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NXP Semiconductors MCZ33905DS3EK
- Part No.:
- MCZ33905DS3EK
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33905DS3EK.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,758
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Product details
Overview
MCZ33905DS3EK from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), single LIN 2.1 interface, 3.3 V MCU supply regulator, 5 V CAN driver supply, and four configurable wake-up/I/O pins. It operates across -40 °C to +125 °C and targets automotive ECU power management with fail-safe diagnostics and ultra-low quiescent current in LP modes.
For engineers reviewing the MCZ33905DS3EK datasheet, MCZ33905DS3EK pinout, MCZ33905DS3EK application, or MCZ33905DS3EK equivalent, this page delivers verified technical context, exact pin functions for SOIC-32 exposed pad (SOT1746-3), real-world diagnostic capabilities, and validated alternative parts for ECU design continuity.
Technical Context
The MCZ33905DS3EK implements a SMARTMOS-based fail-safe state machine with dedicated SAFE output, supports ISO 11898-5 CAN at baud rates from 40 kb/s to 1.0 Mb/s, and integrates SPI-configurable regulators (VDD = 3.3 V, VAUX/VBAUX/VCAUX enabled). Its LIN interface complies with J2602-2 and LIN 2.1 standards, with TXD-L/RXD-L pins featuring internal pull-up/pull-down and bus fault detection.
It provides four wake-up sources - CAN/LIN bus activity, I/O transitions, SPI message, and VDD overcurrent - and enables cyclic sense operation during LP VDD-on mode via I/O-0/I/O-1 pairing. The MUX-OUT pin delivers selectable analog monitoring (VSENSE, VDD, temperature) to MCU ADC with integrated switchable pull-down for current sensing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±2%, 250 mA max - powers MCU core with external PNP support disabled per datasheet note |
| CAN Interface | ISO 11898-2 & -5 compliant, 40 kb/s–1.0 Mb/s - enables robust vehicle network communication with bus failure diagnostics |
| LIN Interface | Single LIN 2.1 channel, J2602-2 compatible - supports master node termination via LIN-T/I/O-2 pin |
| Wake-up Inputs | 4 programmable pins (I/O-0 to I/O-3) - configurable as inputs for LP-mode wake events or HS outputs for small loads |
| Quiescent Current (LP) | ≤ 30 µA typical - ensures battery longevity in always-on automotive modules |
| Operating Temp | -40 °C to +125 °C - qualified for under-hood ECU deployment without derating |
| Package | SOIC-32 exposed pad (SOT1746-3) - footprint-compatible with MC33904/MC33903S families for design reuse |
Pinout & Package
MCZ33905DS3EK uses a 32-pin SOIC exposed pad package (SOT1746-3), thermally optimized for automotive power dissipation. Pin layout matches MC33905S, MC33904, and MC33903S footprints per Figure 11 and Table 4 of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 | Battery Supply Input | Main input for internal supplies and VDD regulator; internally tied to VSUP2 in this variant |
| VDD | MCU Power Output | 3.3 V regulated output (250 mA), not extensible with external PNP per datasheet note (2) |
| CANH / CANL | CAN Physical Layer | Differential high-speed CAN transceiver outputs with bus fault detection and fail-safe shutdown |
| LIN-T / I/O-2 | LIN Termination or I/O | Configurable as LIN master termination resistor output or HS switch output/wake-up input |
| RXD-L / TXD-L | LIN Data Interface | LIN bus receive/transmit pins with internal pull-up (TXD-L) and short-to-ground detection |
| MUX-OUT | Analog Monitoring Output | SPI-selectable analog signal (VSENSE, VDD, temp) routed to MCU ADC with integrated pull-down for current sense |
| SAFE | Failsafe Alert Output | Open-drain active-low signal asserting on watchdog timeout, VDD undervoltage, or RST fault |
| I/O-0 to I/O-3 | Configurable I/O | Four pins supporting wake-up input, HS output, or cyclic sense pairing (I/O-0/I/O-1) in LP mode |
Key Features
| Feature | Design Value |
|---|---|
| Fail-safe state machine | Hardware-enforced safe state activation on critical faults (e.g., watchdog expiry, VDD UVLO), signaled via SAFE pin |
| Multi-level undervoltage detection | Separate thresholds for cranking, sleep, and run modes - prevents MCU reset during engine start transients |
| Embedded 5 V CAN regulator | Fully protected (overcurrent, thermal, short-circuit) - eliminates need for external CAN supply components |
| SPI-configurable auxiliary regulators | VAUX, VBAUX, VCAUX all enabled - powers external sensors, drivers, or logic with overcurrent and UVLO protection |
| Advanced diagnostics | Real-time monitoring of VDD, VSENSE, temperature, CAN/LIN bus integrity, and I/O pin states via SPI registers |
Applications
| Body Control Module (BCM) | Engine Control Unit (ECU) |
|---|---|
Use Scenario: Centralized power and communication management for door locks, lighting, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: SBC providing regulated 3.3 V MCU supply, LIN-controlled peripheral interfaces, and CAN gateway functionality. Use Value: Reduces BOM count by integrating CAN transceiver, LIN interface, and four wake-up I/Os - simplifies PCB layout and improves system-level fault coverage. |
Use Scenario: Power management and diagnostics for gasoline/diesel engine ECUs operating under extreme thermal and voltage stress. IC Role / Device Role / Timing Role: Fail-safe power supervisor with ISO 11898-5 CAN and cranking-aware undervoltage detection. Use Value: Enables reliable cold-cranking operation via multi-threshold VDD monitoring and maintains CAN communication down to 40 kb/s during low-battery conditions. |
| Electric Power Steering (EPS) | Industrial Motor Drive Controller |
Use Scenario: Safety-critical steering assist module requiring ASIL-B capable diagnostics and fast wake-up response. IC Role / Device Role / Timing Role: System basis chip delivering monitored 3.3 V supply, CAN diagnostics, and hardware SAFE signal for functional safety chains. Use Value: Achieves <10 µs SAFE assertion latency on VDD fault - meets timing requirements for ISO 26262 ASIL-B diagnostic coverage. |
Use Scenario: Robust motor control in agricultural or construction equipment exposed to load dump and ESD. IC Role / Device Role / Timing Role: Power management IC with 40 V transient-rated VSUP1/2 inputs and integrated CAN/LIN for HMI and actuator coordination. Use Value: Withstands 40 V load dump transients without external TVS - reduces protection component count and board space in harsh environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar System Basis Chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33905DS5EK/R2 | VDD output fixed at 5.0 V instead of 3.3 V; identical pinout, LIN count, and CAN capability | Required where MCU or peripheral logic mandates 5 V supply; not suitable for 3.3 V-only designs | Select when interfacing with legacy 5 V microcontrollers or mixed-voltage peripherals |
| MCZ33904D3EK/R2 | No LIN interface; retains same 3.3 V VDD, CAN, 4 wake-up I/Os, and SOIC-32 package | Targeted at CAN-only ECUs without LIN slave networks - e.g., sensor fusion modules or gateway nodes | Choose to reduce cost and complexity where LIN is unnecessary, with full footprint compatibility |
Compared with MCZ33905DS5EK/R2, MCZ33905DS3EK enables direct 3.3 V MCU powering without level-shifting; versus MCZ33904D3EK/R2, it adds LIN 2.1 support for body electronics integration - both alternatives maintain identical thermal and mechanical fit.
Availability
MCZ33905DS3EK is available at Aetrix Electronics and suitable for automotive ECU development, electric power steering systems, and industrial motor controllers requiring stable component supply across extended temperature and high-reliability qualification.
Supply support for MCZ33905DS3EK includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade power management and communication ICs.
The MCZ33905DS3EK belongs to NXP's SBC Gen2 family, designed specifically for next-generation automotive electronic control units requiring integrated CAN/LIN, fail-safe supervision, and ultra-low-power operation in harsh environments.
FAQ
What is the maximum CAN baud rate supported by MCZ33905DS3EK?
The MCZ33905DS3EK supports high-speed CAN up to 1.0 Mb/s and is compliant with ISO 11898-5, enabling reliable communication in demanding automotive networks. It also operates down to 40 kb/s for low-power or diagnostic modes - all within a single device without external configuration.
Does MCZ33905DS3EK support external PNP transistor augmentation for its VDD regulator?
No, MCZ33905DS3EK does not support external PNP augmentation for its VDD regulator. Per datasheet note (2), this capability is explicitly disabled for the MC33903 series and applies to MCZ33905DS3EK - the 3.3 V output is self-contained at 250 mA maximum with internal protection.
How many LIN interfaces does MCZ33905DS3EK integrate?
MCZ33905DS3EK integrates one LIN 2.1 interface, as confirmed by Table 1 ("MC33905S (Single LIN)") and pin definitions showing only RXD-L/TXD-L and LIN-T/I/O-2. This distinguishes it from the dual-LIN MCZ33905DD3EK/R2 variant.
What package type and pin count does MCZ33905DS3EK use?
MCZ33905DS3EK uses a 32-pin SOIC with exposed thermal pad (package code SOT1746-3), as specified in Table 1 and Figure 11 of the datasheet. It shares footprint compatibility with MC33904, MC33903S, and other SBC Gen2 variants in the same package family.
Is MCZ33905DS3EK qualified for automotive temperature range?
Yes, MCZ33905DS3EK is fully qualified for the automotive temperature range of -40 °C to +125 °C, as stated in Table 1 ("all devices rated at TA = -40 °C TO 125 °C"). This rating covers junction temperature under continuous operation in under-hood and cabin ECU environments.
MCZ33905DS3EK Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SOIC-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33905DS3EK FAQ
1.How can I place an order for MCZ33905DS3EK through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33905DS3EK on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33905DS3EK reliable?
The price and inventory of MCZ33905DS3EK are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33905DS3EK is usually 5 days.
3.What payment methods are accepted for MCZ33905DS3EK?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33905DS3EK transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33905DS3EK?
MCZ33905DS3EK orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33905DS3EK order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33905DS3EK?
For technical support, including MCZ33905DS3EK datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33905DS3EK requirements.
6.How does Aetrix verify that MCZ33905DS3EK is sourced from the original manufacturer or authorized distributors?
All MCZ33905DS3EK products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33905DS3EK meets industry standards.
7.What is the process for return or replacement of MCZ33905DS3EK?
All MCZ33905DS3EK units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33905DS3EK, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33905DS3EK part is unused and in its original packaging.
Return procedure for MCZ33905DS3EK:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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