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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - DC DC Switching Regulators

Microchip Technology MIC33M356-HAYMP-TR

Name: MIC33M356-HAYMP-TR
Brand: Microchip Technology
SKU: MIC33M356-HAYMP-TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MIC33M356-HAYMP-TR

Manufacturer:: Microchip Technology

Category:: Voltage Regulators - DC DC Switching Regulators

Package:: 24-PowerFQFN

Datasheet:: MIC33M356-HAYMP-TR.pdf

Description:: IC REG 3A 24QFN

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Product details

Overview

MIC33M356-HAYMP-TR from Microchip Technology is an I²C-programmable, integrated-inductor synchronous buck power module delivering 3A output current with ±1.5% voltage accuracy across line/load/temperature. It operates from 2.4V–5.5V input, supports 0.6V–1.28V output at 5 mV resolution, and features HyperLight Load® mode for >95% efficiency at light loads-optimized for SSD and FPGA core rail applications.

For engineers reviewing the MIC33M356-HAYMP-TR datasheet, MIC33M356-HAYMP-TR pinout, MIC33M356-HAYMP-TR application, or MIC33M356-HAYMP-TR equivalent, key selection criteria include I²C-configurable slew rate (200–3200 µs/V), latch-off thermal/current protection, 1.5 µA shutdown current, and compatibility with MIC33M350 for drop-in migration in space-constrained portable designs.

Technical Context

The MIC33M356-HAYMP-TR implements Constant On-Time (COT) control with adaptive on-time adjustment to maintain near-constant switching frequency in continuous conduction mode. Its HyperLight Load® mode dynamically reduces switching frequency under light load by enabling low-side MOSFET diode emulation, minimizing drive and switching losses.

It integrates dual internal MOSFETs (30 mΩ HS / 16 mΩ LS typical R_DS(on)), a 0.47 µH inductor, and I²C slave interface (0x5B, up to 3.4 MHz). Fault reporting includes overtemperature latch-off at +165°C, hiccup-mode short-circuit protection (8 pulses), and Power Good monitoring with 91%/87% thresholds and 65 µs blanking.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.4V–5.5V - supports single-cell Li-ion battery operation with UVLO at 2.225V (153 mV hysteresis).
Output Current	3A continuous - sustained delivery with thermal derating above +125°C junction temperature.
Output Voltage Accuracy	±1.5% over line/load/temperature - ensures stable core voltage for FPGAs and ASICs without external trimming.
I²C Interface Speed	Up to 3.4 MHz - enables rapid dynamic voltage scaling (DVS) during processor state transitions.
Shutdown Current	1.5 µA typical - minimizes battery drain in always-on subsystems or sleep modes.
Thermal Protection	Latch-off at +165°C with +22°C hysteresis - prevents thermal runaway in sealed enclosures.
Power Good Output	Open-drain PG with 91% activation / 87% deactivation threshold - enables precise power sequencing with external pull-up.

Pinout & Package

The MIC33M356-HAYMP-TR is housed in a thermally enhanced 24-lead QFN package (3.0 mm × 4.5 mm × 1.8 mm) with exposed thermal pads electrically tied to PGND, SW, OUT, and AGND for optimal PCB heat dissipation and EMI control.

Pin/Terminal	Circuit Role	Design Meaning
PGND (Pins 1,2,3,10,11)	Power Ground return path	Carries high-frequency switch-node return current; must be connected to low-impedance ground plane with multiple vias.
SW (Pins 4–9)	Switch node connection	High dv/dt node linking internal HS/LG MOSFETs and integrated inductor; requires minimal trace length and no external loading.
PVIN (Pin 17)	Main power input	Supplies high-side P-MOSFET; requires local 47 µF ceramic capacitor to PGND for transient current handling.
SVIN (Pin 18)	Analog supply input	Bias source for control circuitry; internally connected to PVIN via 10 Ω resistor; requires 1 µF decoupling to AGND.
SCL/SDA (Pins 19–20)	I²C serial interface	Slave-mode bus interface (7-bit address 0x5B); supports standard/fast/high-speed modes up to 3.4 MHz.
EN (Pin 21)	Enable control input	Active-high logic input; programmable delay (0.25–3 ms) prevents inrush; must not float.
PG (Pin 22)	Power Good status output	Open-drain signal indicating VOUT ≥91% of target; asserts after 65 µs blanking; sinks 10 mA max.
VOUT (Pin 23)	Remote output sense	Connects directly to output capacitor's high-side terminal for accurate regulation; enables active discharge via internal 10 Ω resistor when disabled.
OUT (Pins 12–16)	Power output terminals	Low-impedance paths to load; must be routed with wide copper and connected to EP_OUT thermal pad.
AGND (Pin 24)	Analog reference ground	Signal ground for feedback and control circuits; isolated from PGND except at single-point star connection.
EP1_PGND / EP2_PGND	Exposed thermal pads	Internally tied to PGND; require ≥6 thermal vias to inner ground plane for thermal resistance reduction (θ_JA = 36°C/W).
EP_SW / EP_OUT	Exposed thermal pads	Directly connect to SW node and output power plane respectively; critical for EMI suppression and current handling.

Key Features

Feature	Design Value
I²C-programmable output voltage	0.6V–1.28V at 5 mV steps (HAYMP variant), enabling precise core voltage tuning for multi-VDD SoCs without hardware changes.
HyperLight Load® mode	Automatic transition to discontinuous conduction at light loads, reducing quiescent current to 60 µA and maintaining >85% efficiency down to 1 mA.
Safe start-up with pre-biased output	Enables reliable power-up into systems where output rail is already partially charged (e.g., hot-swap or rail-sharing configurations).
Integrated inductor and MOSFETs	Eliminates external magnetics and discrete power stage components, reducing BOM count and layout area by >40% vs. controller+external FET solutions.
Multiple fault indication	I²C-readable status flags for overtemperature, overcurrent, undervoltage lockout, and PG fault-enabling real-time system health monitoring.
Output discharge on disable	Configurable 10 Ω internal pull-down activated via I²C CTRL2 register, ensuring controlled ramp-down and preventing back-powering of downstream circuitry.

Applications

Solid-State Drive (SSD) Core Rail	FPGA Core Voltage Supply
Use Scenario: Powers NAND flash controller and DRAM cache in M.2 NVMe SSDs with tight thermal constraints and burst current demands. IC Role / Device Role / Timing Role: Primary 1.0V/3A core regulator with I²C-based dynamic voltage scaling during read/write state transitions. Use Value: Ultra-fast transient response (<80 µs recovery from 0.5A→3A step) maintains voltage stability during PCIe Gen4 burst transfers, preventing data corruption.	Use Scenario: Supplies configurable core voltage (0.85V–1.2V) to Xilinx Artix-7 or Intel Cyclone V FPGA banks requiring precise rail sequencing. IC Role / Device Role / Timing Role: I²C-programmable buck module with PG output used to enable downstream I/O rails only after core rail stabilization. Use Value: ±1.5% output accuracy and remote sensing ensure FPGA logic integrity across -40°C to +125°C industrial operating range.
Ultrabook CPU/GPU Core Rail	Low-Power ASIC Power Management
Use Scenario: Delivers 3A peak current to ARM Cortex-A7x or x86 Atom processor cores in fanless ultrabooks with single-cell Li-ion battery input. IC Role / Device Role / Timing Role: High-efficiency buck converter operating in HyperLight Load® mode during idle states, transitioning to FPWM under load. Use Value: 95% peak efficiency and 1.5 µA shutdown current extend battery life by >12% versus non-HLL alternatives in always-connected standby.	Use Scenario: Powers vision-processing ASICs in edge AI cameras requiring sub-1V rails with programmable startup timing and fault logging. IC Role / Device Role / Timing Role: I²C-configurable regulator with readable fault registers (thermal, current limit, UVLO) for embedded firmware diagnostics. Use Value: Latch-off thermal protection (+165°C) and hiccup-mode short-circuit response prevent field failures in unventilated enclosures.

Solid-State Drive (SSD) Core Rail

FPGA Core Voltage Supply

Use Scenario: Powers NAND flash controller and DRAM cache in M.2 NVMe SSDs with tight thermal constraints and burst current demands.

IC Role / Device Role / Timing Role: Primary 1.0V/3A core regulator with I²C-based dynamic voltage scaling during read/write state transitions.

Use Value: Ultra-fast transient response (<80 µs recovery from 0.5A→3A step) maintains voltage stability during PCIe Gen4 burst transfers, preventing data corruption.

Use Scenario: Supplies configurable core voltage (0.85V–1.2V) to Xilinx Artix-7 or Intel Cyclone V FPGA banks requiring precise rail sequencing.

IC Role / Device Role / Timing Role: I²C-programmable buck module with PG output used to enable downstream I/O rails only after core rail stabilization.

Use Value: ±1.5% output accuracy and remote sensing ensure FPGA logic integrity across -40°C to +125°C industrial operating range.

Ultrabook CPU/GPU Core Rail

Low-Power ASIC Power Management

Use Scenario: Delivers 3A peak current to ARM Cortex-A7x or x86 Atom processor cores in fanless ultrabooks with single-cell Li-ion battery input.

IC Role / Device Role / Timing Role: High-efficiency buck converter operating in HyperLight Load® mode during idle states, transitioning to FPWM under load.

Use Value: 95% peak efficiency and 1.5 µA shutdown current extend battery life by >12% versus non-HLL alternatives in always-connected standby.

Use Scenario: Powers vision-processing ASICs in edge AI cameras requiring sub-1V rails with programmable startup timing and fault logging.

IC Role / Device Role / Timing Role: I²C-configurable regulator with readable fault registers (thermal, current limit, UVLO) for embedded firmware diagnostics.

Use Value: Latch-off thermal protection (+165°C) and hiccup-mode short-circuit response prevent field failures in unventilated enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous buck regulator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MIC33M350-HAYMP-TR	Same pinout, identical package, but fixed 1.0V output (non-I²C-programmable); lacks slew rate, current limit, and soft-start configuration.	Used where static core voltage suffices and I²C overhead is undesirable; no dynamic voltage scaling capability.	Select when cost sensitivity outweighs programmability needs and system-level voltage margin allows fixed 1.0V operation.
TPS62864ARQYR	3A buck with I²C interface (0x60), 0.4V–1.975V output (10 mV steps), 1.8V–5.5V input; no integrated inductor; higher quiescent current (12 µA shutdown).	Requires external inductor and compensation; better suited for designs needing custom inductance or tighter EMI filtering.	Choose when board space permits discrete magnetics and higher design flexibility is required over module-level integration.

Compared with MIC33M356-HAYMP-TR, MIC33M350-HAYMP-TR offers lower BOM cost and simpler bring-up but forfeits dynamic voltage control, while TPS62864ARQYR provides broader output range and adjustable loop compensation at the expense of increased layout complexity and reduced thermal performance without integrated magnetics.

Availability

MIC33M356-HAYMP-TR is available at Aetrix Electronics and suitable for solid-state drives, ultrabooks, and FPGA power delivery systems requiring stable component supply, full production traceability, and long-term lifecycle support.

Supply support for MIC33M356-HAYMP-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontroller, analog, and Flash-IP solutions, serving automotive, industrial, communications, and consumer markets with vertically integrated silicon and software platforms.

The MIC33M356-HAYMP-TR belongs to Microchip's integrated power module family designed specifically for high-density, low-noise, battery-powered computing applications demanding I²C configurability, ultra-fast transient response, and robust thermal management.

FAQ

What is the default output voltage of the MIC33M356-HAYMP-TR at power-up?

The MIC33M356-HAYMP-TR powers up with a default output voltage of 1.0V, as specified in its ordering information. This safe-start voltage is factory-programmed and remains active until modified via the I²C interface. The device retains this setting across enable cycles, and the 1.0V default aligns with common FPGA and SSD core rail requirements, eliminating need for external configuration on initial boot.

Does the MIC33M356-HAYMP-TR support pre-biased output start-up?

Yes, the MIC33M356-HAYMP-TR supports safe start-up into a pre-biased output condition, as confirmed in the Functional Description section. This feature prevents reverse current flow and potential damage when the output rail is already charged-critical in hot-swap or multi-rail systems. The internal control logic actively manages the high-side MOSFET gate drive to avoid sinking current from the pre-charged rail during turn-on.

How does the HyperLight Load® mode improve efficiency in the MIC33M356-HAYMP-TR?

HyperLight Load® mode in the MIC33M356-HAYMP-TR improves light-load efficiency by reducing switching frequency and enabling low-side MOSFET diode emulation, cutting drive and switching losses. At 1 mA load, it achieves >85% efficiency-versus ~65% in forced PWM-while maintaining ultra-fast transient response. This mode activates automatically below ~150 mA and is disabled only via I²C CTRL2 register bit FPWM.

Can the MIC33M356-HAYMP-TR be programmed while disabled (EN = GND)?

Yes, the MIC33M356-HAYMP-TR retains full I²C functionality-including register reads/writes-even when EN = GND, provided PVIN remains above the 2.225V UVLO threshold. This allows housekeeping MCUs to pre-configure output voltage, slew rate, and protection thresholds before enabling power delivery, ensuring glitch-free startup and eliminating need for post-enable reconfiguration delays.

What thermal management features does the MIC33M356-HAYMP-TR include?

The MIC33M356-HAYMP-TR includes latch-off thermal shutdown at +165°C with +22°C hysteresis, thermal warning at +118°C (readable via I²C), and four-cycle thermal latch-off soft-start recovery. Its 24-lead QFN package integrates four exposed thermal pads (EP1_PGND, EP2_PGND, EP_SW, EP_OUT) tied to respective internal nodes-enabling <36°C/W junction-to-ambient thermal resistance when properly mounted with ≥6 thermal vias per pad.

MIC33M356-HAYMP-TR Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 24-PowerFQFN

Packaging:: Tape & Reel (TR)

Product Status:: Active

Function:: -

Output Configuration:: -

Topology:: -

Output Type:: -

Number of Outputs:: -

Voltage - Input (Min):: -

Voltage - Input (Max):: -

Voltage - Output (Min/Fixed):: -

Voltage - Output (Max):: -

Current - Output:: -

Frequency - Switching:: -

Synchronous Rectifier:: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 24-QFN (3x4.5)

MIC33M356-HAYMP-TR FAQ

1.How can I place an order for MIC33M356-HAYMP-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MIC33M356-HAYMP-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIC33M356-HAYMP-TR reliable?

The price and inventory of MIC33M356-HAYMP-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC33M356-HAYMP-TR is usually 5 days.

3.What payment methods are accepted for MIC33M356-HAYMP-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC33M356-HAYMP-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIC33M356-HAYMP-TR?

MIC33M356-HAYMP-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIC33M356-HAYMP-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIC33M356-HAYMP-TR?

For technical support, including MIC33M356-HAYMP-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC33M356-HAYMP-TR requirements.

6.How does Aetrix verify that MIC33M356-HAYMP-TR is sourced from the original manufacturer or authorized distributors?

All MIC33M356-HAYMP-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC33M356-HAYMP-TR meets industry standards.

7.What is the process for return or replacement of MIC33M356-HAYMP-TR?

All MIC33M356-HAYMP-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC33M356-HAYMP-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIC33M356-HAYMP-TR part is unused and in its original packaging.

Return procedure for MIC33M356-HAYMP-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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