NXP Semiconductors MCZ33905CS3EKR2

Overview

MCZ33905CS3EKR2 from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) integrating high-speed CAN, single LIN 2.1/J2602-2 transceiver, 5.0 V MCU regulator (150 mA standard, up to 300 mA with external PNP), internal 5.0 V CAN regulator, and fail-safe state machine - designed as power management and communication hub for automotive body control modules. It operates from 5.5–28 V input, supports -40 °C to 125 °C ambient, and delivers 15 µA quiescent current in VDD-OFF low-power mode.

For engineers reviewing the MCZ33905CS3EKR2 datasheet, MCZ33905CS3EKR2 pinout, MCZ33905CS3EKR2 application, or MCZ33905CS3EKR2 equivalent, key selection considerations include its SOIC-32 exposed-pad package, configurable wake-up/I/O pins (3 wake-up + 1 LIN termination), VAUX/VSENSE/MUX support, and ISO 11898-2/5 & LIN 2.1 compliance - critical for ECU designs requiring functional safety, cranking pulse resilience, and scalable power delivery.

Technical Context

The MCZ33905CS3EKR2 implements a dual-regulator architecture: a primary LDO delivering 5.0 V @ 150 mA (extendable to 300 mA) for MCU supply (VDD), and a dedicated 5.0 V regulator (VCAN) for the integrated CAN transceiver. Its fail-safe state machine is hardware-configurable via SAFE pin assertion and supports cranking pulse management without external capacitors.

It integrates a secured SPI interface with watchdog capability (time-out and window modes), high-precision VSUP sensing, analog MUX with multiple inputs (VSENSE, VAUX, etc.), and triple configurable I/O pins usable as wake-up inputs or LIN master terminations - all within a single SOIC-32 EP package meeting AEC-Q100 Grade 1 requirements.

Key Specifications

Pinout & Package

MCZ33905CS3EKR2 is housed in a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (98ASA10556D), optimized for automotive thermal and EMI performance. Pin count and layout align with MC33903/4/5 family SOIC-32 variants, enabling board-level compatibility across SBC options.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar System Basis Chip applications.

Compared with MCZ33905BS3EKR2 and MCZ33904B3EKR2, MCZ33905CS3EKR2 uniquely delivers 5.0 V MCU regulation plus single-LIN support in the same SOIC-32 package - enabling drop-in upgrades from 3.3 V or LIN-less designs while preserving board layout and thermal design.

Availability

MCZ33905CS3EKR2 is available at Aetrix Electronics and suitable for body control modules, seat modules, door modules, and lighting control modules requiring stable component supply, AEC-Q100 qualification, and long-term automotive lifecycle support.

Supply support for MCZ33905CS3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader specializing in secure, high-reliability automotive ICs, leveraging SMARTMOS process technology for mixed-signal power integration.

The MC33903/4/5 family was engineered to replace discrete power + interface solutions in automotive ECUs - delivering integrated CAN/LIN, fail-safe control, and ultra-low-power operation for body, safety, and powertrain domains.

FAQ

What is the VDD output voltage and maximum current rating of the MCZ33905CS3EKR2?

The MCZ33905CS3EKR2 provides a fixed 5.0 V ±2% VDD output rated for 150 mA continuous current. With an optional external PNP ballast transistor, it supports up to 300 mA - sufficient for mid-range automotive MCUs like S12x or MPC560x. This dual-current capability allows scalable power delivery without changing the MCZ33905CS3EKR2 footprint or firmware.

Does the MCZ33905CS3EKR2 support both CAN and LIN communication simultaneously?

Yes, the MCZ33905CS3EKR2 integrates a high-speed CAN transceiver compliant with ISO 11898-2 and ISO 11898-5, plus a single LIN 2.1 / SAE J2602-2 transceiver - enabling concurrent CAN backbone communication and LIN subnetwork control. Both interfaces operate independently with shared diagnostics and fail-safe coordination managed by the on-chip state machine.

How many wake-up capable I/O pins does the MCZ33905CS3EKR2 have, and how are they configured?

The MCZ33905CS3EKR2 provides three configurable I/O pins (I/O-0, I/O-1, I/O-3) that can be individually set as edge-sensitive wake-up inputs or LIN master termination drivers. Configuration is done via hardware strapping or SPI registers - allowing flexible allocation across different ECU variants without PCB changes.

What package type and thermal characteristics does the MCZ33905CS3EKR2 use?

The MCZ33905CS3EKR2 uses a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (98ASA10556D). The exposed pad enhances thermal dissipation in high-ambient environments like under-dash or door modules, supporting continuous operation at 125 °C junction temperature per AEC-Q100 Grade 1 requirements.

Is the MCZ33905CS3EKR2 qualified for automotive applications, and what safety features does it include?

Yes, the MCZ33905CS3EKR2 is AEC-Q100 Grade 1 qualified and includes hardware-based safety features: a configurable fail-safe state machine linked to the SAFE pin, cranking pulse management, overtemperature/undervoltage detection, and secured SPI with dual-mode watchdog. These features support ASIL-B system-level compliance in body electronics applications.