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Microchip Technology MIC2800-G8SYML-TR
- Part No.:
- MIC2800-G8SYML-TR
- Manufacturer:
- Microchip Technology
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 16-VFQFN
- Datasheet:
-
MIC2800-G8SYML-TR.pdf
- Description:
- IC REG TRPL BUCK/LNR 2MHZ 16QFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,021
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Product details
Overview
MIC2800-G8SYML-TR from Microchip Technology is a digital power management IC integrating a 2 MHz, 600 mA synchronous buck DC/DC converter and two independent 300 mA LDOs (LDO1 fed from DC/DC output, LDO2 fed directly from VIN). It delivers three regulated outputs with <30 µA total quiescent current in LOWQ mode, 75 µVRMS DC/DC output noise, and thermal/current protection-designed for embedded MPU core/I/O rail sequencing in portable SAMA5D2-based systems.
For engineers reviewing the MIC2800-G8SYML-TR datasheet, MIC2800-G8SYML-TR pinout, MIC2800-G8SYML-TR application, or MIC2800-G8SYML-TR equivalent, key selection criteria include LOWQ-mode ultra-low-noise operation, adjustable POR delay via CSET capacitor, dual enable control (EN1 for DC/DC+LDO1, EN2 for LDO2), and QFN-16 3mm×3mm package compatibility with high-density PCB layouts.
Technical Context
The MIC2800-G8SYML-TR implements a dual-mode regulation architecture: full-power PWM mode (2 MHz fixed-frequency switching) for high-efficiency conversion up to 600 mA, and LOWQ linear-regulator mode (activated by pulling LOWQ pin low) that disables the DC/DC stage and uses internal LDO circuitry to supply up to 60 mA with 75 µVRMS noise. LDO1 draws input from the DC/DC output, enabling efficient 1.8 V → 1.5 V or 1.2 V conversion; LDO2 accepts direct VIN input (2.7–5.5 V) for independent I/O rail generation.
Its POR function monitors all three outputs (DC/DC, LDO1, LDO2) with open-drain active-low assertion and user-programmable delay (via CSET capacitor, 1.25 µA current source), while dedicated SGND/PGND pins isolate signal and power return paths to minimize noise coupling. The device supports leakage-free interfacing with backup-power-domain host I/Os due to ESD-protected LOWQ and POR pins without clamping diodes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports single-cell Li-ion, USB, or 3.3 V/5 V system rails without external pre-regulation. |
| DC/DC Output Current | 600 mA max in PWM mode - sufficient to power ARM Cortex-A5 cores and DDR memory subsystems. |
| LDO1/LDO2 Output Current | 300 mA each - enables simultaneous core voltage (VDD_CORE) and I/O voltage (VDD_IO) regulation. |
| LOWQ Mode IQ | 30 µA total - extends battery life in sleep states while maintaining regulated outputs. |
| DC/DC Output Noise | 75 µVRMS in LOWQ mode - avoids interference with sensitive RF or ADC circuits during light-load operation. |
| Package | 16-pin 3 mm × 3 mm QFN - compact footprint with exposed thermal pad for thermal management in space-constrained wearables. |
| Operating Temperature | –40°C to +125°C junction - qualified for industrial and automotive-adjacent embedded applications. |
Pinout & Package
Package: 16-pin leadless QFN, 3 mm × 3 mm, 0.5 mm pitch, exposed thermal pad (pin 9 not assigned; thermal pad must be soldered to PCB ground plane).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (LOWQ) | Mode Control Input | Active-low logic input selecting LOWQ linear mode (<0.2 V) or PWM mode (>1.0 V); no clamping diodes enable safe backup-power-domain interfacing. |
| Pin 2 (BIAS) | Bias Supply Terminal | Internal reference and control circuit power node; requires 0.1 µF ceramic bypass to SGND for stability and noise reduction. |
| Pins 3 & 4 (SGND, PGND) | Ground Returns | SGND carries low-current signal paths; PGND carries high-switching-current return - separation prevents noise injection into control loop. |
| Pin 5 (SW) | Power Switch Node | High-speed switching output connected to external inductor; routing must avoid sensitive analog traces due to dV/dt transients. |
| Pins 6 & 7 (VIN) | Main Power Inputs | Dual VIN pins tied externally to supply both DC/DC switcher and LDO2; requires ≥4.7 µF ceramic bypass to PGND. |
| Pin 8 (LDO2) | LDO2 Regulated Output | 300 mA output referenced to VIN; minimum 2.2 µF ceramic output capacitor required for stability. |
| Pin 9 (FB) | DC/DC Feedback Input | Connects to DC/DC output for fixed-voltage versions; internal resistor divider sets nominal VOUT (e.g., 1.87 V). |
| Pin 10 (LDO) | LOWQ Linear Regulator Output | Supplies LDO1 in PWM mode and becomes primary output in LOWQ mode; connects to DC/DC VOUT node. |
| Pin 11 (LDO1) | LDO1 Regulated Output | 300 mA output powered by DC/DC stage; ideal for low-noise core voltage (e.g., 1.2 V or 1.5 V) with 2.2 µF output cap. |
| Pin 12 (POR) | Open-Drain Reset Flag | Asserts low if any enabled output falls below 90% of nominal; requires external pull-up to VIN or VDD_IO for host MPU reset signaling. |
| Pin 13 (CSET) | POR Delay Timing Input | 1.25 µA current source charges external capacitor to set POR high-to-low delay; delay = CSET capacitance in pF (e.g., 10 nF = 10,000 µs). |
| Pin 14 (CBYP) | Reference Bypass | Connects 0.1 µF capacitor to SGND to reduce reference noise and improve PSRR; optional but recommended for RF-sensitive designs. |
| Pin 15 (EN1) | DC/DC + LDO1 Enable | Active-high CMOS input controlling both buck regulator and LDO1; VIH ≥ 1.0 V ensures reliable turn-on. |
| Pin 16 (EN2) | LDO2 Enable | Independent active-high enable for LDO2 only; allows flexible power sequencing (e.g., VDD_IO before VDD_CORE). |
Key Features
| Feature | Design Value |
|---|---|
| LOWQ Mode Operation | Reduces total IQ to ≤30 µA while delivering regulated output via internal linear regulator-enabling multi-day battery life in sensor-sleep states. |
| Programmable POR Delay | CSET pin accepts external capacitor (0–1 µF) to set POR assertion delay from microseconds to 1 second-ensuring proper MPU boot sequencing across varying load conditions. |
| Dual Independent Enables | EN1 controls DC/DC + LDO1; EN2 controls LDO2 alone-supporting staggered power-up (e.g., LDO2 first for I/O, then DC/DC+LDO1 for core) without external logic. |
| Backup-Power-Safe Pins | LOWQ and POR pins lack supply-rail clamping diodes-allowing direct connection to host I/Os powered from coin-cell backup supplies without parasitic leakage. |
| Thermal & Current Protection | Integrated overtemperature shutdown (160°C trigger, 23°C hysteresis) and per-channel current limiting prevent damage during overload or poor heatsinking. |
Applications
| Embedded MPU Core/I/O Power | Low-Power RF System Power |
|---|---|
Use Scenario: Powering ARM-based SAMA5D2 MPU requiring separate 1.2 V core (VDD_CORE), 2.8 V I/O (VDD_IO), and 1.8 V DDR interface (VDDIO_DDR) from a single 3.6 V Li-ion source. IC Role / Device Role / Timing Role: MIC2800-G8SYML-TR acts as primary PMIC generating all three rails with precise sequencing: LDO2 powers VDD_IO first, then DC/DC+LDO1 establish VDDIO_DDR and VDD_CORE. Use Value: Eliminates need for three discrete regulators and external POR timing components-reducing BOM count by ≥5 parts and PCB area by >30 mm². | Use Scenario: Supplying BLE/Wi-Fi SoC (e.g., ATWINC1500) with clean 1.8 V RF supply and 3.3 V digital I/O, where switching noise must not degrade receiver sensitivity. IC Role / Device Role / Timing Role: MIC2800-G8SYML-TR operates in LOWQ mode during standby, using LDO path to deliver 75 µVRMS-noise 1.8 V to RF section while drawing only 30 µA. Use Value: Achieves –95 dBm RX sensitivity (vs. –90 dBm with standard PFM-mode converters) due to ultra-low output noise during listening intervals. |
| Portable Wearable Power | Backup Power Sequencing |
Use Scenario: Powering optical heart-rate monitor with photodiode amplifier (noise-sensitive analog), MCU, and Bluetooth LE radio from coin-cell battery. IC Role / Device Role / Timing Role: MIC2800-G8SYML-TR supplies 1.8 V (LDO1) to analog front-end and 2.8 V (LDO2) to BLE radio; LOWQ mode engages between measurements to conserve energy. Use Value: Extends coin-cell lifetime to 12 months (vs. 4 months with conventional PMIC) by cutting average current from 120 µA to 22 µA during 95% duty-cycle sleep. | Use Scenario: Maintaining real-time clock and SRAM retention during main power loss in industrial controller, using supercapacitor backup. IC Role / Device Role / Timing Role: MIC2800-G8SYML-TR's LOWQ and POR pins interface directly with backup domain I/Os; POR remains asserted even when main VIN drops, signaling host MPU to save state. Use Value: Enables seamless failover to backup power without external level shifters or isolation MOSFETs-reducing design complexity and failure points. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-rail power management applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS65023BRSBT | Triple-output PMIC with 2.5 A DC/DC + dual 600 mA LDOs; higher current capability but 40 µA typical IQ in LP mode and no LOWQ-equivalent ultra-low-noise mode. | Targeted at higher-power OMAP3/4 platforms; lacks programmable POR delay and backup-safe LOWQ/POR pins. | Select when >600 mA DC/DC current or >300 mA LDO current is required; avoid when sub-30 µA IQ or RF-grade noise performance is critical. |
| RT5782AZSP | 2 MHz, 600 mA buck + dual 300 mA LDOs; 25 µA IQ in ultralight-load mode but 120 µVRMS output noise-2.5× higher than MIC2800-G8SYML-TR in LOWQ mode. | Optimized for cost-sensitive consumer electronics; no CSET-programmable POR delay or dedicated backup-power-safe pins. | Select for price-driven volume production where 75 µVRMS noise is not mandatory; avoid for medical or RF-critical designs requiring lowest possible ripple. |
Compared with TPS65023BRSBT and RT5782AZSP, the MIC2800-G8SYML-TR uniquely combines <30 µA IQ, 75 µVRMS LOWQ noise, CSET-adjustable POR timing, and backup-domain-safe pin architecture-making it optimal for battery-powered, noise-sensitive, and fail-safe embedded systems where reliability and efficiency are co-prioritized.
Availability
MIC2800-G8SYML-TR is available at Aetrix Electronics and suitable for embedded MPU power, portable wearable systems, and low-power RF applications requiring stable component supply, long-lifecycle support, and consistent parametric performance across temperature and voltage ranges.
Supply support for MIC2800-G8SYML-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontroller, mixed-signal, analog, and Flash-IP solutions, serving automotive, industrial, consumer, and communications markets with high-reliability silicon and development tools.
The MIC2800 product line delivers integrated power management ICs optimized for ARM-based embedded processors, emphasizing ultra-low-quiescent-current operation, noise-sensitive RF compatibility, and robust power sequencing for battery-constrained and mission-critical applications.
FAQ
What is the maximum output current capability of the MIC2800-G8SYML-TR's DC/DC converter?
The MIC2800-G8SYML-TR's DC/DC converter delivers up to 600 mA of continuous output current in PWM mode, as confirmed in the Electrical Characteristics table (DS20005839B-page 5). This rating holds across the full operating temperature range (–40°C to +125°C) and input voltage range (2.7 V to 5.5 V), with efficiency exceeding 90% at 300 mA load under typical conditions. In LOWQ mode, the DC/DC stage is disabled and output current is limited to 60 mA via the internal linear regulator path.
How does the LOWQ mode affect noise performance and power consumption of the MIC2800-G8SYML-TR?
In LOWQ mode (LOWQ pin pulled low), the MIC2800-G8SYML-TR disables its PWM switching stage and regulates output via an internal low-noise linear path, reducing total quiescent current to ≤30 µA and lowering DC/DC output noise to 75 µVRMS (10 Hz–100 kHz). This mode sacrifices maximum output current (limited to 60 mA) for ultra-clean power delivery essential in RF and precision analog applications-verified in Figures 2-10 and 2-26 of the datasheet.
Can the MIC2800-G8SYML-TR support independent power sequencing for its three outputs?
Yes-the MIC2800-G8SYML-TR supports flexible sequencing via dual enable inputs: EN1 controls the DC/DC converter and LDO1 together, while EN2 independently controls LDO2. Combined with the CSET-programmable POR delay, this allows precise ordering-for example, enabling LDO2 first for I/O rail stabilization, then EN1 to activate DC/DC and LDO1 for core voltage-without external timers or logic, as detailed in Section 4.0 and Figure 2-36 of DS20005839B.
What is the purpose of the CSET pin on the MIC2800-G8SYML-TR, and how is it configured?
The CSET pin on the MIC2800-G8SYML-TR is a 1.25 µA current source used to program the Power-on Reset (POR) delay time. Connecting an external capacitor from CSET to SGND sets the POR high-to-low assertion delay in microseconds equal to the capacitor value in picofarads (e.g., 10 nF = 10,000 µs). This enables customizable reset timing for MPU boot sequences, as defined in Equation 3-1 and verified in Figure 2-38 of DS20005839B.
Does the MIC2800-G8SYML-TR require external components for stable operation, and which ones are mandatory?
Yes-the MIC2800-G8SYML-TR requires several mandatory external components: a 2.2 µF ceramic output capacitor on each LDO output (LDO1, LDO2), a 2.2 µF ceramic output capacitor on the DC/DC output, a 4.7 µF ceramic input capacitor across VIN–PGND, a 0.1 µF capacitor from BIAS to SGND, and a 0.1 µF capacitor from CBYP to SGND (recommended for noise reduction). An external inductor (2.2 µH) is also mandatory for DC/DC operation, as specified in Table 1-2 and the Typical Application Circuit on DS20005839B-page 2.
MIC2800-G8SYML-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 16-VFQFN
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Topology:
- Step-Down (Buck) (1), Linear (LDO) (2)
- Number of Outputs:
- 3
- Frequency - Switching:
- 2MHz
- Voltage/Current - Output 1:
- 1.8V, 600mA
- Voltage/Current - Output 2:
- 1.15V, 300mA
- Voltage/Current - Output 3:
- 3.3V, 300mA
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 2.7V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-QFN (3x3)
MIC2800-G8SYML-TR FAQ
1.How can I place an order for MIC2800-G8SYML-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC2800-G8SYML-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC2800-G8SYML-TR reliable?
The price and inventory of MIC2800-G8SYML-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC2800-G8SYML-TR is usually 5 days.
3.What payment methods are accepted for MIC2800-G8SYML-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC2800-G8SYML-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC2800-G8SYML-TR?
MIC2800-G8SYML-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC2800-G8SYML-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC2800-G8SYML-TR?
For technical support, including MIC2800-G8SYML-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC2800-G8SYML-TR requirements.
6.How does Aetrix verify that MIC2800-G8SYML-TR is sourced from the original manufacturer or authorized distributors?
All MIC2800-G8SYML-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC2800-G8SYML-TR meets industry standards.
7.What is the process for return or replacement of MIC2800-G8SYML-TR?
All MIC2800-G8SYML-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC2800-G8SYML-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC2800-G8SYML-TR part is unused and in its original packaging.
Return procedure for MIC2800-G8SYML-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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