NXP Semiconductors MCZ33905BS3EK

Overview

MCZ33905BS3EK from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) integrating high-speed CAN, single LIN 2.1/J2602-2 transceiver, 3.3 V/150 mA MCU regulator (VDD), internal 5 V CAN regulator (VCAN), and triple configurable wake-up I/O pins. It operates from 5.5–28 V input, supports -40 °C to 125 °C ambient, and delivers 15 µA quiescent current in VDD-OFF low-power mode - ideal for automotive body control modules requiring robust network interface and ultra-low standby power.

For engineers reviewing the MCZ33905BS3EK datasheet, MCZ33905BS3EK pinout, MCZ33905BS3EK application, or MCZ33905BS3EK equivalent, key selection criteria include its SOIC-32 exposed-pad package, 3.3 V VDD output with no external ballast support (150 mA max), single-LIN capability, integrated fail-safe state machine, and ISO 11898-2/5 + LIN 2.1 compliance - all critical for ECU designs targeting ASIL-B functional safety integration.

Technical Context

The MCZ33905BS3EK implements a dedicated high-speed CAN physical layer compliant with ISO 11898-2 and -5, featuring bus failure diagnostics, local fault detection, and fail-safe operation via SAFE pin assertion. Its LIN interface meets SAE J2602-2 and LIN 2.1 standards with data rates up to 20 kB/s (100 kB/s fast mode), and supports LIN master terminal output configuration on one of three wake-up-capable I/O pins.

Power management includes a fixed 3.3 V LDO for MCU supply (150 mA, non-ballasted), a separate 5 V regulator for CAN transceiver (VCAN), and an auxiliary 3.3/5.0 V VAUX regulator with MUX-enabled analog sensing (VSENSE, VSUP1/2). The device uses a secured SPI interface with watchdog capability and supports debug mode via DBG pin to inhibit watchdog during development.

Key Specifications

Pinout & Package

MCZ33905BS3EK is housed in a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (98ASA10556D), optimized for automotive thermal and mechanical reliability.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Compared with MCZ33905BS5EK and MCZ33904B3EK, the MCZ33905BS3EK uniquely balances 3.3 V MCU compatibility, single-LIN integration, and triple wake-up flexibility - making it optimal for cost-sensitive, space-constrained body electronics where both CAN and LIN coexist.

Availability

MCZ33905BS3EK is available at Aetrix Electronics and suitable for automotive body control modules, door modules, seat modules, and lighting control units requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.

Supply support for MCZ33905BS3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure, high-performance automotive, industrial, and IoT solutions, with deep expertise in SMARTMOS analog-power integration.

The MC33903/4/5 family was designed as second-generation System Basis Chips to consolidate power management, high-speed CAN, and LIN interfaces into a single AEC-Q100-qualified device - targeting body, safety, and powertrain ECUs needing functional safety, ultra-low quiescent current, and design scalability.

FAQ

What is the maximum output current of the VDD regulator in MCZ33905BS3EK?

The MCZ33905BS3EK provides a fixed 3.3 V VDD output rated for up to 150 mA continuous current. Unlike higher-current variants (e.g., MCZ33905D series), this version does not support external PNP ballast transistor augmentation - limiting total MCU supply capability to 150 mA without additional regulation stages. This specification is confirmed in the MC33903_4_5FS datasheet Rev. 6.0.

Does MCZ33905BS3EK support both LIN 2.1 and SAE J2602-2 protocols?

Yes, MCZ33905BS3EK fully supports both LIN 2.1 and SAE J2602-2 standards on its single LIN interface. It operates at data rates from 10.4 kB/s to 20 kB/s, with optional fast-mode operation up to 100 kB/s. Compliance is verified through Freescale's conformance testing and documented in the MC33903_4_5FS datasheet Section 5.3.2.

How many wake-up capable I/O pins does MCZ33905BS3EK have, and can they be reconfigured?

MCZ33905BS3EK features three dedicated wake-up capable I/O pins (I/O-0, I/O-1, I/O-3), all configurable either as wake-up inputs or as LIN master terminations. This dual-role flexibility allows hardware reuse across different module configurations - for example, using I/O-3 as LIN-T in a sensor node or as wake-up source in a switch panel - without PCB redesign.

What is the purpose of the SAFE pin on MCZ33905BS3EK?

The SAFE pin on MCZ33905BS3EK is an open-drain output driven by the integrated fail-safe state machine. It asserts low during detected faults (e.g., overtemperature, undervoltage, or CAN/LIN bus failure) to signal the MCU to enter a defined safe state. Its behavior is hardware-configurable via SPI registers and forms part of the functional safety architecture supporting ASIL-B system requirements.

Is MCZ33905BS3EK compatible with 5 V microcontrollers?

No, MCZ33905BS3EK provides only a 3.3 V VDD output and is intended for use with 3.3 V MCU families such as MPC560x or S08x. For 5 V MCU interfaces, the functionally identical MCZ33905BS5EK variant must be selected - it shares the same SOIC-32 package, LIN/CAN features, and wake-up I/O structure but delivers 5.0 V on VDD.