NXP Semiconductors MCZ33905CD3EKR2

Overview

MCZ33905CD3EKR2 from NXP (formerly Freescale) is a second-generation automotive System Basis Chip (SBC) integrating high-speed CAN, dual LIN transceivers, 5.0 V MCU regulator (300 mA with optional external PNP), internal 5.0 V CAN regulator, and fail-safe state machine. It serves as the central power management and communication interface for MCUs in body control modules, seat modules, and door modules operating from 5.5–28 V supply.

For engineers reviewing the MCZ33905CD3EKR2 datasheet, MCZ33905CD3EKR2 pinout, MCZ33905CD3EKR2 application, or MCZ33905CD3EKR2 equivalent, key selection criteria include dual-LIN support with configurable wake-up/I/O mapping, ISO 11898-2/5 and LIN 2.1/J2602-2 compliance, ultra-low 15 µA sleep current with active bus wake-up, and SOIC-54 exposed-pad packaging for thermal reliability in under-hood environments.

Technical Context

The MCZ33905CD3EKR2 implements a hardware-configurable fail-safe state machine linked to the SAFE pin, supporting cranking pulse management without external capacitors. Its dual LIN interfaces operate at 10.4–20 kB/s (100 kB/s fast mode), each with dedicated LIN-TERM outputs and configurable I/O pins for wake-up or termination.

It integrates three independent regulators: 5.0 V/300 mA VDD LDO (with ballast transistor option), 5.0 V CAN driver supply, and VAUX (5.0 V or 3.3 V configurable). Analog monitoring includes VSUP1/VSUP2 sensing, VSENSE input, and 10-bit MUX-OUT for multiplexed analog diagnostics.

Key Specifications

Pinout & Package

MCZ33905CD3EKR2 is housed in a 54-pin SOIC Wide-body package with exposed thermal pad (98ASA10506D). Pin count and layout match the MC33905D family specification, supporting mechanical and thermal compatibility across dual-LIN SBC variants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Compared with MCZ33905CD3EKR2, the 3.3 V variant (MCZ33905BD3EKR2) enables direct integration with low-voltage MCUs, while the D5 version offers identical performance with optimized packaging for automated assembly - both preserve full dual-LIN, CAN, and fail-safe functionality without design modification.

Availability

MCZ33905CD3EKR2 is available at Aetrix Electronics and suitable for body controller, seat module, and door module designs requiring stable component supply, automotive-grade reliability, and long-term lifecycle support.

Supply support for MCZ33905CD3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive semiconductor solutions, with deep expertise in SMARTMOS analog-power integration and functional safety-certified IC design.

The MC33903/4/5 family was engineered specifically for automotive body, safety, and powertrain ECUs - delivering integrated power management, robust CAN/LIN physical layers, and hardware-enforced fail-safe behavior in a single package.

FAQ

What is the maximum output current capability of the VDD regulator in MCZ33905CD3EKR2?

The MCZ33905CD3EKR2 provides a 5.0 V VDD regulator rated for 300 mA output current when used with an optional external PNP ballast transistor. Without the external transistor, the internal LDO delivers up to 150 mA. This scalability supports both mid-range and higher-power MCUs such as MPC560x series in automotive body control applications.

Does MCZ33905CD3EKR2 support both LIN 2.1 and SAE J2602-2 standards?

Yes, MCZ33905CD3EKR2 fully complies with both LIN 2.1 and SAE J2602-2 specifications across its two independent LIN transceivers. Each interface supports standard data rates (10.4–20 kB/s) and fast-mode operation (100 kB/s), enabling interoperability with legacy and next-generation LIN slaves in automotive networks.

How does the fail-safe state machine in MCZ33905CD3EKR2 respond to overvoltage conditions?

When MCZ33905CD3EKR2 detects overvoltage on VSUP exceeding 27 V, its hardware fail-safe state machine asserts the SAFE pin low and disables non-critical regulators while maintaining minimal CAN/LIN wake-up capability. This behavior is fully autonomous and requires no MCU intervention, ensuring deterministic response during load-dump events.

Can MCZ33905CD3EKR2 operate during cold-crank conditions?

Yes, MCZ33905CD3EKR2 operates down to 4.5 V input (below nominal 5.5 V minimum) with cranking pulse management enabled. Its internal circuitry maintains regulated 5.0 V VDD output and active CAN/LIN wake-up capability during engine start, eliminating need for external hold-up capacitance in most body ECU designs.

What package type and thermal characteristics does MCZ33905CD3EKR2 use?

MCZ33905CD3EKR2 uses a 54-pin SOIC Wide-body package with exposed thermal pad (98ASA10506D). The exposed pad enables direct thermal coupling to PCB ground plane, achieving ≤45 °C/W junction-to-board thermal resistance - critical for sustained operation in under-hood environments up to 125 °C ambient.