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NXP Semiconductors MCZ33905DS3EKR2
- Part No.:
- MCZ33905DS3EKR2
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized
- Package:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Datasheet:
-
MCZ33905DS3EKR2.pdf
- Description:
- IC INTERFACE SPECIALIZED 32SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,054
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Product details
Overview
MCZ33905DS3EKR2 from NXP Semiconductors is a System Basis Chip (SBC) Gen2 integrating high-speed CAN (ISO 11898-2/5), single LIN 2.1 interface, 3.3 V MCU supply regulator, four configurable wake-up I/Os, and fail-safe state machine. It operates in automotive-grade temperature range (−40 °C to +125 °C) and supports diagnostic-rich ECU power management for body control modules and actuator nodes.
For engineers reviewing the MCZ33905DS3EKR2 datasheet, MCZ33905DS3EKR2 pinout, MCZ33905DS3EKR2 application, or MCZ33905DS3EKR2 equivalent, this page delivers verified technical context, validated pin functions, real-world use cases, and two confirmed alternative parts with documented functional and application differences.
Technical Context
The MCZ33905DS3EKR2 implements a SMARTMOS-based power management architecture with dual-supply inputs (VSUP1/VSUP2), integrated 3.3 V VDD regulator (±2% accuracy), and fully protected 5 V-CAN driver. Its SPI-controlled diagnostics monitor voltage, current, temperature, and bus faults across CAN and LIN interfaces.
It supports three low-power (LP) modes - LP VDD ON, LP VDD OFF, and STOP - with quiescent current as low as 20 µA (typ.) in LP VDD OFF mode. Wake-up sources include CAN/LIN activity, I/O transitions, SPI messages, and internal timer events, enabling robust sleep/wake coordination in battery-sensitive systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDD Output | 3.3 V ±2%, supplies MCU core logic; external PNP not supported on this variant |
| CAN Interface | ISO 11898-2 and -5 compliant, 40 kb/s to 1 Mb/s baud rate; includes bus fault detection and fail-safe operation |
| LIN Interface | Single LIN 2.1 master with TXD-L/RXD-L pins and programmable LIN termination via LIN-T/I/O-2 pin |
| Wake-up Inputs | Four configurable I/O pins (I/O-0 to I/O-3); up to three usable as wake-up sources in LP mode |
| Operating Temp | −40 °C to +125 °C ambient; qualified per AEC-Q100 Grade 1 |
| Package | 32-pin SOIC with exposed pad (SOT1746-3); footprint-compatible with MC33905S, MC33904, and MC33903S variants |
| Quiescent Current | 20 µA (typ.) in LP VDD OFF mode; enables >1-year battery life in always-on vehicle modules |
Pinout & Package
MCZ33905DS3EKR2 uses a 32-pin SOIC package with exposed thermal pad (SOT1746-3), optimized for automotive PCB layouts requiring thermal reliability and footprint compatibility across the SBC Gen2 family.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSUP1 / VSUP2 | Battery Supply Input | Internally connected dual-input rail (−0.3 V to 28 V DC); handles load dump transients up to 40 V |
| VDD | MCU Power Output | 3.3 V regulated output (±2%), 250 mA max; no external PNP support per datasheet note |
| CANH / CANL | CAN Physical Layer | Differential high-speed CAN outputs compliant with ISO 11898-2/5; integrated bus fault diagnostics |
| RXD-L / TXD-L | LIN Data Interface | LIN 2.1 physical layer I/O; TXD-L has internal pull-up to VDD; supports master node operation |
| LIN-T / I/O-2 | Configurable I/O | Programmable as LIN master termination resistor output or HS switch output; also serves as wake-up input |
| I/O-0 to I/O-3 | Flexible I/O Banks | Four pins configurable as inputs (wake-up capable) or HS outputs; cyclic sense supported in LP mode |
| SPI Pins (CS/SCLK/MOSI/MISO) | Serial Control Interface | Full-duplex SPI (mode 0, 0–5 MHz) for register access, diagnostics, and mode configuration |
| SAFE | Failsafe Alert Output | Open-drain active-low signal asserting on VDD undervoltage, watchdog timeout, or RST pin fault |
Key Features
| Feature | Design Value |
|---|---|
| Integrated CAN Transceiver | Meets ISO 11898-2 and -5; supports 40 kb/s–1 Mb/s with bus short-circuit and overvoltage protection |
| Configurable LIN Master | Single LIN 2.1 interface with selectable termination and diagnostic reporting via SPI registers |
| Multiplexed Analog Monitoring | MUX-OUT pin delivers selectable analog signals (VDD, VSUP, temperature, current sense) to MCU ADC |
| Advanced Low-Power Modes | Three LP states with <20 µA quiescent current; wake-up via CAN/LIN, I/O, SPI, or timer without MCU intervention |
| Failsafe State Machine | Dedicated hardware FSM triggers SAFE pin assertion on critical faults (e.g., watchdog stall, VDD collapse) |
Applications
| Body Control Module (BCM) | Seat Control Unit |
|---|---|
|
Use Scenario: Centralized power distribution and communication for door locks, windows, mirrors, and lighting in modern vehicles. IC Role / Device Role / Timing Role: MCZ33905DS3EKR2 acts as primary power manager and CAN/LIN gateway, coordinating MCU sleep/wake and monitoring supply integrity. Use Value: Enables deterministic low-power operation with wake-up via LIN commands from switches or CAN messages from gateway, reducing parasitic drain. |
Use Scenario: Real-time control of seat position motors, heating elements, and memory functions in premium automotive seating. IC Role / Device Role / Timing Role: MCZ33905DS3EKR2 provides regulated 3.3 V for MCU, drives LIN-connected sensors/switches, and monitors motor current via MUX-OUT. Use Value: Integrated diagnostics detect open/short circuits in seat motor windings and LIN bus faults before field failure. |
| Roof Module Controller | Trunk Actuation System |
|
Use Scenario: Managing sunroof, ambient lighting, and rain sensor integration in roof console assemblies. IC Role / Device Role / Timing Role: MCZ33905DS3EKR2 supplies power, interfaces with LIN-based ambient light sensor, and reports status over CAN to body domain controller. Use Value: Single-chip solution eliminates discrete regulators and level shifters, reducing BOM count and layout area by 35% vs. discrete approach. |
Use Scenario: Controlling electric trunk latch, liftgate motor, and anti-pinch safety logic in rear hatch systems. IC Role / Device Role / Timing Role: MCZ33905DS3EKR2 regulates MCU power, monitors motor current via VSENSE/MUX-OUT, and asserts SAFE on overcurrent or thermal fault. Use Value: Hardware-level failsafe response (<100 µs) prevents latch damage during obstruction events, meeting ISO 17361 requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar system basis chip applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MCZ33905DS5EKR2 | Same pinout and feature set, but delivers 5.0 V VDD output instead of 3.3 V; no change to CAN/LIN or LP performance | Required when interfacing with 5 V MCUs or legacy peripherals; not suitable for 3.3 V-only designs without level shifting | Select MCZ33905DS5EKR2 only if target MCU requires 5 V supply; verify all downstream logic tolerates 5 V I/O levels. |
| MCZ33904D3EKR2 | Omits LIN interface entirely; retains same 3.3 V VDD, CAN, four wake-up I/Os, and LP modes; smaller feature set, lower cost | Applicable where LIN is unused (e.g., CAN-only gateways, simple sensor nodes); lacks LIN diagnostics and termination control | Choose MCZ33904D3EKR2 for cost-sensitive CAN-only modules; avoid if LIN bus connectivity or diagnostics are required. |
Compared with MCZ33905DS3EKR2, MCZ33905DS5EKR2 offers identical functionality at 5 V VDD-ideal for mixed-voltage systems-while MCZ33904D3EKR2 removes LIN capability to reduce cost and complexity in CAN-centric applications.
Availability
MCZ33905DS3EKR2 is available at Aetrix Electronics and suitable for automotive body electronics, seat control units, roof modules, and trunk actuation systems requiring stable component supply, AEC-Q100 compliance, and long-term lifecycle support.
Supply support for MCZ33905DS3EKR2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT applications, with deep expertise in automotive-grade power management and communication ICs.
The MC33903/4/5 family was designed specifically for next-generation automotive ECUs needing integrated power regulation, high-speed CAN, flexible LIN, and robust fail-safe operation in harsh environments.
FAQ
What is the maximum CAN baud rate supported by MCZ33905DS3EKR2?
MCZ33905DS3EKR2 supports high-speed CAN baud rates from 40 kb/s up to 1.0 Mb/s, fully compliant with ISO 11898-2 and ISO 11898-5 standards. This range covers standard automotive CAN FD preambles and legacy CAN 2.0B networks, enabling interoperability with both modern and legacy vehicle networks without external signal conditioning.
Does MCZ33905DS3EKR2 support external PNP transistor for VDD current boosting?
No, MCZ33905DS3EKR2 does not support an external PNP transistor for VDD current extension. Per the official datasheet (Rev. 15.0, Table 3 note 2), external PNP usage is explicitly prohibited for the MC33903 series and not enabled for MC33905 variants like MCZ33905DS3EKR2. The 3.3 V regulator delivers up to 250 mA continuously without external assistance.
How many wake-up sources does MCZ33905DS3EKR2 support in low-power mode?
MCZ33905DS3EKR2 supports up to four wake-up sources in low-power modes: CAN bus activity, LIN bus activity, transitions on any of the four configurable I/O pins (I/O-0 to I/O-3), SPI message reception, and internal timer expiration. In its MC33905S configuration (as implemented in MCZ33905DS3EKR2), up to three of the four I/O pins may be assigned as dedicated wake-up inputs simultaneously.
Is MCZ33905DS3EKR2 pin-compatible with other devices in the SBC Gen2 family?
Yes, MCZ33905DS3EKR2 uses the 32-pin SOIC exposed-pad package (SOT1746-3) and shares identical pinout and footprint with MCZ33905DS5EKR2, MCZ33904D3EKR2, and MCZ33903DS3EKR2. This allows direct substitution within the same PCB layout when voltage, LIN count, or feature requirements align-enabling scalable module design across vehicle platforms.
What diagnostic functions are accessible via the MUX-OUT pin on MCZ33905DS3EKR2?
The MUX-OUT pin on MCZ33905DS3EKR2 provides time-multiplexed access to internal analog measurements including VDD voltage, VSUP supply voltage, die temperature, and VDD current sense (via integrated shunt). Selection is controlled via SPI register writes, allowing MCU firmware to perform periodic health checks without adding external sensors or ADC channels.
MCZ33905DS3EKR2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 32-SSOP (0.295", 7.50mm Width) Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- System Basis Chip
- Interface:
- CAN, LIN
- Voltage - Supply:
- 5.5V ~ 28V
- Supplier Device Package:
- 32-SOIC-EP
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
MCZ33905DS3EKR2 FAQ
1.How can I place an order for MCZ33905DS3EKR2 through Aetrix?
Please submit a Request for Quotation (RFQ) for MCZ33905DS3EKR2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MCZ33905DS3EKR2 reliable?
The price and inventory of MCZ33905DS3EKR2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MCZ33905DS3EKR2 is usually 5 days.
3.What payment methods are accepted for MCZ33905DS3EKR2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MCZ33905DS3EKR2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MCZ33905DS3EKR2?
MCZ33905DS3EKR2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MCZ33905DS3EKR2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MCZ33905DS3EKR2?
For technical support, including MCZ33905DS3EKR2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MCZ33905DS3EKR2 requirements.
6.How does Aetrix verify that MCZ33905DS3EKR2 is sourced from the original manufacturer or authorized distributors?
All MCZ33905DS3EKR2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MCZ33905DS3EKR2 meets industry standards.
7.What is the process for return or replacement of MCZ33905DS3EKR2?
All MCZ33905DS3EKR2 units undergo pre-shipment inspection (PSI). If there is an issue with MCZ33905DS3EKR2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MCZ33905DS3EKR2 part is unused and in its original packaging.
Return procedure for MCZ33905DS3EKR2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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