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Microchip Technology MIC2800-GFMYML-TR

Part No.:
MIC2800-GFMYML-TR
Manufacturer:
Microchip Technology
Category:
Voltage Regulators - Linear + Switching
Package:
16-VFQFN
Datasheet:
AetrixMIC2800-GFMYML-TR.pdf
Description:
IC REG TRPL BUCK/LNR 2MHZ 16QFN
Quantity:
Payment:
Payment
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Inventory:1,580

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Product details

Overview

MIC2800-GFMYML-TR from Microchip Technology is a digital power management IC integrating a 2 MHz, 600 mA PWM buck converter with two independent 300 mA LDOs (LDO1 and LDO2), an adjustable power-on reset (POR) output, and LOWQ mode for ultra-low-noise light-load operation. It delivers three regulated outputs - DC/DC (adjustable or fixed), LDO1 (fed from DC/DC), and LDO2 (fed from VIN) - with <30 µA total quiescent current in LOWQ mode and 75 µVRMS output noise, targeting embedded MPU core/I/O rail sequencing in battery-powered systems.

For engineers reviewing the MIC2800-GFMYML-TR datasheet, MIC2800-GFMYML-TR pinout, MIC2800-GFMYML-TR application, or MIC2800-GFMYML-TR equivalent, key selection criteria include its triple-output architecture, LOWQ mode's 20–30 µA IQ with 60 mA LDO2 support, 2 MHz fixed-frequency PWM operation, thermal/current protection, and 16-pin 3 mm × 3 mm QFN package with separate SGND/PGND pins for noise-sensitive RF and low-power MCU designs.

Technical Context

The MIC2800-GFMYML-TR implements a dual-mode regulation architecture: full-power PWM mode (LOWQ = high) enables up to 600 mA from the buck stage and 300 mA each from LDO1 and LDO2, while LOWQ mode (LOWQ = low) disables the buck switcher and uses an internal linear regulator to supply up to 60 mA to LDO2 with <75 µVRMS noise and <30 µA total IQ. The device features independent enable controls (EN1 for DC/DC+LDO1, EN2 for LDO2), open-drain POR with programmable delay via CSET capacitor, and separate signal (SGND) and power (PGND) ground paths to minimize coupling between control and switching circuits.

Its functional partitioning supports precise power sequencing: LDO1 derives input from the DC/DC output (enabling efficient 1.8 V → 1.5 V or 1.2 V conversion), LDO2 draws directly from VIN (supporting independent I/O rail generation), and the POR output performs logic-OR monitoring across all three outputs with user-adjustable assertion delay. The BIAS pin powers internal references via a 6 Ω resistor, requiring only a 0.1 µF bypass capacitor, and the LOWQ/POR pins are ESD-protected without clamping diodes - enabling safe interfacing with backup-power-domain host I/Os.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range2.7 V to 5.5 V - supports single-cell Li-ion, USB, or 3.3 V/5 V system rails without external pre-regulation.
DC/DC Output Current600 mA max in PWM mode - sufficient for powering ARM Cortex-A/M cores or FPGA fabric at typical 1.0–1.2 V levels.
LDO1/LDO2 Output Current300 mA each - enables simultaneous supply of MPU I/O banks, DDR termination, or peripheral interfaces.
LOWQ Mode IQ30 µA total - extends battery life in sleep states while maintaining regulated LDO2 output for real-time clock or sensor bias.
Output Noise (LOWQ)75 µVRMS - meets stringent RF front-end and ADC reference requirements without additional filtering.
Switching Frequency2 MHz ±10% - allows use of small 2.2 µH inductors and 2.2 µF ceramic capacitors, minimizing board area.
Thermal Shutdown160 °C with 23 °C hysteresis - prevents damage during sustained overload or poor PCB thermal design.
Junction Temp Range–40 °C to +125 °C - qualified for industrial and automotive under-hood applications.

Pinout & Package

The MIC2800-GFMYML-TR is housed in a 16-pin, 3 mm × 3 mm, 0.5 mm pitch QFN package with exposed thermal pad (pin 16 is LOWQ, not thermal pad). It features physically separated SGND (pin 3) and PGND (pin 4) pins to isolate analog control ground from high-current switching return paths, critical for noise-sensitive applications.

Pin/TerminalCircuit RoleDesign Meaning
LOWQ (Pin 1)Mode select inputActive-low control: LOW = ultra-low-noise linear mode (20–30 µA IQ); HIGH = full-power 2 MHz PWM mode (600 mA DC/DC).
BIAS (Pin 2)Internal bias supplyPowers reference and control circuitry via internal 6 Ω resistor; requires 0.1 µF ceramic bypass to SGND for stability.
SGND (Pin 3)Signal groundReturn path for BIAS, FB, CSET, POR, EN1/EN2 - must be routed separately from PGND to avoid noise injection into error amplifier.
PGND (Pin 4)Power groundHigh-current return for SW node and LDO2 - connects to VIN decoupling capacitor and inductor ground to minimize EMI.
SW (Pin 5)Switch nodeDrives external 2.2 µH inductor; high dv/dt node requiring short, shielded routing away from sensitive analog traces.
VIN (Pins 6 & 7)Main supply inputsDual VIN pins must be tied together externally; supply DC/DC switcher and LDO2; require ≥4.7 µF ceramic bypass to PGND.
LDO2 (Pin 8)LDO2 output300 mA regulated output referenced to VIN; minimum 2.2 µF ceramic output capacitor required for stability.
FB (Pin 9)DC/DC feedbackConnects to DC/DC output for fixed-voltage versions; enables precision output voltage setting via external resistor divider for adjustable variants.
LDO (Pin 10)LOWQ mode outputSupplies LDO1 in PWM mode; becomes active output in LOWQ mode - must connect to DC/DC output node (VOUT).
LDO1 (Pin 11)LDO1 output300 mA output powered by DC/DC or LDO pin; ideal for low-noise 1.5 V/1.2 V core rails; requires 2.2 µF ceramic output capacitor.
POR (Pin 12)Open-drain reset flagAsserts low if any output (DC/DC, LDO1, LDO2) falls out of regulation; delay programmable via CSET capacitor (1 µs/pF).
CSET (Pin 13)POR delay programming1.25 µA current source charges external capacitor to set POR high-to-low delay; open = ~100 ns minimum delay.
CBYP (Pin 14)Reference bypassConnect 0.1 µF ceramic to SGND to reduce output noise and improve PSRR; optional but recommended for RF applications.
EN1 (Pin 15)DC/DC + LDO1 enableActive-high CMOS input (VIH ≥1.0 V); controls both buck converter and LDO1; floating prohibited.
EN2 (Pin 16)LDO2 enableActive-high CMOS input (VIH ≥1.0 V); independent control of LDO2; enables flexible power sequencing with EN1.

Key Features

FeatureDesign Value
Triple-output PMIC architectureIntegrates one 600 mA buck + two 300 mA LDOs in single 3×3 mm QFN - reduces BOM count and layout complexity vs. discrete solutions.
LOWQ ultra-low-noise modeReduces total IQ to ≤30 µA while delivering clean 75 µVRMS output - eliminates need for post-regulation LDOs in sleep-state RF or sensor bias rails.
Independent enable controlEN1 (DC/DC+LDO1) and EN2 (LDO2) allow precise sequencing of core, I/O, and backup rails - critical for SAMA5D2 and similar MPUs.
Programmable POR with logic-OR monitoringCSET-programmable delay (up to 1 s) and open-drain output monitor all three outputs simultaneously - simplifies system-level reset management.
Separate SGND/PGND pinsPrevents switching noise from corrupting feedback, POR, or enable signals - improves regulation accuracy and transient response in mixed-signal systems.
Backup-power-safe I/O pinsLOWQ and POR pins lack supply-rail clamping diodes - enables direct connection to host GPIOs powered by coin-cell or supercap backup supplies without leakage.

Applications

Embedded MPU Power SequencingLow-Power Wearable RF Systems

Use Scenario: Powering ARM-based SAMA5D2 MPU with independent core (1.1 V), DDR I/O (1.8 V), and peripheral (2.8 V) rails.

IC Role / Device Role / Timing Role: MIC2800-GFMYML-TR provides sequenced DC/DC (core), LDO1 (DDR), and LDO2 (peripherals) with POR flag ensuring all rails stabilize before processor release.

Use Value: Eliminates need for external sequencer IC and reduces component count by consolidating three regulators with integrated monitoring.

Use Scenario: Supplying BLE/Wi-Fi SoC transceivers requiring ultra-low-noise 1.8 V LDO2 rail during receive mode and high-efficiency 3.3 V DC/DC during transmit bursts.

IC Role / Device Role / Timing Role: MIC2800-GFMYML-TR switches between LOWQ mode (75 µVRMS noise, 30 µA IQ) for RX sensitivity and PWM mode (600 mA, >90% efficiency) for TX power delivery.

Use Value: Achieves >10 dB improvement in receiver SNR vs. PFM-mode converters while maintaining >90% efficiency at full load.

Industrial Backup Power SystemsPortable Medical Sensor Nodes

Use Scenario: Maintaining RTC, SRAM, and sensor bias during main power failure using coin-cell backup connected to LDO2.

IC Role / Device Role / Timing Role: MIC2800-GFMYML-TR's LOWQ mode draws <30 µA from backup source while sustaining regulated 2.8 V LDO2 output; POR remains valid even when main VIN is removed.

Use Value: Enables seamless failover without external diode-ORing or level-shifting, thanks to clamping-diode-free LOWQ/POR pins.

Use Scenario: Powering ECG/PPG analog front-ends and low-power microcontroller in disposable patch monitors.

IC Role / Device Role / Timing Role: MIC2800-GFMYML-TR delivers 1.2 V LDO1 (for ADC reference) and 3.3 V LDO2 (for op-amps) with <30 µVRMS noise, while DC/DC powers MCU in active mode.

Use Value: Meets clinical-grade noise requirements (<5 µVpp) for biopotential acquisition without adding discrete low-noise LDOs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-rail power management applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS65023BRSBRTriple-output PMIC with 600 mA buck + two 600 mA LDOs; no LOWQ mode; fixed 2.25 MHz switching; requires external POR timing components.Higher LDO current capability but lacks ultra-low-noise light-load mode - unsuitable for RF sleep-state or medical sensor bias where 75 µVRMS noise is mandatory.Select TPS65023BRSBR only when higher LDO2 current (>300 mA) is needed and LOWQ noise performance is not required.
MAX20029ATGB/V+T2.2 MHz buck + dual LDO PMIC; includes spread-spectrum clocking and AEC-Q100 qualification; no programmable POR delay; 40 µA IQ in low-power mode.Automotive-qualified with enhanced EMI control, but 40 µA IQ and absence of LOWQ's 75 µVRMS noise limit suitability for portable RF or medical applications.Choose MAX20029ATGB/V+T for automotive infotainment or ADAS modules where AEC-Q100 compliance and spread spectrum are prioritized over sub-30 µA IQ.

Compared with TPS65023BRSBR and MAX20029ATGB/V+T, the MIC2800-GFMYML-TR uniquely combines <30 µA LOWQ IQ, 75 µVRMS noise, and CSET-programmable POR delay in a 3×3 mm footprint - making it optimal for space-constrained, battery-operated systems demanding both ultra-low sleep current and RF-grade cleanliness.

Availability

MIC2800-GFMYML-TR is available at Aetrix Electronics and suitable for embedded MPU power sequencing, low-power wearable RF systems, and industrial backup power applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for MIC2800-GFMYML-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a leading provider of microcontrollers, analog devices, and power management ICs, serving industrial, automotive, and consumer markets with high-reliability semiconductor solutions.

The MIC2800 product line delivers compact, highly integrated power management ICs optimized for battery-powered embedded systems requiring precise multi-rail sequencing, ultra-low sleep current, and RF-clean operation - particularly for ARM-based MPUs and wireless sensor nodes.

FAQ

What is the function of the LOWQ pin on the MIC2800-GFMYML-TR?

The LOWQ pin on the MIC2800-GFMYML-TR is an active-low mode control input that selects between full-power PWM operation (LOWQ = high) and ultra-low-noise linear regulation (LOWQ = low). In LOWQ mode, the buck converter is disabled, reducing total quiescent current to ≤30 µA while delivering up to 60 mA from LDO2 with 75 µVRMS output noise - critical for RF receive and sensor bias applications. The MIC2800-GFMYML-TR's LOWQ pin has no clamping diodes to VIN, enabling safe interface with backup-power-domain host I/Os.

How does the POR output of the MIC2800-GFMYML-TR behave during power-up and fault conditions?

The POR output of the MIC2800-GFMYML-TR is an open-drain signal that asserts low if any of the three regulated outputs (DC/DC, LDO1, or LDO2) falls outside regulation. Its high-to-low transition is immediate upon undervoltage detection, while the low-to-high transition is delayed by a user-programmable time set via a capacitor on the CSET pin (1 µs per pF, up to ~1 s). During normal operation, POR remains high only when all enabled outputs are within specification. The MIC2800-GFMYML-TR's POR pin is ESD-protected without clamping diodes, allowing pull-up to backup supplies.

Can the MIC2800-GFMYML-TR support independent power sequencing of its three outputs?

Yes, the MIC2800-GFMYML-TR supports independent sequencing via EN1 (controls DC/DC and LDO1) and EN2 (controls LDO2 only), enabling staggered turn-on of core, I/O, and peripheral rails. The POR output provides system-level status monitoring across all outputs, and the CSET pin allows adjustment of the POR assertion delay to match MPU reset timing requirements. This makes the MIC2800-GFMYML-TR suitable for complex sequencing in SAMA5D2 and similar MPUs without external controllers.

What are the grounding requirements for optimal noise performance of the MIC2800-GFMYML-TR?

The MIC2800-GFMYML-TR requires strict separation of SGND (pin 3) and PGND (pin 4) to achieve specified noise and PSRR performance. SGND serves as the return path for low-current analog circuitry (BIAS, FB, CSET, POR, EN1/EN2), while PGND handles high-current switching return (SW, VIN, LDO2). These grounds must be connected at a single point near the device's thermal pad or via a dedicated star ground - never routed as a shared plane. Failure to isolate SGND/PGND degrades LOWQ mode noise below the guaranteed 75 µVRMS and compromises POR accuracy. The MIC2800-GFMYML-TR's layout guidelines mandate this separation.

What is the maximum output current capability of LDO1 and LDO2 in LOWQ mode on the MIC2800-GFMYML-TR?

In LOWQ mode (LOWQ = low), the MIC2800-GFMYML-TR disables the buck converter and relies on an internal linear regulator to supply LDO2. LDO2 can deliver up to 60 mA in this mode, while LDO1 is disabled. The datasheet explicitly states "LOWQ mode also limits the output load of both LDO1 and LDO2 to 10 mA" only when both are active - but LDO1 is inactive in LOWQ mode due to loss of its input source (the DC/DC output). Therefore, the MIC2800-GFMYML-TR's LDO2 supports 60 mA in LOWQ mode, and LDO1 is not operational. This configuration ensures minimal IQ while maintaining a clean, low-noise backup rail.

MIC2800-GFMYML-TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
16-VFQFN
Packaging:
Tape & Reel (TR)
Product Status:
Active
Topology:
Step-Down (Buck) (1), Linear (LDO) (2)
Number of Outputs:
3
Frequency - Switching:
2MHz
Voltage/Current - Output 1:
1.8V, 600mA
Voltage/Current - Output 2:
1.5V, 300mA
Voltage/Current - Output 3:
2.8V, 300mA
w/LED Driver:
No
w/Supervisor:
No
w/Sequencer:
No
Voltage - Supply:
2.7V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (3x3)

MIC2800-GFMYML-TR FAQ

1.How can I place an order for MIC2800-GFMYML-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MIC2800-GFMYML-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIC2800-GFMYML-TR reliable?

The price and inventory of MIC2800-GFMYML-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC2800-GFMYML-TR is usually 5 days.

3.What payment methods are accepted for MIC2800-GFMYML-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC2800-GFMYML-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIC2800-GFMYML-TR?

MIC2800-GFMYML-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIC2800-GFMYML-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIC2800-GFMYML-TR?

For technical support, including MIC2800-GFMYML-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC2800-GFMYML-TR requirements.

6.How does Aetrix verify that MIC2800-GFMYML-TR is sourced from the original manufacturer or authorized distributors?

All MIC2800-GFMYML-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC2800-GFMYML-TR meets industry standards.

7.What is the process for return or replacement of MIC2800-GFMYML-TR?

All MIC2800-GFMYML-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC2800-GFMYML-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIC2800-GFMYML-TR part is unused and in its original packaging.

Return procedure for MIC2800-GFMYML-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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