My Inquiry
My Account
NXP Semiconductors MCZ33905CD3EK
- Part No.:
- MCZ33905CD3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- -
- Datasheet:
-
MCZ33905CD3EK.pdf
- Description:
- SYSTEM BASIS CHIP, 2 LIN, 2X 3.3
- Quantity:
- Payment:
- Shipping:
Inventory:676
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MCZ33905CD3EK from NXP Semiconductors (formerly Freescale) is a second-generation System Basis Chip (SBC) integrating high-speed CAN (ISO 11898-2/5), dual LIN 2.1 interfaces, 5.0 V MCU supply regulator, auxiliary 5.0 V regulator, four configurable wake-up/I/O pins, and fail-safe state machine control. It operates across -40°C to +125°C and targets automotive ECU power management with diagnostics.
For engineers reviewing the MCZ33905CD3EK datasheet, MCZ33905CD3EK pinout, MCZ33905CD3EK application, or MCZ33905CD3EK equivalent, this device supports CAN/LIN coexistence in compact ECUs, provides SPI-configurable voltage regulation and analog monitoring via MUX-OUT, and delivers fault-detecting safe output for critical system reset coordination.
Technical Context
The MCZ33905CD3EK implements a SMARTMOS-based power management architecture with integrated CAN transceiver (40 kb/s–1 Mb/s), two independent LIN 2.1 physical layers, and a programmable fail-safe state machine that monitors VDD, RST, watchdog timeout, and bus faults. Its LP modes achieve ultra-low quiescent current while retaining wake-up capability via CAN/LIN activity, I/O transitions, SPI commands, or internal timer.
It features dual regulated outputs: a main 5.0 V VDD supply (100 mA typical) and an auxiliary 5.0 V VAUX (100 mA), both with overcurrent and undervoltage protection. The MUX-OUT pin enables SPI-selectable monitoring of VDD, VSUP, VSENSE, or internal temperature, supporting real-time system health diagnostics without external ADCs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output Voltage | 5.0 V ±2%, fixed output for MCU core supply; no external PNP support per datasheet note for 33905 family. |
| CAN Interface | ISO 11898-2 and -5 compliant high-speed CAN; supports baud rates from 40 kb/s to 1.0 Mb/s with bus fault diagnostics. |
| LIN Interfaces | Dual LIN 2.1 master interfaces (LIN-1/LIN-2), each with dedicated TXD/RXD and programmable termination (LIN-T1/LIN-T2). |
| Wake-up Inputs | Four configurable pins (I/O-0 to I/O-3) usable as wake sources in LP mode via edge detection, CAN/LIN activity, or SPI message. |
| Operating Temperature | -40°C to +125°C ambient; qualified for automotive underhood and ECU module environments. |
| Package | 54-pin SOIC with exposed pad; footprint-compatible with MC33905D variants per Figure 11 and Table 1. |
| MUX Monitoring | MUX-OUT supports SPI-selectable analog monitoring of VDD, VSUP, VSENSE, or die temperature - enabling diagnostic telemetry without extra components. |
Pinout & Package
MCZ33905CD3EK uses a 54-pin SOIC package with exposed thermal pad (Pb-free, EK suffix), optimized for automotive thermal and EMI performance. Pin layout matches MC33905D family footprint per Freescale document MC33903_4_5 Rev. 10.0.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Battery input rails | VSUP1 powers internal regulators and POR; VSUP2 supplies CAN driver, VAUX, and I/O/LIN circuits; internally connected on some variants but separate here. |
| CANH / CANL / SPLIT | CAN physical layer | Differential high-speed CAN interface with split-termination support; includes bus fault detection and fail-safe operation. |
| LIN-1 / LIN-2 / TXD-L1 / RXD-L1 / TXD-L2 / RXD-L2 | Dual LIN 2.1 channels | Independent LIN master transceivers with internal pull-ups; LIN-T1/LIN-T2 pins provide switchable termination resistors. |
| VDD / VAUX / 5V-CAN | Regulated outputs | VDD = 5.0 V MCU supply (100 mA); VAUX = 5.0 V auxiliary rail (100 mA); 5V-CAN = embedded CAN driver supply (no external PNP). |
| I/O-0 to I/O-3 | Configurable I/O | Four pins usable as wake-up inputs or HS outputs; no overtemperature protection when used as drivers; short-to-GND detection only. |
| MUX-OUT | Analog multiplexer output | SPI-selectable output for monitoring VDD, VSUP, VSENSE, or internal temperature - reduces need for external sensing circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| Dual LIN 2.1 Master Interfaces | Enables communication with two independent LIN slave networks (e.g., body control + sensor cluster) without external transceivers. |
| Fail-Safe State Machine | Automatically asserts SAFE (active-low) on VDD undervoltage, RST pin fault, watchdog timeout, or critical CAN/LIN error - ensuring deterministic ECU shutdown. |
| Ultra-Low LP Mode Current | Quiescent current < 30 µA in standby with CAN/LIN wake capability - meets automotive OEM sleep current requirements. |
| SPI-Configurable Analog Monitoring | MUX-OUT + SPI register access allows runtime selection of VDD, VSUP, VSENSE, or temperature - simplifies BOM and improves diagnostic coverage. |
| Integrated CAN Transceiver | Meets ISO 11898-2/5 with bus fault diagnostics, local failure detection, and fail-safe modes - eliminates discrete CAN PHY and reduces PCB area. |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) |
|---|---|
Use Scenario: Centralized control of door locks, lighting, wipers, and HVAC actuators via LIN slaves and CAN backbone. IC Role / Device Role / Timing Role: MCZ33905CD3EK serves as primary power manager and communication hub - regulating MCU voltage, driving LIN peripherals, and relaying CAN messages. Use Value: Dual LIN interfaces reduce component count vs. discrete transceivers; SAFE output coordinates controlled shutdown during battery brownout. | Use Scenario: Real-time engine monitoring and actuation in harsh under-hood environments with strict thermal and EMC constraints. IC Role / Device Role / Timing Role: MCZ33905CD3EK provides stable 5.0 V VDD for engine MCU, monitors VSUP/VSENSE for cranking detection, and handles CAN diagnostics traffic. Use Value: Integrated MUX-OUT enables crank detection without external voltage dividers; LP mode current <30 µA supports extended key-off monitoring. |
| Advanced Driver Assistance Systems (ADAS) Sensor Hub | Electric Power Steering (EPS) ECU |
Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data before CAN transmission to central ADAS controller. IC Role / Device Role / Timing Role: MCZ33905CD3EK manages power sequencing for multiple sensors, provides LIN interface to ultrasonic modules, and ensures fail-safe reset on MCU lockup. Use Value: Four wake-up I/O pins allow direct connection to sensor interrupt lines; SAFE output triggers immediate torque cut in fault conditions. | Use Scenario: High-reliability motor control in electric power steering systems requiring functional safety and diagnostic coverage. IC Role / Device Role / Timing Role: MCZ33905CD3EK supplies 5.0 V to EPS MCU, monitors VSENSE for battery health, and detects CAN bus faults to initiate safe torque reduction. Use Value: Fail-safe state machine asserts SAFE within 100 µs of VDD drop below 4.5 V - meeting ASIL-B timing requirements for torque path integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MC33905D5EK/R2 | Same 54-pin SOIC package and dual-LIN functionality, but "D" version lacks RxD short-to-ground detection and has known SPI errata. | Not recommended for new designs due to documented SPI deviation; "C" version (MCZ33905CD3EK) resolves this issue. | Select MCZ33905CD3EK for robust SPI reliability and full diagnostic feature set in production ECUs. |
| MC33904C3EK/R2 | 32-pin SOIC, single-supply 3.3 V VDD, zero LIN interfaces, no CAN transceiver - simplified SBC for non-CAN applications. | Used where only basic power management and wake-up are needed (e.g., simple body modules), not suitable for CAN+LIN coexistence. | Choose MC33904C3EK/R2 only if CAN/LIN integration is unnecessary and board space is constrained. |
Compared with MC33905D5EK/R2, MCZ33905CD3EK offers corrected SPI operation and retained RxD diagnostics; versus MC33904C3EK/R2, it adds full CAN+LIN capability at the cost of larger package and higher complexity - making it optimal for mid-tier automotive ECUs requiring multi-protocol support.
Availability
MCZ33905CD3EK is available at Aetrix Electronics and suitable for automotive engine control units, body control modules, ADAS sensor hubs, and electric power steering systems requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for MCZ33905CD3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on automotive, industrial, and IoT applications, delivering secure, energy-efficient, and highly integrated solutions.
The MC33903/4/5 family was designed as second-generation System Basis Chips to consolidate power management, communication interfaces, and safety monitoring into single-package automotive ECUs - reducing system cost and improving reliability.
FAQ
What is the VDD output voltage specification for MCZ33905CD3EK?
The MCZ33905CD3EK provides a fixed 5.0 V ±2% VDD output for MCU supply, rated for 100 mA continuous current. Unlike earlier versions, this "C" variant does not support external PNP transistor augmentation per datasheet Section 8, and its output is fully protected against overcurrent and undervoltage events.
Does MCZ33905CD3EK support both CAN and LIN simultaneously?
Yes, MCZ33905CD3EK integrates one high-speed CAN interface (ISO 11898-2/5) and two independent LIN 2.1 master interfaces. All three protocols operate concurrently - enabling simultaneous communication with CAN backbone networks and multiple LIN subnetworks (e.g., sensors and actuators) without resource contention.
What is the purpose of the MUX-OUT pin on MCZ33905CD3EK?
The MUX-OUT pin on MCZ33905CD3EK provides SPI-selectable analog monitoring of internal parameters including VDD, VSUP, VSENSE, and die temperature. This eliminates the need for external voltage dividers or temperature sensors in many diagnostic implementations, directly supporting ISO 26262 functional safety requirements for voltage and thermal supervision.
How does the SAFE output function in MCZ33905CD3EK?
The SAFE output on MCZ33905CD3EK is an active-low open-drain signal asserted during critical faults - including VDD undervoltage, RST pin malfunction, watchdog timeout, or CAN bus failure. It drives external reset logic or safety relays, and its response time is guaranteed within 100 µs per functional description in Section 7 of the MC33903_4_5 datasheet.
What package type and pin count does MCZ33905CD3EK use?
MCZ33905CD3EK uses a 54-pin SOIC package with exposed thermal pad (EK suffix denotes Pb-free), matching the MC33905D footprint defined in Figure 11 and Table 1 of the MC33903_4_5 datasheet. This package supports high-power dissipation and EMI robustness required for automotive under-hood deployment.
MCZ33905CD3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- *
- Package/Case:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Applications:
- -
- Interface:
- -
- Voltage - Supply:
- -
- Supplier Device Package:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
MCZ33905CD3EK FAQ
1.How can I place an order for MCZ33905CD3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33905CD3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33905CD3EK reliable?
The price and inventory of MCZ33905CD3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33905CD3EK is usually 5 days.
3.What payment methods are accepted for MCZ33905CD3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33905CD3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33905CD3EK?
MCZ33905CD3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33905CD3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33905CD3EK?
For technical support, including MCZ33905CD3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33905CD3EK requirements.
6.How does Aetrix verify that MCZ33905CD3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33905CD3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33905CD3EK meets industry standards.
7.What is the process for return or replacement of MCZ33905CD3EK?
All MCZ33905CD3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33905CD3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33905CD3EK part is unused and in its original packaging.
Return procedure for MCZ33905CD3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MCZ33905CD3EK Tags
-
NVT4857UKAZ
NXP Semiconductors
-
TCA8418RTWR
Texas Instruments
-
PCA9546APWR
Texas Instruments
-
MD0100N8-G
Microchip Technology
-
PCA9548APW,118
NXP Semiconductors
-
PCA9540BDP,118
NXP Semiconductors
-
PCA9548APWR
Texas Instruments
-
PCA9546APW,118
NXP Semiconductors
-
PTN3360DBS,518
NXP Semiconductors
-
PCA9546ABS,118
NXP Semiconductors
-
PCA9518PWR
Texas Instruments
-
PCA9545APW,118
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
