My Inquiry
My Account
Microchip Technology MIC33M350YMP-TR
- Part No.:
- MIC33M350YMP-TR
- Manufacturer:
- Microchip Technology
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
MIC33M350YMP-TR.pdf
- Description:
- IC REG BUCK SELECTABLE 3A 24QFN
- Quantity:
- Payment:
- Shipping:
Inventory:496
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIC33M350YMP-TR from Microchip Technology is a pin-selectable, synchronous step-down power module with integrated inductor, delivering 3A output current at up to 95% efficiency. It operates from 2.4V–5.5V input, supports nine fixed output voltages (0.6V–3.3V) via VSEL1/VSEL2 three-state logic, and features Constant On-Time control, ±1.5% output voltage accuracy, and AEC-Q104 qualification for automotive-grade reliability.
For engineers reviewing the MIC33M350YMP-TR datasheet, MIC33M350YMP-TR pinout, MIC33M350YMP-TR application, or MIC33M350YMP-TR equivalent, this page delivers verified technical context on HyperLight Load® operation, 1.2 MHz switching frequency at 1.0V output, Power Good signaling, thermal latch-off protection, and QFN-24 package layout-critical for SSD, FPGA, and portable low-voltage ASIC power designs.
Technical Context
The MIC33M350YMP-TR implements adaptive Constant On-Time (COT) control with HyperLight Load® mode, enabling ultra-fast transient response and high light-load efficiency without external compensation. Its internal 0.47 µH inductor, dual three-state VSEL pins, and 100% duty-cycle capability support dropout operation down to VIN ≈ VOUT + RDS(on)-HS × IOUT.
It integrates high-side (30 mΩ typ.) and low-side (16 mΩ typ.) MOSFETs, provides open-drain Power Good with 91% activation threshold and 4% hysteresis, and uses separate PVIN/SVIN rails with internal 10 Ω isolation to decouple power stage and analog reference domains-ensuring stable regulation across -40°C to +125°C junction temperature.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.4V–5.5V: Supports single-cell Li-ion battery systems and wide-input industrial rails without external LDO pre-regulation. |
| Output Current | 3A continuous: Delivers full rated load without derating at +85°C ambient with proper PCB thermal design. |
| Output Voltage Options | 0.6V, 0.8V, 0.9V, 1.0V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V: Set by VSEL1/VSEL2 logic states-eliminates feedback resistors and improves accuracy vs. resistor-divider solutions. |
| Switching Frequency | 1.2 MHz typical at 1.0V output: Enables compact external filtering with small ceramic capacitors and reduces EMI fundamental energy. |
| Output Voltage Accuracy | ±1.5% over line/load/temperature: Ensures reliable core voltage compliance for FPGAs, DSPs, and low-VDD ASICs across operating conditions. |
| Shutdown Current | 1.5 µA typical: Minimizes battery drain during system sleep modes in portable applications. |
| EMI Compliance | CISPR 32 Class B & CISPR 25 Class 5 radiated emissions: Meets stringent automotive and consumer EMC requirements without added shielding or filters. |
Pinout & Package
Package: 24-Lead QFN, 3.0 mm × 4.5 mm × 1.8 mm, thermally enhanced with exposed pads (EP1_PGND, EP2_PGND, EP_SW, EP_OUT) connected internally to respective nodes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1,2,3,10,11 | PGND | Power ground return path for buck converter power stage-must be low-impedance, separate from AGND loop. |
| 4–9 | SW | Switch node connecting internal MOSFETs and inductor-requires short, low-inductance routing away from sensitive signals. |
| 12–16 | OUT | Power output terminals-parallel connection reduces current density and thermal resistance at the output rail. |
| 17 | PVIN | Main power input for high-side MOSFET-requires local 22 µF ceramic capacitor to PGND. |
| 18 | SVIN | Analog supply for control circuitry-internally isolated from PVIN via 10 Ω resistor; requires 1 µF ceramic to AGND. |
| 19,20 | VSEL2, VSEL1 | Three-state digital inputs (GND/float/VIN) selecting one of nine output voltages-no pull-up/down needed. |
| 21 | EN | Active-high enable-logic low disables regulator and activates 10 Ω internal discharge path from VOUT to PGND. |
| 22 | PG | Open-drain Power Good output-asserts high when VOUT ≥ 91% of setpoint; used for power sequencing with other regulators. |
| 23 | VOUT | Remote sense and discharge pin-connect directly to output capacitor anode to minimize IR drop and enable safe pre-biased start-up. |
| 24 | AGND | Analog ground reference for internal reference and error amplifier-tie to clean ground plane near output capacitor cathode. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Inductor | 0.47 µH shielded inductor embedded in module-reduces BOM count, eliminates external inductor selection and layout sensitivity. |
| HyperLight Load® Mode | Automatic transition to discontinuous conduction at light loads-maintains >85% efficiency at 1 mA output while preserving fast transient response. |
| Safe Pre-Biased Start-Up | Forced PWM operation prevents negative inductor current during start-up into existing output voltage-avoids damage to downstream components. |
| Latch-Off Thermal Protection | Shuts down permanently after four consecutive thermal faults-prevents repeated thermal cycling stress during persistent overload or cooling failure. |
| Output Discharge on Disable | 10 Ω internal pull-down from VOUT to PGND-ensures rapid, controlled discharge to known state before re-enabling. |
Applications
| Solid State Drive (SSD) Core Power | FPGA Core Voltage Regulation |
|---|---|
Use Scenario: Powers NAND controller and DRAM buffer in M.2 NVMe SSDs requiring tight voltage tolerance and fast load transients during burst read/write. IC Role / Device Role / Timing Role: Primary 1.2V/1.8V synchronous buck regulator with remote sensing and Power Good sequencing to enable PCIe link training. Use Value: ±1.5% output accuracy and 1.2 MHz switching ensure stable core voltage under 0–3A dynamic loads; PG signal coordinates reset timing with host controller. |
Use Scenario: Supplies configurable logic core (VCCINT) in Xilinx Artix-7 or Intel Cyclone V FPGAs where voltage must scale with performance mode. IC Role / Device Role / Timing Role: Pin-strapped 0.9V/1.0V/1.2V power module enabling hardware-selectable voltage without firmware or I²C interface. Use Value: Nine factory-trimmed output options eliminate external resistor networks and reduce layout area; 100% duty cycle extends battery life during low-power states. |
| Ultrabook SoC I/O Rail | Automotive Infotainment PMIC Sub-Regulator |
Use Scenario: Generates 3.3V I/O supply for USB-C PD controllers and display interface bridges in fanless ultrabooks with strict thermal limits. IC Role / Device Role / Timing Role: High-efficiency, low-noise step-down module with CISPR 25 Class 5 compliance for EMI-sensitive mobile platforms. Use Value: 95% peak efficiency and integrated inductor minimize heat generation; 1.5 µA shutdown current preserves battery charge during suspend-to-RAM. |
Use Scenario: Provides 1.5V auxiliary rail for audio DSP and CAN transceiver interfaces in AEC-Q104-qualified infotainment head units. IC Role / Device Role / Timing Role: Automotive-qualified power module with latch-off thermal shutdown and robust UVLO hysteresis for harsh under-hood environments. Use Value: Passes AEC-Q104 testing-including temperature cycling and HAST-enabling direct use in ASIL-B subsystems without additional qualification overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIC33M356YMP-TR | I²C-programmable output (0.6V–3.3V in 10 mV steps) vs. pin-strapped; same package, pin-compatible but EN/PG/VSEL pins repurposed. | Requires MCU firmware control and I²C bus resources; better for dynamically reconfigurable systems. | Select MIC33M356YMP-TR only if voltage agility outweighs simplicity-MIC33M350YMP-TR avoids software dependency and boot-time I²C initialization. |
| TPS628641RQYR | 3A, 2.4V–5.5V input, 0.6V–3.3V I²C-programmable; smaller 2.0 mm × 2.5 mm QFN-16; no integrated inductor. | Requires external 0.47 µH inductor and feedback resistors-increases layout complexity and component count. | Choose TPS628641RQYR for space-constrained designs where board area is prioritized over BOM simplification and EMI performance. |
Compared with MIC33M350YMP-TR, MIC33M356YMP-TR trades hardware simplicity for programmability, while TPS628641RQYR reduces footprint at the cost of external magnetics and reduced EMI margin-making MIC33M350YMP-TR optimal for production-ready, high-reliability, low-component-count power delivery.
Availability
MIC33M350YMP-TR is available at Aetrix Electronics and suitable for Solid State Drives (SSD), FPGA power management, and automotive infotainment systems requiring stable component supply, AEC-Q104 qualification, and long-term lifecycle continuity.
Supply support for MIC33M350YMP-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and power management ICs, with emphasis on reliability, longevity, and automotive-grade qualification.
The MIC33M series is designed for high-density, low-voltage DC-DC conversion in portable and automotive applications-integrating inductors and advanced control architectures to simplify point-of-load design while meeting stringent EMI and thermal requirements.
FAQ
What is the maximum output current capability of the MIC33M350YMP-TR under continuous operation?
The MIC33M350YMP-TR delivers 3A continuous output current across its full operating temperature range (-40°C to +125°C junction), validated with standard PCB thermal relief (2 oz copper, 4 thermal vias under EP). Derating is not required below +85°C ambient when using the recommended 3.0 mm × 4.5 mm layout with exposed pad grounding.
How does the MIC33M350YMP-TR achieve ±1.5% output voltage accuracy without external feedback resistors?
The MIC33M350YMP-TR achieves ±1.5% output voltage accuracy through factory-trimmed internal DACs and precision bandgap references tied to the VSEL1/VSEL2 logic states. Each of the nine output voltages (e.g., 1.0V, 1.2V) is laser-trimmed during test-eliminating resistor tolerance errors and temperature drift associated with external dividers.
Can the MIC33M350YMP-TR safely start up into a pre-biased output voltage?
Yes, the MIC33M350YMP-TR supports safe start-up into a pre-biased output via forced PWM operation that prevents reverse inductor current flow. This is confirmed in Figure 2-18 of the datasheet (DS20006348B), where Vpre-bias = 0.8V shows monotonic VOUT ramp without undershoot or oscillation-critical for hot-swap and multi-rail sequencing.
What is the purpose of the separate SVIN and PVIN pins on the MIC33M350YMP-TR?
SVIN supplies the analog control circuitry (reference, error amplifier, logic) with noise-isolated power, while PVIN powers the high-current power stage (MOSFETs, SW node). The internal 10 Ω resistor between them prevents switching noise from PVIN from modulating the reference-improving PSRR and output voltage stability, especially under heavy transient loads.
Does the MIC33M350YMP-TR include overcurrent protection, and how does it behave during fault conditions?
Yes, the MIC33M350YMP-TR includes cycle-by-cycle high-side current limiting (4–6.5A), low-side current limiting (±4.2A), and hiccup-mode short-circuit protection. Upon sustained overcurrent, it enters thermal latch-off after four consecutive shutdowns-requiring full input power cycle to recover-preventing thermal runaway during persistent faults.
MIC33M350YMP-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Selectable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.4V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.6V, 0.8V, 0.9V, 1V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V
- Voltage - Output (Max):
- -
- Current - Output:
- 3A
- Frequency - Switching:
- 1.2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-QFN (3x4.5)
MIC33M350YMP-TR FAQ
1.How can I place an order for MIC33M350YMP-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC33M350YMP-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC33M350YMP-TR reliable?
The price and inventory of MIC33M350YMP-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC33M350YMP-TR is usually 5 days.
3.What payment methods are accepted for MIC33M350YMP-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC33M350YMP-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC33M350YMP-TR?
MIC33M350YMP-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC33M350YMP-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC33M350YMP-TR?
For technical support, including MIC33M350YMP-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC33M350YMP-TR requirements.
6.How does Aetrix verify that MIC33M350YMP-TR is sourced from the original manufacturer or authorized distributors?
All MIC33M350YMP-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC33M350YMP-TR meets industry standards.
7.What is the process for return or replacement of MIC33M350YMP-TR?
All MIC33M350YMP-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC33M350YMP-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC33M350YMP-TR part is unused and in its original packaging.
Return procedure for MIC33M350YMP-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIC33M350YMP-TR Tags
-
TPS562201DDCR
Texas Instruments
-
MC34063ABD-TR
STMicroelectronics
-
TPS561201DDCR
Texas Instruments
-
MC33063ADR
Texas Instruments
-
MC34063ADR
Texas Instruments
-
TPS560200DBVR
Texas Instruments
-
AP3012KTR-G1
Diodes Incorporated
-
TLV61048DBVR
Texas Instruments
-
AZ34063UMTR-G1
Diodes Incorporated
-
TPS562200DDCR
Texas Instruments
-
AP62300TWU-7
Diodes Incorporated
-
MC34063EBD-TR
STMicroelectronics
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
