EK meets industry standards.

7.What is the process for return or replacement of MCZ33904C3EK?

All MCZ33904C3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33904C3EK, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MCZ33904C3EK part is unused and in its original packaging.

Return procedure for MCZ33904C3EK:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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