Microchip Technology MIC2800-D24MYML-TR
- Part No.:
- MIC2800-D24MYML-TR
- Manufacturer:
- Microchip Technology
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 16-VFQFN
- Datasheet:
-
MIC2800-D24MYML-TR.pdf
- Description:
- IC REG TRPL BUCK/LNR 2MHZ 16QFN
- Quantity:
- Payment:

- Shipping:

Inventory:2,705
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Product details
Overview
MIC2800-D24MYML-TR from Microchip Technology is a digital power management IC integrating a 2 MHz, 600 mA synchronous buck DC/DC converter and two independent 300 mA LDO regulators (LDO1 and LDO2), all in a single 16-pin 3 mm × 3 mm QFN package. It delivers three regulated outputs with adjustable POR delay, LOWQ ultra-low-noise light-load mode (30 µA total IQ, 75 µVRMS noise), and thermal/current protection - optimized for embedded MPU core and I/O rail sequencing in battery-powered SAMA5D2-based systems.
For engineers reviewing the MIC2800-D24MYML-TR datasheet, MIC2800-D24MYML-TR pinout, MIC2800-D24MYML-TR application, or MIC2800-D24MYML-TR equivalent, this page provides verified technical context, real-world design meanings for key specs, validated pin functions, confirmed alternative parts with functional differences, and supply-chain support details specific to this exact variant.
Technical Context
The MIC2800-D24MYML-TR implements a dual-mode regulation architecture: full-power PWM operation (2 MHz, >90% efficiency at 600 mA) and LOWQ linear-regulator mode (30 µA IQ, 75 µVRMS output noise, 60 mA max LDO-sourced output). Its three-output topology separates power domains - DC/DC feeds LDO1, while LDO2 draws directly from VIN - enabling independent enable control (EN1 for DC/DC+LDO1, EN2 for LDO2) and precise power sequencing via programmable POR delay (CSET pin).
Pin-level isolation is engineered for backup-power integrity: LOWQ and POR pins feature ESD protection without clamping diodes to supply rails, allowing direct interfacing with host MPU GPIOs under backup domains without parasitic leakage - critical for fail-safe reset signaling and low-power retention states.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports single-cell Li-ion, USB, and industrial 3.3V/5V rails without external pre-regulation. |
| DC/DC Output Current | 600 mA in PWM mode - sufficient to power ARM Cortex-A5 cores (e.g., SAMA5D2) and feed LDO1 simultaneously. |
| LDO1/LDO2 Output Current | 300 mA each - enables independent powering of DDR I/O (LDO2) and processor core (LDO1 via DC/DC output). |
| LOWQ Mode IQ | 30 µA total - reduces system standby power by >95% vs. PWM mode, extending battery life in wearable sleep states. |
| Output Noise (LOWQ) | 75 µVRMS - low enough to avoid interference with sensitive RF receivers or high-resolution ADCs sharing the same PCB. |
| POR Delay Programmability | Capacitor-set (CSET pin) - allows precise timing alignment of reset assertion with multi-rail power-up sequences (e.g., VDD_CORE before VDD_IO). |
| Thermal Shutdown | 160°C threshold with 23°C hysteresis - prevents damage during sustained overload or poor PCB thermal design. |
Pinout & Package
Package: 16-pin 3 mm × 3 mm QFN (ML suffix per Microchip part numbering), leadless, exposed thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (LOWQ) | Mode select input | Active-low control: <0.2V enables ultra-low-noise LOWQ mode (30 µA IQ); >1V enables full-power 2 MHz PWM mode - no clamping diodes allow safe backup-domain GPIO driving. |
| Pin 2 (BIAS) | Bias supply input | Internal 6Ω resistor-fed bias rail; requires 0.1 µF ceramic bypass to SGND - stabilizes reference and error amplifier operation across temperature. |
| Pins 3 & 4 (SGND, PGND) | Separate ground returns | SGND carries low-current analog/digital control signals; PGND handles high di/dt PWM switching current - mandatory split-plane layout prevents noise coupling into regulation loop. |
| Pin 5 (SW) | Power switch node | High-speed connection to internal MOSFETs and external inductor; must be routed short and away from sensitive traces to minimize EMI. |
| Pins 6 & 7 (VIN) | Input power inputs | Dual VIN pins - both must be tied together externally to supply DC/DC stage and LDO2; requires ≥4.7 µF ceramic capacitor near PGND. |
| Pin 8 (LDO2) | LDO2 regulated output | 300 mA output referenced to VIN; dropout as low as 70 mV at 150 mA - suitable for 2.8V I/O rails with tight voltage margins. |
| Pin 9 (FB) | DC/DC feedback input | Connects to DC/DC output for fixed-voltage versions; internal resistor divider sets nominal VOUT - enables accurate ±2% regulation over load/temperature. |
| Pin 10 (LDO) | LOWQ mode output path | Connects to DC/DC output node; supplies LDO1 in PWM mode and becomes primary output in LOWQ mode - enables seamless transition between regulation topologies. |
| Pin 11 (LDO1) | LDO1 regulated output | 300 mA output powered by DC/DC stage; ideal for 1.2V–1.5V core rails with 30 µVRMS noise - avoids need for separate core LDO. |
| Pin 12 (POR) | Open-drain reset flag | Asserts low if any output (DC/DC, LDO1, LDO2) falls below 90% of nominal - ESD-isolated for direct connection to backup-power MPU GPIOs. |
| Pin 13 (CSET) | POR delay timing | 1.25 µA current source charges external capacitor; delay = CSET value in pF - allows up to 1 s programmable reset hold-off for complex power sequencing. |
| Pin 14 (CBYP) | Reference bypass | 0.1 µF capacitor to SGND reduces output noise and improves PSRR - optional but recommended for RF-sensitive applications. |
| Pin 15 (EN1) | DC/DC + LDO1 enable | Active-high CMOS input (VIH ≥1.0V); controls main power domain - pulling low disables both DC/DC and LDO1, reducing IQ to <0.2 µA. |
| Pin 16 (EN2) | LDO2 enable | Active-high CMOS input (VIH ≥1.0V); independent control of I/O rail - enables staggered power-up (e.g., LDO2 first, then DC/DC+LDO1). |
Key Features
| Feature | Design Value |
|---|---|
| LOWQ Mode | Reduces total quiescent current to 30 µA while delivering ultra-low-noise (75 µVRMS) output - eliminates PFM ripple that disrupts RF receivers during sleep. |
| Independent Dual Enable Control | EN1 (DC/DC+LDO1) and EN2 (LDO2) allow precise sequencing - e.g., power LDO2 first for I/O initialization, then DC/DC+LDO1 for core boot - preventing bus contention. |
| Backup-Power-Safe POR & LOWQ Pins | No clamping diodes to supply rails - enables direct connection to host MPU GPIOs powered by coin-cell backup, eliminating leakage paths when main power is off. |
| Integrated Power-on Reset with Programmable Delay | CSET pin sets POR assert time (up to 1 s) - ensures stable DC/DC and LDO outputs before releasing reset to MPU, avoiding brown-out crashes during cold start. |
| Thermal and Current Protection | 160°C shutdown with 23°C hysteresis and per-rail current limiting (e.g., 350–700 mA for LDO1) - protects against PCB layout errors or transient overloads without external components. |
Applications
| Embedded MPU Core Power | Portable Wearable Sequencing |
|---|---|
Use Scenario: Powering ARM Cortex-A5 core (e.g., SAMA5D2) requiring 1.2V @ 300 mA with strict noise and sequencing requirements. IC Role / Device Role / Timing Role: MIC2800-D24MYML-TR delivers VDD_CORE via LDO1 (fed by DC/DC), with POR delay aligned to DDR initialization timing. Use Value: Eliminates need for discrete core LDO and external POR timer; 30 µVRMS LDO1 noise meets ARM core analog supply specs. | Use Scenario: Smartwatch with Li-ion battery, BLE radio, and always-on sensor hub requiring ultra-low standby power. IC Role / Device Role / Timing Role: MIC2800-D24MYML-TR switches to LOWQ mode during sleep, powering MCU via LDO2 while disabling DC/DC and LDO1. Use Value: 30 µA total IQ extends battery life to >7 days in sleep; 75 µVRMS noise prevents BLE packet corruption. |
| Low-Power RF System Bias | Backup Power System Monitoring |
Use Scenario: Sub-GHz RF transceiver (e.g., SX1276) sharing PCB with digital processor, needing clean 3.3V supply. IC Role / Device Role / Timing Role: MIC2800-D24MYML-TR supplies VDD_IO via LDO2, with CBYP capacitor minimizing switching noise coupling. Use Value: 75 dB PSRR at 1 kHz and 25 µVRMS output noise ensure >80 dB adjacent-channel rejection in RF receive mode. | Use Scenario: Industrial controller with supercapacitor backup maintaining RTC and critical registers during AC loss. IC Role / Device Role / Timing Role: MIC2800-D24MYML-TR POR and LOWQ pins interface directly with backup-powered MCU GPIOs to signal power-fail events. Use Value: ESD-isolated pins prevent parasitic discharge from backup rail through MIC2800, preserving >95% of backup energy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65023BRSBR | Triple-output PMIC (2 DC/DC + 1 LDO); 2.5–5.5V input; 600 mA DC/DC; no LOWQ mode; 100 µA typical IQ | Lacks ultra-low-noise light-load mode - unsuitable for RF-sensitive or multi-day battery applications | Select when higher DC/DC efficiency at mid-load is prioritized over standby IQ and noise performance |
| MAX20029ATGB/V+T | Dual-output PMIC (1 DC/DC + 1 LDO); 3–36V input; 600 mA DC/DC; 20 µA IQ; automotive AEC-Q100 qualified | Single LDO only; wider input range targets 12V automotive, not portable 3.3V/5V systems | Select for automotive infotainment requiring extended temp range and ASIL-B compliance, not consumer wearables |
Compared with TPS65023BRSBR and MAX20029ATGB/V+T, the MIC2800-D24MYML-TR uniquely combines triple-output flexibility, programmable POR sequencing, and LOWQ mode's 75 µVRMS noise - making it optimal for space-constrained, battery-powered MPU systems where RF coexistence and multi-day standby are critical.
Availability
MIC2800-D24MYML-TR is available at Aetrix Electronics and suitable for embedded MPU power, portable wearable sequencing, low-power RF system bias, and backup power system monitoring requiring stable component supply across design-in, prototyping, and volume production phases.
Supply support for MIC2800-D24MYML-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog devices, and power management ICs, headquartered in Chandler, Arizona, with global design and manufacturing operations.
The MIC2800 product line is designed for highly integrated, low-power digital power management in resource-constrained embedded systems - specifically targeting ARM-based MPUs requiring sequenced multi-rail power with ultra-low standby consumption and RF-clean operation.
FAQ
What is the exact input voltage range supported by the MIC2800-D24MYML-TR?
The MIC2800-D24MYML-TR supports an input voltage range of 2.7V to 5.5V, covering common single-cell Li-ion batteries (3.0–4.2V), USB 5V, and industrial 3.3V rails. Absolute maximum rating is 6.0V, but operation above 5.5V is not guaranteed and may cause permanent damage.
How does the LOWQ mode affect output current capability on the MIC2800-D24MYML-TR?
In LOWQ mode (LOWQ pin <0.2V), the MIC2800-D24MYML-TR disables the DC/DC PWM stage and regulates output via the internal LDO path. Total IQ drops to 30 µA, but LDO1 and LDO2 output current is limited to 10 mA each, while the LDO-sourced output (via Pin 10) can deliver up to 60 mA - sufficient for MCU retention but not full active operation.
Can the MIC2800-D24MYML-TR be used with ceramic output capacitors only?
Yes, the MIC2800-D24MYML-TR is fully compatible with ceramic output capacitors: minimum 2.2 µF for each LDO output and 2.2 µF for the DC/DC output, plus a 4.7 µF ceramic capacitor on VIN. The device's stability is guaranteed with low-ESR ceramics, eliminating need for tantalum or electrolytic types and reducing board area and cost.
What is the purpose of the CSET pin on the MIC2800-D24MYML-TR, and how is it configured?
The CSET pin on the MIC2800-D24MYML-TR is a 1.25 µA current source that charges an external capacitor to ground, setting the POR output's low-to-high assertion delay. Delay (in microseconds) equals the capacitor value in picofarads - e.g., 10 nF yields ~10 ms delay. Leaving CSET open gives minimum delay (~1 µs); grounding it is prohibited.
Does the MIC2800-D24MYML-TR provide overtemperature protection, and what is its trip point?
Yes, the MIC2800-D24MYML-TR includes overtemperature shutdown with a trip point of 160°C and 23°C hysteresis. When junction temperature exceeds 160°C, the device disables all regulators and enters thermal shutdown. Recovery occurs only after temperature falls below 137°C, preventing cycling during sustained overload conditions.
MIC2800-D24MYML-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 16-VFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Topology:
- Step-Down (Buck) (1), Linear (LDO) (2)
- Number of Outputs:
- 3
- Frequency - Switching:
- 2MHz
- Voltage/Current - Output 1:
- 1.87V, 600mA
- Voltage/Current - Output 2:
- 1.2V, 300mA
- Voltage/Current - Output 3:
- 2.8V, 300mA
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (3x3)
MIC2800-D24MYML-TR FAQ
1.How can I place an order for MIC2800-D24MYML-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC2800-D24MYML-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC2800-D24MYML-TR reliable?
The price and inventory of MIC2800-D24MYML-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC2800-D24MYML-TR is usually 5 days.
3.What payment methods are accepted for MIC2800-D24MYML-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC2800-D24MYML-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC2800-D24MYML-TR?
MIC2800-D24MYML-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC2800-D24MYML-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC2800-D24MYML-TR?
For technical support, including MIC2800-D24MYML-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC2800-D24MYML-TR requirements.
6.How does Aetrix verify that MIC2800-D24MYML-TR is sourced from the original manufacturer or authorized distributors?
All MIC2800-D24MYML-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC2800-D24MYML-TR meets industry standards.
7.What is the process for return or replacement of MIC2800-D24MYML-TR?
All MIC2800-D24MYML-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC2800-D24MYML-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC2800-D24MYML-TR part is unused and in its original packaging.
Return procedure for MIC2800-D24MYML-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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