NXP Semiconductors MCZ33905CS5EKR2

Overview

The MCZ33905CS5EKR2 from NXP (formerly Freescale) is a second-generation System Basis Chip (SBC) integrating high-speed CAN, single LIN 2.1/J2602-2 transceiver, dual LDO regulators (5.0 V VDD and VAUX), internal 5.0 V CAN supply, fail-safe state machine, secured SPI with watchdog, and analog sensing MUX - designed as a power management and communication hub for automotive body and safety ECUs. It delivers 5.0 V/150 mA VDD output, supports cranking pulse management, operates from 5.5–28 V input, and consumes only 15 µA in VDD-OFF low-power mode.

For engineers reviewing the MCZ33905CS5EKR2 datasheet, MCZ33905CS5EKR2 pinout, MCZ33905CS5EKR2 application, or MCZ33905CS5EKR2 equivalent, key selection considerations include its SOIC-32 exposed-pad package, 5.0 V VDD regulator without external ballast support (150 mA max), single LIN interface with configurable I/O wake-up capability (3 wake-up + 1 LIN term or 4 wake-up), integrated VSUP sense monitoring, and ISO 11898-2/5 & LIN 2.1 compliance.

Technical Context

This SBC implements a fail-safe state machine linked to the SAFE pin, enabling configurable default behavior during fault conditions. Its enhanced high-speed CAN physical layer complies with ISO 11898-2 and -5, supporting data rates from 40 kB/s to 1.0 MB/s with bus failure diagnostics and protection.

The device integrates a secured SPI interface with parity checking and window/time-out watchdog modes, plus an analog multiplexer routing up to four monitored signals (VSUP, VSENSE, VAUX, internal temperature) to a single MUX-OUT pin. Wake-up inputs are software-configurable as LIN master terminations, offering design flexibility without PCB changes.

Key Specifications

Pinout & Package

MCZ33905CS5EKR2 is housed in a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (98ASA10556D), optimized for automotive thermal and EMC performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar SBC applications.

Compared with MCZ33905CS5EKR2, MCZ33905BS5EKR2 provides identical functionality at 3.3 V for low-voltage MCUs, while MCZ33904C5EKR2 removes LIN to free I/O for additional wake-up capability - both retain CAN, analog MUX, and fail-safe architecture but serve distinct platform voltage and interface needs.

Availability

MCZ33905CS5EKR2 is available at Aetrix Electronics and suitable for body controller modules, seat modules, lighting control units, and HVAC blower systems requiring stable component supply, automotive-grade reliability, and long-term lifecycle support.

Supply support for MCZ33905CS5EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in automotive, industrial, and IoT semiconductors, with deep expertise in SMARTMOS analog-power integration and functional safety certification.

The MC33903/4/5 family was engineered specifically for automotive electronic control units needing integrated power management, CAN/LIN connectivity, and fail-safe operation - targeting body, safety, and powertrain domains with ASIL-ready architecture.

FAQ

What is the maximum output current of the VDD regulator in MCZ33905CS5EKR2?

The MCZ33905CS5EKR2 provides a fixed 5.0 V VDD output rated for up to 150 mA. Unlike "D" or "S" variants with optional external ballast transistors, this variant does not support scalability to 300 mA. The 150 mA limit is sufficient for S08x and S12x MCUs in body electronics applications and is internally current-limited for short-circuit protection.

Does MCZ33905CS5EKR2 support both LIN 2.1 and SAE J2602-2 protocols?

Yes, MCZ33905CS5EKR2 integrates a single LIN transceiver compliant with both LIN 2.1 and SAE J2602-2 standards. It supports standard baud rates (10.4–20 kB/s) and fast-mode operation up to 100 kB/s, enabling interoperability with legacy and next-generation LIN slaves in automotive subsystems such as seat controls and lighting nodes.

How does the fail-safe state machine in MCZ33905CS5EKR2 operate during a power fault?

During overvoltage, undervoltage, or thermal fault conditions, the MCZ33905CS5EKR2's hardware-based fail-safe state machine asserts the SAFE pin low. This signal can directly trigger MCU reset or initiate a defined safe state (e.g., disabling outputs, entering diagnostic mode). Configuration of default behavior is done via SPI registers before deployment - no firmware intervention required during fault events.

Can MCZ33905CS5EKR2 monitor battery voltage and auxiliary supply simultaneously?

Yes, MCZ33905CS5EKR2 supports simultaneous monitoring via its analog MUX: VSUP (battery input), VSENSE (external voltage sense point), VAUX (auxiliary regulator output), and internal die temperature are all routed to the MUX-OUT pin. The MCU samples them sequentially using timing controlled by the SBC's internal oscillator - enabling comprehensive system health checks without additional ADC channels.

What package type and thermal characteristics does MCZ33905CS5EKR2 use?

MCZ33905CS5EKR2 uses a Pb-free 32-pin SOIC Wide-body package with exposed thermal pad (98ASA10556D). The exposed pad improves thermal dissipation in high-ambient environments like under-dash or door modules, supporting continuous operation at 125 °C junction temperature. Thermal resistance (θ_JA) is 52 °C/W per datasheet, validated for automotive convection-cooled PCB layouts.