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NXP Semiconductors MCZ33905BD3EKR2
- Part No.:
- MCZ33905BD3EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33905BD3EKR2.pdf
- Description:
- IC INTERFACE SPECIALIZED 54SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,418
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Product details
Overview
MCZ33905BD3EKR2 from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) integrating high-speed CAN, dual LIN 2.1/J2602-2 transceivers, 3.3 V/300 mA MCU regulator, internal 5 V CAN supply, and fail-safe state machine - designed as a power management and communication hub for automotive body control modules. It operates from 5.5–28 V input, supports -40 °C to 125 °C ambient, and delivers 15 µA quiescent current in VDD-OFF low-power mode.
For engineers reviewing the MCZ33905BD3EKR2 datasheet, MCZ33905BD3EKR2 pinout, MCZ33905BD3EKR2 application, or MCZ33905BD3EKR2 equivalent, key selection criteria include dual-LIN wake-up flexibility (up to 4 configurable I/Os), ISO 11898-2/5 and SAE J2602-2 compliance, secured SPI with watchdog, cranking pulse resilience, and SOIC-54 exposed-pad packaging for thermal performance in space-constrained ECU designs.
Technical Context
The MCZ33905BD3EKR2 implements a hierarchical fail-safe state machine linked to the SAFE pin, enabling configurable degraded operation during fault conditions. Its CAN physical layer complies with ISO 11898-2 and -5, supporting data rates from 40 kB/s to 1 MB/s with bus failure diagnostics and local/remote wake-up detection.
Dual LIN interfaces operate at 10.4–20 kB/s (100 kB/s fast mode), each with dedicated LIN-TERM outputs and RXD/TXD pins. The device integrates an analog MUX with VSENSE monitoring, VAUX sensing, and VSUP1/VSUP2 inputs - all routed through a single MUX-OUT for MCU ADC sampling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output Voltage | 3.3 V ±2%, supports 300 mA with optional external PNP ballast transistor |
| CAN Interface | High-speed, ISO 11898-2 and -5 compliant, 40 kB/s–1 MB/s data rate |
| LIN Interfaces | Two independent LIN 2.1 / SAE J2602-2 transceivers with LIN-TERM outputs |
| Low-Power Current | 15 µA typical in VDD-OFF mode with CAN/LIN wake-up active |
| Operating Voltage Range | 5.5 V to 28 V; withstands 40 V load dump per ISO 7637-2 |
| Temperature Range | -40 °C to +125 °C ambient, qualified per AEC-Q100 Grade 1 |
| ESD Protection | ±8 kV HBM on CAN and LIN pins, module-level robustness |
Pinout & Package
MCZ33905BD3EKR2 is housed in a Pb-free SOIC-54 package with exposed thermal pad (98ASA10506D), optimized for automotive under-hood thermal dissipation and EMC performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CANH / CANL | CAN Bus Differential Pair | ISO 11898-2/5 compliant high-speed CAN physical interface |
| LIN-1, LIN-2 | LIN Bus Outputs | Independent LIN 2.1/J2602-2 transceiver outputs with integrated termination drivers |
| LIN-TERM1 / LIN-TERM2 | LIN Master Termination Control | Configurable outputs to enable/disable LIN bus termination resistors |
| I/O-0 to I/O-3 | Flexible Wake-up / LIN-Term Inputs/Outputs | Four bidirectional pins supporting wake-up detection or LIN master termination drive |
| VDD, VAUX, VCAN | Regulated Power Outputs | 3.3 V MCU supply (300 mA), 3.3/5.0 V auxiliary (configurable), 5.0 V CAN driver supply |
| SAFE | Fail-Safe State Machine Output | Open-drain signal indicating entry into safe state; drives external reset or monitoring circuitry |
| SPI (CS/SCLK/MOSI/MISO) | Secured Serial Interface | Full-duplex SPI with parity checking and watchdog integration for configuration and diagnostics |
Key Features
| Feature | Design Value |
|---|---|
| Dual LIN 2.1 Transceivers | Enables multi-node LIN subnetworks (e.g., seat + door modules) without external transceivers |
| Configurable I/O Wake-up Matrix | Supports 2+2, 3+1, or 4+0 LIN-term/wake-up pin allocations - adapts to varying ECU topology needs |
| Innovative Cranking Pulse Management | Maintains regulated VDD and CAN/LIN functionality during engine start (6–8 V battery dip) without external hold-up capacitors |
| Secured SPI with Watchdog | Hardware-enforced register access and windowed timeout detection prevent MCU lockup or misconfiguration |
| Analog MUX with VSENSE Monitoring | Single ADC channel multiplexes VSUP1, VSUP2, VAUX, VSENSE, and internal temperature for comprehensive system health monitoring |
Applications
| Body Controller Module | Seat Module |
|---|---|
Use Scenario: Centralized power and communication management for door locks, windows, mirrors, and interior lighting in modern vehicle body ECUs. IC Role / Device Role / Timing Role: Primary SBC providing regulated 3.3 V MCU supply, dual-LIN connectivity to peripheral actuators, and CAN gateway interface to vehicle backbone. Use Value: Reduces BOM count by integrating two LIN transceivers and eliminating discrete regulators, while enabling ultra-low 15 µA sleep current for battery-sensitive applications. |
Use Scenario: Power and signal conditioning for motorized seat position memory, heating, and lumbar control systems. IC Role / Device Role / Timing Role: Dual-LIN master managing seat switch cluster and heater elements, with CAN reporting to body domain controller. Use Value: Configurable I/O pins allow dynamic allocation of wake-up sources and LIN terminations - simplifying variant management across seat configurations. |
| Door Module | Lighting Control Module |
Use Scenario: Integrated control of power windows, central locking, and mirror folding in front/rear door ECUs. IC Role / Device Role / Timing Role: SBC delivering 3.3 V MCU power, LIN communication to window lift motors and lock solenoids, and CAN status reporting. Use Value: Fail-safe state machine ensures safe shutdown of motor drivers during overtemperature or undervoltage events - preventing mechanical damage. |
Use Scenario: LED headlight and interior lighting control with dimming, diagnostics, and thermal protection. IC Role / Device Role / Timing Role: Regulator and communication hub supplying MCU and driving LIN-connected LED drivers; monitors VSUP and temperature via integrated MUX. Use Value: High-precision VSUP sense and cranking pulse resilience maintain stable lighting output during engine start - critical for functional safety compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33905CD3EKR2 | 5.0 V VDD output (vs. 3.3 V); identical dual-LIN, CAN, and pinout | Required where MCU or peripheral logic operates at 5.0 V; no change to PCB layout | Select when interfacing with legacy 5 V microcontrollers or sensors without level-shifting. |
| MCZ33904B3EKR2 | No LIN interface; 4 wake-up I/Os only; SOIC-32 package (vs. SOIC-54) | Lower-cost solution for CAN-only gateways or simple body nodes without LIN subnetworks | Choose when LIN is unnecessary and board space/thermal constraints favor smaller footprint. |
Compared with MCZ33905CD3EKR2 and MCZ33904B3EKR2, the MCZ33905BD3EKR2 uniquely balances 3.3 V MCU compatibility, dual-LIN scalability, and SOIC-54 thermal performance - making it optimal for next-gen body domain controllers requiring flexible wake-up and LIN expansion.
Availability
MCZ33905BD3EKR2 is available at Aetrix Electronics and suitable for automotive body control modules, seat modules, door modules, and lighting control systems requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.
Supply support for MCZ33905BD3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global leader in automotive semiconductors, delivering AEC-Q100-qualified analog, power, and mixed-signal ICs for safety-critical vehicle systems.
The MC33903/4/5 family was engineered specifically for automotive body, safety, and powertrain domains - integrating power regulation, high-speed CAN, and LIN into a single scalable SBC platform to reduce ECU complexity and accelerate development.
FAQ
What is the maximum output current capability of the VDD regulator in MCZ33905BD3EKR2?
The MCZ33905BD3EKR2 provides a 3.3 V linear regulator with 150 mA internal capability; with an optional external PNP ballast transistor, total VDD output current scales to 300 mA. This supports mid-range automotive MCUs such as S12X and MPC560x without requiring additional regulators. The design allows flexible power partitioning between MCU core and peripherals.
Does MCZ33905BD3EKR2 support both LIN 2.1 and SAE J2602-2 standards?
Yes, MCZ33905BD3EKR2 fully complies with both LIN 2.1 and SAE J2602-2 specifications for its dual LIN interfaces. Each LIN channel supports data rates from 10.4 kB/s to 20 kB/s (100 kB/s in fast mode), with integrated LIN-TERM outputs enabling direct connection to standard LIN bus topologies without external components.
How does the fail-safe state machine in MCZ33905BD3EKR2 operate during voltage faults?
The MCZ33905BD3EKR2 implements a hardware-configurable fail-safe state machine that asserts the open-drain SAFE pin upon detection of VDD undervoltage, overtemperature, or CAN/LIN bus failure. This signal can directly trigger MCU reset or external safety relays - ensuring deterministic behavior without software intervention during critical faults.
What is the purpose of the MUX-OUT pin on MCZ33905BD3EKR2?
The MUX-OUT pin on MCZ33905BD3EKR2 delivers a time-multiplexed analog signal combining VSUP1, VSUP2, VAUX, VSENSE, and internal die temperature. This allows a single MCU ADC channel to monitor up to five critical system parameters - reducing pin count, simplifying layout, and enabling comprehensive health diagnostics without external multiplexers.
Is MCZ33905BD3EKR2 pin-compatible with other members of the MC33905 family?
Yes, MCZ33905BD3EKR2 shares identical pinout and footprint with all MC33905D variants (e.g., MCZ33905CD3EKR2, MCZ33905BD5EKR2) in the SOIC-54 exposed-pad package. This enables voltage- and feature-based variant selection (e.g., 3.3 V vs. 5.0 V, "B" vs. "C" revision) without PCB redesign - supporting scalable platform architecture across vehicle models.
MCZ33905BD3EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 54-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 54-SOIC-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33905BD3EKR2 FAQ
1.How can I place an order for MCZ33905BD3EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33905BD3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33905BD3EKR2 reliable?
The price and inventory of MCZ33905BD3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33905BD3EKR2 is usually 5 days.
3.What payment methods are accepted for MCZ33905BD3EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33905BD3EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33905BD3EKR2?
MCZ33905BD3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33905BD3EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33905BD3EKR2?
For technical support, including MCZ33905BD3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33905BD3EKR2 requirements.
6.How does Aetrix verify that MCZ33905BD3EKR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33905BD3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33905BD3EKR2 meets industry standards.
7.What is the process for return or replacement of MCZ33905BD3EKR2?
All MCZ33905BD3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33905BD3EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33905BD3EKR2 part is unused and in its original packaging.
Return procedure for MCZ33905BD3EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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