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Microchip Technology MIC2810-4GSYML-TR
- Part No.:
- MIC2810-4GSYML-TR
- Manufacturer:
- Microchip Technology
- Category:
- Voltage Regulators - Linear + Switching
- Package:
- 16-VQFN Exposed Pad, 16-MLF®
- Datasheet:
-
MIC2810-4GSYML-TR.pdf
- Description:
- IC REG TRPL BUCK/LNR 2MHZ 16MLF
- Quantity:
- Payment:
- Shipping:
Inventory:265
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Product details
Overview
MIC2810-4GSYML-TR from Microchip Technology is a digital power management IC integrating a 2 MHz, 600 mA DC/DC buck converter and two independent 300 mA LDOs (1.2 V, 1.8 V, 3.3 V outputs), with LOWQ ultra-low-noise light-load mode, integrated POR with programmable delay, and thermal/current protection. It delivers stable multi-rail power for embedded MPU subsystems requiring low quiescent current and RF-clean operation.
For engineers reviewing the MIC2810-4GSYML-TR datasheet, MIC2810-4GSYML-TR pinout, MIC2810-4GSYML-TR application, or MIC2810-4GSYML-TR equivalent, key selection criteria include its 30 µA total IQ in LOWQ mode, 53 µVRMS DC/DC output noise, dual 300 mA LDOs with 0.8 V minimum output, 16-pin 3 mm × 3 mm QFN package, and independent enable control per regulator channel.
Technical Context
The MIC2810-4GSYML-TR implements a dual-mode DC/DC architecture: PWM mode (2 MHz, up to 600 mA, >90% efficiency) and LOWQ linear-regulator mode (30 µA IQ, 53 µVRMS noise, 60 mA max). Its three regulated outputs-DC/DC (1.2 V), LDO1 (1.8 V), and LDO2 (3.3 V)-feature independent EN pins and share no internal voltage coupling.
LOWQ mode disables the PWM switch (SW pin becomes high-impedance), routes DC/DC output through the LDO pin, and reduces LDO1/LDO2 current limits to <50 mA. The POR output performs logic-OR monitoring across all three outputs and supports backup-power-safe open-drain interfacing via ESD-isolated design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | VIN/VIN2: 2.7–5.5 V; VIN1: 1.65–5.5 V - enables direct Li-ion or 3.3 V system rail powering of LDO1 while maintaining full DC/DC/LDO2 operation. |
| DC/DC Output | 1.2 V @ 600 mA (PWM) / 60 mA (LOWQ) - fixed output per part number; supports core logic and memory rails with minimal external components. |
| LDO Outputs | LDO1 = 1.8 V @ 300 mA; LDO2 = 3.3 V @ 300 mA - independent input domains (VIN1/VIN2) allow flexible sequencing and source isolation. |
| Quiescent Current | 30 µA total in LOWQ mode - enables >1-year battery life in always-on wearable sensors without compromising POR or sequencing integrity. |
| Output Noise | 53 µVRMS (DC/DC, LOWQ mode, 10 Hz–100 kHz) - 10× lower than typical PFM-mode converters, preventing interference in sub-GHz RF receivers. |
| POR Delay | Programmable via CSET capacitor (1 µs/pF, up to 1 s) - ensures reliable power sequencing across multiple enable transitions in complex SoC boot flows. |
| Package | 16-pin 3 mm × 3 mm QFN, 0.85 mm height - surface-mount footprint compatible with high-density portable PCB layouts and automated assembly. |
Pinout & Package
Package: 16-pin, 3 mm × 3 mm, 0.85 mm height, leadless QFN with exposed thermal pad (PGND-connected). Pin 1 marked by dot/delta; SGND and PGND are separate ground planes for signal integrity and thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (LOWQ) | Mode select input | Active-low control: LOW = 30 µA IQ, 60 mA LDO-fed DC/DC output; HIGH = 2 MHz PWM, 600 mA capability; must not float. |
| 2 (BIAS) | Bias supply input | Powers internal reference/control circuitry via internal 6 Ω resistor; requires 0.1 µF ceramic bypass to SGND. |
| 3 (SGND) | Signal ground | Reference return for BIAS, POR, CSET, and enable logic; must be routed separately from PGND to avoid noise coupling. |
| 4 (PGND) | Power ground | High-current return path for DC/DC switch node (SW); connects to thermal pad; requires low-inductance plane under device. |
| 5 (SW) | Switch node output | Drives external inductor in PWM mode; high dv/dt node - must be short, shielded, and远离 sensitive analog traces. |
| 6 (VIN) | Main input supply | Primary input for DC/DC controller, reference, and shared bias; tied to PIN 7 (VIN2) per layout guidance. |
| 7 (VIN2) | LDO2 input supply | Input for 3.3 V LDO2; must be connected to PIN 6 (VIN) - no independent sourcing allowed. |
| 8 (LDO2) | LDO2 regulated output | 3.3 V @ 300 mA output; requires ≥2.2 µF X7R/X5R ceramic capacitor to PGND for stability. |
| 9 (LDO) | LOWQ mode DC/DC output | Connects to DC/DC output node; used only in LOWQ mode to deliver 1.2 V via LDO path; not used in PWM mode. |
| 10 (VIN1) | LDO1 input supply | Input for 1.8 V LDO1; supports down to 1.65 V - enables partial powering from auxiliary rails or partially discharged batteries. |
| 11 (LDO1) | LDO1 regulated output | 1.8 V @ 300 mA output; requires ≥2.2 µF X7R/X5R ceramic capacitor to PGND; independent from LDO2 domain. |
| 12 (POR) | Open-drain reset output | Asserts low if any output (DC/DC, LDO1, LDO2) falls below 90% nominal; ESD-isolated for backup-domain interfacing. |
| 13 (CSET) | POR delay timing input | 1.25 µA current source charges external capacitor to set POR assertion delay (1 µs/pF); cannot be grounded. |
| 14 (EN1) | LDO1 enable input | Active-high CMOS input (VIH ≥ 1.0 V); controls LDO1 independently; floating prohibited. |
| 15 (EN) | DC/DC enable input | Active-high CMOS input (VIH ≥ 1.0 V); enables/disables PWM regulator; tri-states SW when disabled. |
| 16 (EN2) | LDO2 enable input | Active-high CMOS input (VIH ≥ 1.0 V); controls LDO2 independently; floating prohibited. |
Key Features
| Feature | Design Value |
|---|---|
| LOWQ ultra-low-noise mode | Reduces total IQ to 30 µA while delivering clean 1.2 V output with 53 µVRMS noise - eliminates PFM ripple that disrupts RF/analog circuits. |
| Independent triple-output control | Separate EN, EN1, EN2 pins allow precise power-up/down sequencing of 1.2 V DC/DC, 1.8 V LDO1, and 3.3 V LDO2 for SoC and FPGA applications. |
| Backup-power-safe POR | ESD-isolated open-drain POR output interfaces directly to host I/Os powered by backup rails - zero parasitic leakage when main supply is off. |
| Thermal and current protection | Integrated thermal shutdown (160°C) and cycle-by-cycle current limiting (1.6 A PWM / 190 mA LOWQ) prevent damage during overload or poor heatsinking. |
| Small-footprint power solution | Single 3 mm × 3 mm QFN replaces discrete buck + dual LDOs + POR IC - saves >25 mm² board area and reduces BOM count by 4+ components. |
Applications
| Embedded MPU Power | Wearable Sensor Hub |
|---|---|
|
Use Scenario: Powering ARM Cortex-A/M series processors with split-rail requirements (core 1.2 V, I/O 1.8 V, peripheral 3.3 V). IC Role / Device Role / Timing Role: Primary multi-rail PMIC providing sequenced, monitored, and protected voltage domains for SoC boot and runtime. Use Value: Enables single-chip power delivery with POR coordination and LOWQ mode extending battery life during idle/sleep states without sacrificing RF coexistence. |
Use Scenario: Compact health-monitoring patch with BLE radio, accelerometer, and optical sensor operating from coin cell. IC Role / Device Role / Timing Role: Central power manager delivering 1.2 V (BLE MCU), 1.8 V (sensor interface), and 3.3 V (LED driver) with ultra-low IQ. Use Value: 30 µA LOWQ IQ extends usable battery life beyond 12 months; 53 µVRMS noise prevents BLE packet loss in crowded 2.4 GHz environments. |
| Low-Power RF Transceiver | Industrial Backup Power System |
|
Use Scenario: Sub-GHz wireless sensor node (e.g., LoRaWAN endpoint) requiring clean 1.2 V supply for RF front-end and 3.3 V for microcontroller. IC Role / Device Role / Timing Role: Dual-mode regulator supplying low-noise DC/DC output to RF IC while powering MCU via LDO2. Use Value: LOWQ mode suppresses switching noise below RF receiver sensitivity floor; independent LDO2 enables fast wake-from-sleep without DC/DC re-start delay. |
Use Scenario: Smart meter with primary AC-DC supply and supercapacitor backup maintaining real-time clock and communication during outages. IC Role / Device Role / Timing Role: Sequencing supervisor and backup rail conditioner - POR monitors main outputs and asserts reset during brownout. Use Value: ESD-isolated POR pin connects directly to backup domain I/Os; CSET-programmable delay ensures deterministic reset hold time across voltage sag profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar multi-output PMIC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIC2820-4GSYML-TR | Same pinout and feature set but adds I²C interface for dynamic voltage scaling and telemetry; higher BOM cost and firmware overhead. | Required where adaptive DVFS or real-time rail monitoring is needed; overkill for fixed-voltage, sequenced-only use cases. | Select MIC2820-4GSYML-TR only if closed-loop voltage control or telemetry reporting is required; otherwise MIC2810-4GSYML-TR offers simpler, lower-cost implementation. |
| TPS65023BRSBR | 3-output PMIC (2 buck + 1 LDO), 2.7–5.5 V input, but no LOWQ mode; 80 µA IQ in lowest power state; 100 µVRMS noise. | Lacks ultra-low-noise light-load capability - unsuitable for RF-sensitive applications requiring sub-100 µVRMS noise at light loads. | Choose TPS65023BRSBR for cost-sensitive industrial applications without RF coexistence constraints; MIC2810-4GSYML-TR remains preferred for wearable/RF designs. |
Compared with MIC2820-4GSYML-TR, the MIC2810-4GSYML-TR provides identical power performance at lower system complexity and cost, while compared with TPS65023BRSBR, it delivers 50% lower output noise and 62% lower quiescent current - critical for battery-powered RF systems.
Availability
MIC2810-4GSYML-TR is available at Aetrix Electronics and suitable for embedded MPU power, wearable sensor hubs, low-power RF transceivers, and industrial backup power systems requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for MIC2810-4GSYML-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog devices, and power management ICs, serving automotive, industrial, consumer, and communications markets with high-reliability semiconductor solutions.
The MIC2810 product line delivers highly integrated, low-noise multi-rail power management for space-constrained, battery-operated systems - specifically engineered to replace discrete buck + dual LDO solutions while enabling robust sequencing and RF-clean operation.
FAQ
What output voltages does the MIC2810-4GSYML-TR provide?
The MIC2810-4GSYML-TR provides three fixed output voltages: 1.2 V from the DC/DC converter, 1.8 V from LDO1, and 3.3 V from LDO2. These values are laser-trimmed at wafer test and are not adjustable. The part number suffix "4GS" explicitly denotes this 1.2 V / 1.8 V / 3.3 V configuration per Microchip's Product Identification System.
How does the LOWQ mode affect the DC/DC converter and LDO outputs in MIC2810-4GSYML-TR?
In LOWQ mode (LOWQ pin ≤ 0.2 V), the MIC2810-4GSYML-TR disables the PWM switch, routes the 1.2 V DC/DC output through the LDO pin using internal linear regulation, and reduces LDO1/LDO2 current limits to <50 mA. Total quiescent current drops to 30 µA, and DC/DC output noise falls to 53 µVRMS - ideal for RF-silent standby operation.
Can the POR output of MIC2810-4GSYML-TR interface directly with a backup power domain?
Yes. The POR output of MIC2810-4GSYML-TR is ESD-isolated with no clamping diodes to VIN, allowing safe connection to host I/Os powered by backup rails (e.g., coin cell or supercapacitor). This prevents parasitic leakage when main power is removed - a key design feature confirmed in Section 3.10 of the datasheet.
What is the recommended output capacitance for each regulator in MIC2810-4GSYML-TR?
All three outputs of MIC2810-4GSYML-TR require ≥2.2 µF ceramic capacitors for stability: 2.2 µF on DC/DC (SW-to-PGND), 2.2 µF on LDO1 (LDO1-to-PGND), and 2.2 µF on LDO2 (LDO2-to-PGND). X7R or X5R dielectrics are mandatory; Z5U/Y5V types are excluded due to excessive capacitance drift over temperature.
Does MIC2810-4GSYML-TR support independent input supplies for its LDOs?
Yes. MIC2810-4GSYML-TR supports independent input domains: VIN1 (1.65–5.5 V) powers LDO1, while VIN2 (2.7–5.5 V) powers LDO2. Although VIN2 must be tied to VIN per layout guidelines, VIN1 may be sourced from a separate low-voltage rail - enabling partial operation during brownout or battery discharge.
MIC2810-4GSYML-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 16-VQFN Exposed Pad, 16-MLF®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Topology:
- Step-Down (Buck) (1), Linear (LDO) (2)
- Number of Outputs:
- 3
- Frequency - Switching:
- 2MHz
- Voltage/Current - Output 1:
- 1.2V, 600mA
- Voltage/Current - Output 2:
- 1.8V, 300mA
- Voltage/Current - Output 3:
- 3.3V, 300mA
- w/LED Driver:
- No
- w/Supervisor:
- No
- w/Sequencer:
- No
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-MLF® (4x4)
MIC2810-4GSYML-TR FAQ
1.How can I place an order for MIC2810-4GSYML-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC2810-4GSYML-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC2810-4GSYML-TR reliable?
The price and inventory of MIC2810-4GSYML-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC2810-4GSYML-TR is usually 5 days.
3.What payment methods are accepted for MIC2810-4GSYML-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC2810-4GSYML-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC2810-4GSYML-TR?
MIC2810-4GSYML-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC2810-4GSYML-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC2810-4GSYML-TR?
For technical support, including MIC2810-4GSYML-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC2810-4GSYML-TR requirements.
6.How does Aetrix verify that MIC2810-4GSYML-TR is sourced from the original manufacturer or authorized distributors?
All MIC2810-4GSYML-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC2810-4GSYML-TR meets industry standards.
7.What is the process for return or replacement of MIC2810-4GSYML-TR?
All MIC2810-4GSYML-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC2810-4GSYML-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC2810-4GSYML-TR part is unused and in its original packaging.
Return procedure for MIC2810-4GSYML-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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