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Microchip Technology MIC2870YFT-T5
- Part No.:
- MIC2870YFT-T5
- Manufacturer:
- Microchip Technology
- Category:
- LED Drivers
- Package:
- 16-UFQFN Exposed Pad
- Datasheet:
-
MIC2870YFT-T5.pdf
- Description:
- IC LED DRV RGLTR I2C 1.5A 16TQFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,104
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Product details
Overview
MIC2870YFT-T5 from Microchip Technology is a 1.5A synchronous boost flash LED driver IC designed for dual-channel white LED camera flash applications in mobile handsets. It operates from 2.7V to 5.0V input, delivers up to 750 mA per channel with ±10% current accuracy and <5% channel matching, features 2 MHz adaptive switching, true load disconnect, and I²C interface supporting up to 3.4 MHz clock rate - enabling precise control of flash/torch modes in smartphone image capture systems.
For engineers reviewing the MIC2870YFT-T5 datasheet, MIC2870YFT-T5 pinout, MIC2870YFT-T5 application, or MIC2870YFT-T5 equivalent, this device serves as a high-efficiency, thermally robust solution for battery-powered camera flash subsystems requiring programmable current, safety timers, overvoltage protection, and GSM pulse-synchronized flash inhibit functionality.
Technical Context
The MIC2870YFT-T5 integrates a 2 MHz synchronous boost converter with internal NMOS/PMOS power switches (RON ≤ 80 mΩ), delivering regulated output voltage up to 5.38 V while maintaining high efficiency across 2.7–5.0 V input range. Its dual-current-sink architecture supports independent Flash and Torch mode operation via hardware pins (FEN/TEN/FI) or I²C register control (01h/02h), with soft-start, auto-discharge, and real-time open/short-circuit detection on both LED channels.
Functional safety is enforced through multiple layers: flash timeout (1.25 s), overtemperature shutdown (160°C), overvoltage protection (5.38 V threshold), UVLO (2.5 V rising), and dedicated LED fault recovery logic with 100 ms retry intervals. Current programming uses FRSET/TRSET pins with 10 kΩ resistors setting 750 mA (Flash) and 187.5 mA (Torch) per channel respectively.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.0 V - compatible with single-cell Li-ion/Li-poly battery systems without external LDO. |
| Max Output Current | 1.5 A total (750 mA × 2 channels) - supports dual-LED flash illumination with automatic current matching. |
| Switching Frequency | 2.0 MHz typical - enables use of compact 1 µH inductor and 2.2 µF ceramic output capacitor. |
| I²C Interface Speed | Up to 3.4 MHz - supports high-speed camera functions including auto-focus, white balance, and burst flash timing. |
| Shutdown Current | 0.6 µA - minimizes battery drain during standby in always-on mobile devices. |
| Operating Junction Temp | –40°C to +125°C - qualified for harsh thermal environments inside sealed handset enclosures. |
| OVP Threshold | 5.38 V - protects internal circuitry and LEDs from overvoltage damage during transient conditions. |
| Current Accuracy | ±10% per channel - ensures consistent brightness and color rendering across production units. |
Pinout & Package
Package: 16-pin, 2 mm × 2 mm TQFN with exposed thermal pad (ePAD), rated θJA = 80°C/W.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 SCL | I²C Clock Input | High-speed (3.4 MHz) clock line requiring 4.7 kΩ pull-up; synchronizes register writes for flash/torch control. |
| 2 VIN | Main Power Input | Accepts 2.7–5.0 V battery supply; requires ≥4.7 µF low-ESR ceramic capacitor to PGND for stability. |
| 3 FEN | Flash Enable Input | Rising-edge triggered hardware control for Flash mode; internally pulled down if floating. |
| 4 FI | Flash Inhibit Input | Active-high signal that forces Flash current down to Torch level during GSM pulse off-time to reduce battery droop. |
| 5 FRSET | Flash Current Programming | Resistor-to-AGND sets max Flash current (e.g., 10 kΩ → 750 mA/channel); not floatable. |
| 6 AGND | Analog Ground Reference | Reference for FRSET/TRSET biasing; must be separated from PGND and connected at single point. |
| 7,15 PGND | Power Ground | Return path for boost switch currents and LED sink paths; connects internally to ePAD for thermal conduction. |
| 8 TRSET | Torch Current Programming | Resistor-to-AGND sets max Torch current (e.g., 10 kΩ → 187.5 mA/channel); not floatable. |
| 9 LED2 | Channel 2 LED Cathode Sink | Current sink output for second WLED; voltage monitored for open/short detection (15–40 mV threshold). |
| 10 LED1 | Channel 1 LED Cathode Sink | Current sink output for first WLED; matched to LED2 within ±5% under identical conditions. |
| 11 TEN | Torch Enable Input | Rising-edge triggered hardware control for Torch mode; internally pulled down if floating. |
| 12 OUT | Boost Converter Output | Regulated high-voltage node connected to LED anodes; requires ≥2.2 µF ceramic capacitor to PGND. |
| 13 EN | Global Enable | Active-high enable; driving low >1 s shuts down IC; also controllable via I²C Master Control register. |
| 14 SW | Switch Node | Connection to internal NMOS/PMOS switches; routes high-frequency inductor current; sensitive to layout parasitics. |
| 16 SDA | I²C Data I/O | Open-drain bidirectional data line requiring 4.7 kΩ pull-up; supports readback of status registers. |
| EP ePAD | Thermal Pad | Internally tied to PGND; must be soldered to PCB ground plane for thermal performance and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| True Load Disconnect | Internal NMOS discharge path (RDCHG = 160 Ω) actively pulls OUT to PGND when disabled, eliminating residual LED glow. |
| Flash Safety Time-out | Fixed 1.25 s shutdown timer prevents thermal runaway during extended Flash activation - critical for handheld safety compliance. |
| Dual-Mode Programmability | Independent Flash (750 mA/ch) and Torch (187.5 mA/ch) current levels set via external resistors or I²C register scaling (0–100%). |
| GSM Pulse Synchronization | FI pin allows dynamic current reduction during RF transmission bursts, minimizing battery voltage sag and preventing system reset. |
| Robust Fault Protection | Integrated open-circuit (15–40 mV), short-circuit (400–800 mV), overvoltage (5.38 V), and overtemperature (160°C) detection with auto-retry logic. |
| High-Efficiency Boost Architecture | 2 MHz switching with ≤80 mΩ RON switches achieves >90% efficiency at 3.6 V input / 1.5 A output, reducing thermal load in space-constrained modules. |
Applications
| Smartphone Dual-LED Flash Module | Mobile Handset Torch Lighting |
|---|---|
|
Use Scenario: High-resolution rear-camera flash requiring synchronized dual-LED illumination for uniform beam pattern and reduced hotspots. IC Role / Device Role / Timing Role: Dual-channel synchronous boost driver delivering matched 750 mA currents with <5% inter-channel mismatch and 1.25 s safety timeout. Use Value: Enables consistent color temperature and luminance across production units while meeting IEC 62471 photobiological safety limits. |
Use Scenario: Always-on video light for front-facing camera during video calls or live streaming in low-light conditions. IC Role / Device Role / Timing Role: Precision current sink operating in Torch mode with adjustable 187.5 mA/channel via TRSET resistor or I²C scaling. Use Value: Delivers stable, flicker-free illumination with <±10% current accuracy and zero residual glow due to true load disconnect. |
| Camera Phone Auto-Focus Assist | Compact Digital Camera Flash |
|
Use Scenario: Short-duration IR/visible assist light used during phase-detection auto-focus acquisition before full flash activation. IC Role / Device Role / Timing Role: Fast-turn-on boost regulator with soft-start and sub-100 µs response time controlled via I²C register write to address 01h. Use Value: Reduces focus acquisition latency by eliminating mechanical shutter delay and enabling pre-flash sequencing. |
Use Scenario: Low-volume portable digital camera requiring reliable flash performance with minimal BOM count and board area. IC Role / Device Role / Timing Role: Single-chip flash driver supporting both 1.5 A single-LED and 750 mA × 2 configurations with integrated OVP and thermal shutdown. Use Value: Eliminates need for discrete MOSFETs, current sense resistors, and protection ICs - reduces total solution size by >40%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar flash LED driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| RT8546GQW | Single-channel 1.2 A flash driver; no I²C interface; analog-only control via EN/FB pins; lacks flash inhibit and safety timer. | Suitable for cost-sensitive single-LED torch-only designs without GSM sync or programmable flash duration. | Select when I²C control, dual-channel matching, or flash safety timeout are not required. |
| TPS61310DSKR | 1.2 A boost WLED driver with I²C but only single-channel output; no dedicated FI pin; lower max input voltage (4.5 V). | Applicable for mid-tier smartphones where dual-LED matching and GSM pulse synchronization are secondary priorities. | Choose if board space allows separate drivers per LED and 4.5 V max input suffices for battery aging margin. |
Compared with RT8546GQW and TPS61310DSKR, the MIC2870YFT-T5 uniquely combines dual-channel current matching, GSM-synchronized flash inhibit, 1.25 s safety timer, and 5.0 V input support - making it the only option qualified for flagship smartphone flash subsystems demanding full feature parity and thermal reliability.
Availability
MIC2870YFT-T5 is available at Aetrix Electronics and suitable for smartphone camera modules, mobile handset lighting systems, and portable imaging equipment requiring stable component supply, long-term lifecycle assurance, and traceable sourcing for consumer electronics production.
Supply support for MIC2870YFT-T5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and power management ICs, serving automotive, industrial, and consumer markets with ISO 9001-certified manufacturing and global distribution.
The MIC2870YFT-T5 belongs to Microchip's high-efficiency LED driver product line, engineered specifically for battery-powered mobile imaging applications requiring precision current regulation, multi-mode flexibility, and robust fault protection in ultra-compact packages.
FAQ
What is the maximum continuous LED current supported by the MIC2870YFT-T5 in dual-channel configuration?
The MIC2870YFT-T5 supports up to 750 mA per channel continuously in dual-channel Flash mode, with automatic current matching within ±5%. When configured for single-LED operation using both channels in parallel, it delivers up to 1.5 A total current. This capability is validated across –40°C to +125°C junction temperature range with appropriate thermal design using the ePAD.
How does the Flash Inhibit (FI) function work in the MIC2870YFT-T5, and what is its primary design purpose?
The FI pin in the MIC2870YFT-T5 dynamically reduces Flash-mode LED current to Torch-mode level when asserted high, enabling synchronization with GSM transmit pulse off-times. Its primary purpose is to prevent excessive battery voltage droop during RF transmission - a critical requirement for cellular handset compliance. The function remains active whether Flash mode is initiated via FEN or I²C register control.
Can the MIC2870YFT-T5 operate without external resistors on FRSET and TRSET pins?
Yes - grounding FRSET configures MIC2870YFT-T5 for default Flash current of 750 mA per channel, and grounding TRSET sets default Torch current of 187.5 mA per channel. However, neither pin may be left floating; both require either a grounded connection or a resistor (≤80 kΩ) to AGND. Floating these pins violates absolute maximum ratings and risks undefined behavior.
What thermal management provisions are built into the MIC2870YFT-T5 package?
The MIC2870YFT-T5 uses a 2 mm × 2 mm TQFN package with an exposed thermal pad (ePAD) internally connected to PGND. For optimal thermal performance, the ePAD must be soldered to a PCB copper pour tied to PGND. With proper layout, the device achieves θJA = 80°C/W, enabling operation up to +125°C junction temperature under 1.5 A load with adequate board-level heatsinking.
Does the MIC2870YFT-T5 support I²C register readback for status monitoring?
Yes - the MIC2870YFT-T5 supports full-duplex I²C communication including readback of status registers such as Flash Control (01h), Torch Control (02h), and Master Control/Status (00h). These registers provide real-time visibility into mode state, fault flags (OVP, OCD, short-circuit), and current scaling percentage - enabling closed-loop system diagnostics in smartphone firmware.
MIC2870YFT-T5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 16-UFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- DC DC Regulator
- Topology:
- Step-Up (Boost)
- Internal Switch(s):
- Yes
- Number of Outputs:
- 2
- Voltage - Supply (Min):
- 2.7V
- Voltage - Supply (Max):
- 5V
- Voltage - Output:
- 5.2V
- Current - Output / Channel:
- 1.5A (Flash)
- Frequency:
- 2MHz
- Dimming:
- I2C
- Applications:
- Camera Flash
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TQFN (2x2)
MIC2870YFT-T5 FAQ
1.How can I place an order for MIC2870YFT-T5 through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC2870YFT-T5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC2870YFT-T5 reliable?
The price and inventory of MIC2870YFT-T5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC2870YFT-T5 is usually 5 days.
3.What payment methods are accepted for MIC2870YFT-T5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC2870YFT-T5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC2870YFT-T5?
MIC2870YFT-T5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC2870YFT-T5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC2870YFT-T5?
For technical support, including MIC2870YFT-T5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC2870YFT-T5 requirements.
6.How does Aetrix verify that MIC2870YFT-T5 is sourced from the original manufacturer or authorized distributors?
All MIC2870YFT-T5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC2870YFT-T5 meets industry standards.
7.What is the process for return or replacement of MIC2870YFT-T5?
All MIC2870YFT-T5 units undergo pre-shipment inspection (PSI). If there is an issue with MIC2870YFT-T5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC2870YFT-T5 part is unused and in its original packaging.
Return procedure for MIC2870YFT-T5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIC2870YFT-T5 Tags
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BCR402RE6327HTSA1
Infineon Technologies
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BCR430UXTSA2
Infineon Technologies
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BCR420UE6433HTMA1
Infineon Technologies
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BCR420UE6327HTSA1
Infineon Technologies
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BCR421UE6327HTSA1
Infineon Technologies
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LYT1604D-TL
Power Integrations
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HV9910CLG-G
Microchip Technology
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CL2N8-G
Microchip Technology
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BCR420UW6-7
Diodes Incorporated
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BCR421UW6-7
Diodes Incorporated
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BCR420UFD-7
Diodes Incorporated
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BCR421UFD-7
Diodes Incorporated
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