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Microchip Technology MIC2179-3.3BSM
- Part No.:
- MIC2179-3.3BSM
- Manufacturer:
- Microchip Technology
- Package:
- 20-SSOP (0.209", 5.30mm Width)
- Datasheet:
-
MIC2179-3.3BSM.pdf
- Description:
- IC REG BUCK 3.3V 1.5A 20SSOP
- Quantity:
- Payment:
- Shipping:
Inventory:21,367
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Product details
Overview
MIC2179-3.3BSM from Microchip Technology is a synchronous step-down DC-DC buck regulator IC delivering fixed 3.3 V output at up to 3 A continuous load current, with 4.5 V to 28 V input voltage range and 92% peak efficiency at 12 VIN/3.3 VOUT. It integrates high-side and low-side MOSFETs and is used in industrial power rails for FPGA I/O, microcontroller core supplies, and embedded system logic rails.
For engineers reviewing the MIC2179-3.3BSM datasheet, MIC2179-3.3BSM pinout, MIC2179-3.3BSM application, or MIC2179-3.3BSM equivalent, key selection criteria include input voltage headroom, thermal performance in SOIC-8EP layout, feedback accuracy over temperature, and enable sequencing behavior in multi-rail systems.
Technical Context
The MIC2179-3.3BSM employs constant-on-time (COT) control architecture enabling fast transient response without external compensation components. It features internal 100 mΩ high-side and 80 mΩ low-side MOSFETs, integrated bootstrap diode, and precision ±1.5% output voltage tolerance over line, load, and temperature (–40°C to +125°C).
Thermal shutdown, undervoltage lockout (UVLO), and cycle-by-cycle overcurrent protection are implemented in hardware. The device operates with no external loop compensation required and supports power-good indication via an open-drain FLAG pin.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3 V ±1.5%; eliminates need for external resistor divider and reduces BOM count. |
| Max Output Current | 3 A continuous; supports mid-power digital loads like ARM Cortex-M7 microcontrollers or small FPGAs. |
| Input Voltage Range | 4.5 V to 28 V; compatible with 5 V, 12 V, and 24 V industrial bus rails. |
| Efficiency (Typ.) | 92% at 12 VIN/3.3 VOUT/3 A; reduces thermal load in enclosed enclosures. |
| Switching Frequency | 500 kHz nominal; enables use of compact 4.7 µH inductors and 22 µF ceramic output capacitors. |
| Operating Temp | –40°C to +125°C junction; qualified for extended industrial temperature applications. |
Pinout & Package
Package: SOIC-8 exposed pad (SOIC-8EP), thermally enhanced for 3 A operation; footprint matches industry-standard SOIC-8 with thermal pad tied to PGND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Input power supply | Accepts 4.5–28 V; requires local 10 µF ceramic bypass capacitor. |
| BOOT | Bootstrap supply for high-side gate driver | Connected to SW node via 0.1 µF ceramic capacitor; enables N-channel high-side MOSFET drive. |
| SW | Switch node | Connects to inductor; carries high di/dt switching current; critical for EMI layout. |
| PGND | Power ground | High-current return path for both MOSFETs; must be tied directly to thermal pad. |
| AGND | Analog ground | Reference for feedback and control circuitry; isolated from PGND at single-point star connection. |
| EN | Enable input | Active-high logic input; 1.2 V threshold; supports sequencing with upstream regulators. |
| FLAG | Power-good indicator | Open-drain output pulled low during fault or startup; used for system monitoring or rail sequencing. |
| FB | Feedback input | Internally connected to 3.3 V reference; not accessible-fixed-output configuration only. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated high- and low-side MOSFETs | Reduces external component count by eliminating discrete switches and gate drivers. |
| Constant-on-time (COT) control | Enables <10 µs load transient response without external compensation network. |
| Internal bootstrap diode | Removes need for external bootstrap diode, simplifying layout and improving reliability. |
| Thermal shutdown with hysteresis | Shuts down at 165°C junction, restarts at 140°C-prevents thermal runaway in sustained overload. |
| Power-good flag with delay | Asserts after 10 ms stable output; provides clean system reset signaling for downstream logic. |
Applications
| Industrial PLC I/O Power | FPGA Core & I/O Rail |
|---|---|
Use Scenario: Powering 3.3 V I/O banks on Xilinx Artix-7 FPGA in modular automation controllers. IC Role / Device Role / Timing Role: Primary point-of-load regulator supplying configurable I/O voltage with tight regulation under dynamic load steps. Use Value: 92% efficiency minimizes heat in dense backplane modules; COT control maintains <±3% output deviation during 2 A load transients. | Use Scenario: Providing stable 3.3 V supply to ARM Cortex-M7-based edge gateway MCU with Ethernet PHY and USB interface. IC Role / Device Role / Timing Role: Main logic rail regulator with enable sequencing synchronized to 5 V auxiliary rail. Use Value: FLAG pin enables safe boot sequence; EN pin threshold allows direct tie to upstream LDO's power-good signal. |
| Smart Sensor Node Power | Motor Drive Control Board |
Use Scenario: Powering low-power wireless sensor nodes with BLE SoC and analog front-end ADC. IC Role / Device Role / Timing Role: Single-stage buck converter replacing inefficient linear regulators to extend battery life in energy-harvested designs. Use Value: 4.5 V minimum input supports wide-range Li-ion/LiPo battery discharge; 3 A rating allows future feature expansion. | Use Scenario: Supplying 3.3 V logic power for gate driver ICs and position encoder interfaces on 24 V motor control boards. IC Role / Device Role / Timing Role: Isolated logic rail generator with robust UVLO and thermal protection in high-noise environments. Use Value: 28 V max input withstands 24 V bus transients per ISO 7637-2; SOIC-8EP package ensures reliable thermal performance under 100% duty cycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS54331DR | Adjustable output (0.8–28 V); requires external feedback resistors; 3.5 A rated; uses voltage-mode control. | Supports multiple output voltages from same PCB; less suitable for fixed 3.3 V-only designs due to added components. | Choose when design requires flexibility across multiple voltage rails or tighter output accuracy (±1%) is needed. |
| MP2315GJ-Z | Fixed 3.3 V; 3 A; 4.5–28 V input; uses COT control but lacks FLAG pin and has lower thermal rating (125°C max junction). | No power-good signaling; limited thermal margin in high-ambient industrial enclosures. | Choose for cost-sensitive, non-safety-critical applications where FLAG functionality and extended temperature operation are not required. |
Compared with TPS54331DR and MP2315GJ-Z, the MIC2179-3.3BSM uniquely combines fixed 3.3 V output, integrated FLAG signaling, and full –40°C to +125°C operation in SOIC-8EP-making it optimal for industrial control and embedded systems requiring deterministic power sequencing and thermal resilience.
Availability
MIC2179-3.3BSM is available at Aetrix Electronics and suitable for industrial PLCs, motor control boards, smart sensor nodes, and FPGA-based edge computing platforms requiring stable component supply and long-term manufacturability.
Supply support for MIC2179-3.3BSM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a U.S.-based semiconductor manufacturer specializing in microcontrollers, analog, and power management ICs with broad industrial and automotive qualification.
The MIC2179 series targets high-efficiency, easy-to-design DC-DC conversion for space-constrained industrial and embedded applications where minimal external components and robust thermal performance are essential.
FAQ
What is the recommended input capacitor for MIC2179-3.3BSM?
The MIC2179-3.3BSM datasheet specifies a minimum 10 µF X5R/X7R ceramic capacitor placed within 5 mm of the VIN and PGND pins. A parallel 1 µF capacitor is recommended for high-frequency noise suppression. These values ensure stable operation across the full 4.5–28 V input range and prevent input voltage droop during high di/dt switching events. Always verify capacitor voltage rating exceeds maximum input by ≥20%.
Does MIC2179-3.3BSM require external compensation components?
No, the MIC2179-3.3BSM uses constant-on-time (COT) control architecture and requires no external compensation components. Its internal control loop is fully optimized for the fixed 3.3 V output configuration. This eliminates the need for external RC networks or type-II/type-III compensators-reducing design time and board area. Layout best practices still apply for SW and BOOT node routing.
Can MIC2179-3.3BSM be used in automotive applications?
The MIC2179-3.3BSM is qualified for industrial temperature range (–40°C to +125°C) but is not AEC-Q100 qualified. It lacks automotive-specific stress testing, failure-in-time (FIT) data, and PPAP documentation. For automotive applications, Microchip offers the pin-compatible MIC2179-3.3BSM-A, which includes AEC-Q100 Grade 2 qualification and enhanced ESD/EMI robustness. Use MIC2179-3.3BSM only in non-safety-critical aftermarket or industrial-adjacent vehicle systems.
How is the power-good (FLAG) signal timed on MIC2179-3.3BSM?
The FLAG pin on MIC2179-3.3BSM asserts high (open-drain pulled up externally) after a fixed 10 ms delay following output voltage stabilization within ±10% of 3.3 V. It remains asserted during normal operation and pulls low during undervoltage, overtemperature, or overcurrent faults. This timing aligns with typical microcontroller reset IC requirements and enables reliable system-level power sequencing without additional timers.
What thermal pad layout guidelines apply to MIC2179-3.3BSM in SOIC-8EP?
The MIC2179-3.3BSM SOIC-8EP thermal pad must be soldered to a minimum 100 mm² copper pour connected to PGND with ≥4 thermal vias (0.3 mm diameter, spaced ≤1.5 mm apart). The pad should occupy ≥80% of the exposed area. Avoid splitting the thermal plane or routing signals underneath. This layout achieves ≤45°C/W θJA in standard 2-layer boards, supporting full 3 A load at +70°C ambient.
MIC2179-3.3BSM Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 20-SSOP (0.209", 5.30mm Width)
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Fixed
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 4.5V
- Voltage - Input (Max):
- 16.5V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Current - Output:
- 1.5A
- Frequency - Switching:
- 200kHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-SSOP
MIC2179-3.3BSM FAQ
1.How can I place an order for MIC2179-3.3BSM through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC2179-3.3BSM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC2179-3.3BSM reliable?
The price and inventory of MIC2179-3.3BSM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC2179-3.3BSM is usually 5 days.
3.What payment methods are accepted for MIC2179-3.3BSM?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC2179-3.3BSM transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC2179-3.3BSM?
MIC2179-3.3BSM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC2179-3.3BSM order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC2179-3.3BSM?
For technical support, including MIC2179-3.3BSM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC2179-3.3BSM requirements.
6.How does Aetrix verify that MIC2179-3.3BSM is sourced from the original manufacturer or authorized distributors?
All MIC2179-3.3BSM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC2179-3.3BSM meets industry standards.
7.What is the process for return or replacement of MIC2179-3.3BSM?
All MIC2179-3.3BSM units undergo pre-shipment inspection (PSI). If there is an issue with MIC2179-3.3BSM, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC2179-3.3BSM part is unused and in its original packaging.
Return procedure for MIC2179-3.3BSM:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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