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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - DC DC Switching Regulators

Microchip Technology MIC33M656-FAYMP-TR

Name: MIC33M656-FAYMP-TR
Brand: Microchip Technology
SKU: MIC33M656-FAYMP-TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: MIC33M656-FAYMP-TR

Manufacturer:: Microchip Technology

Category:: Voltage Regulators - DC DC Switching Regulators

Package:: 53-PowerBFQFN Module

Datasheet:: MIC33M656-FAYMP-TR.pdf

Description:: IC REG BUCK PROG 6A 53B1QFN

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Product details

Overview

MIC33M656-FAYMP-TR from Microchip Technology is an I²C-programmable, 6A synchronous buck power module with integrated inductor, operating from 2.4V to 5.5V input and delivering 0.9V default output (5 mV resolution up to 1.28V). It features ±1.5% output voltage accuracy over line/load/temperature, latch-off thermal and current protection, and meets CISPR32 Class B emissions. It serves as a high-efficiency, ultra-fast transient response core supply for FPGAs and SSDs.

For engineers reviewing the MIC33M656-FAYMP-TR datasheet, MIC33M656-FAYMP-TR pinout, MIC33M656-FAYMP-TR application, or MIC33M656-FAYMP-TR equivalent, key selection criteria include I²C-configurable slew rate (0.2–3.2 ms/V), programmable high-side current limit (3.5–10 A), 100% duty-cycle low-dropout operation, and compatibility with MIC33M650 for drop-in migration in space-constrained designs.

Technical Context

The MIC33M656-FAYMP-TR implements Constant-On-Time (COT) control with HyperLight Load® mode, enabling near-constant switching frequency in CCM while reducing frequency at light loads to minimize switching losses. Its adaptive on-time scheme maintains stability across wide VIN and VOUT ranges without external compensation.

It integrates dual MOSFETs (30 mΩ HS / 16 mΩ LS typical RDS(on)), internal 0.47 µH inductor, and dedicated SVIN/AGND domains for precision reference regulation. Fault reporting-including overcurrent, overtemperature (165°C latch-off), and PG status-is communicated via I²C registers, supporting real-time system monitoring and sequencing.

Key Specifications

Parameter	Value and Actual Design Meaning
Input Voltage Range	2.4V to 5.5V - supports single-cell Li-ion battery systems and USB-powered applications without external LDO pre-regulation.
Output Current	6A continuous - delivers full rated current with thermal derating managed by 45°C/W θJA and exposed thermal pads (EP_OUT, EP_SW, EP_PGND, EP_PVIN).
Output Voltage Accuracy	±1.5% over line/load/temperature - ensures reliable core voltage delivery for FPGA I/O banks and ASIC logic rails under dynamic load and temperature variation.
I²C Interface Speed	Up to 3.4 MHz (High-Speed mode) - enables fast configuration of VOUT, slew rate, and fault thresholds during boot or runtime reconfiguration.
Shutdown Supply Current	1.5 µA typical - minimizes battery drain in always-on subsystems or standby states of portable SSDs and edge AI modules.
Thermal Protection	Latch-off at 165°C with 22°C hysteresis - prevents thermal runaway during sustained overload or poor PCB heatsinking, requiring explicit reset.
EMI Compliance	CISPR32 Class B radiated emissions - simplifies EMC certification for consumer and industrial end equipment without additional filtering.

Pinout & Package

Package: 53-lead, 6 mm × 10 mm × 3 mm B1QFN with four exposed thermal pads (EP_OUT, EP_SW, EP_PGND, EP_PVIN) for enhanced thermal performance and mechanical robustness in high-power density layouts.

Pin/Terminal	Circuit Role	Design Meaning
PGND (Pins 2,3,4,5,23,24,39,40)	Power Ground Return	Low-impedance return path for high-current switching loop; must be connected directly to solid ground plane with minimal trace length to reduce EMI and voltage bounce.
SW (Pins 6–22)	Switch Node	High-frequency connection to internal MOSFETs and inductor; requires short, wide copper pour to minimize ringing and radiated noise.
PVIN (Pins 41,42)	Main Input Power	Primary supply for high-side MOSFET; requires local 47 µF ceramic input capacitor placed adjacent to PVIN and PGND pins.
OUT (Pins 25–38)	Power Output	Delivers regulated 6A output; connects to EP_OUT thermal pad and output capacitors; multiple parallel pins reduce DC resistance and AC impedance.
SCL/SDA (Pins 45,48)	I²C Control Interface	Enable register-based configuration (VOUT, slew, OCP) before or during operation; SDA is open-drain, requiring external pull-up.
EN (Pin 49)	Enable Control	Active-high logic input with programmable delay (0.25–3 ms); allows precise power sequencing with other regulators or host processors.
PG (Pin 50)	Power Good Indicator	Open-drain output asserting when VOUT ≥91% of target; used for cascaded enable timing and fault detection in multi-rail systems.
VOUT (Pin 51)	Remote Sense Input	Provides Kelvin sensing for improved load regulation; must be routed close to output capacitor to reject PCB IR drop.

Key Features

Feature	Design Value
I²C Programmable Output Voltage	0.6V–1.28V in 5 mV steps (FAYMP default = 0.9V) - enables dynamic voltage scaling for FPGA core domains and low-power SoC modes without hardware change.
HyperLight Load® Mode	Ultra-low quiescent current with automatic diode emulation at light loads - achieves >90% efficiency at 1 mA output, extending battery life in idle states.
Safe Start-up with Pre-Biased Output	Enables controlled ramp-up even when output is pre-charged - prevents reverse current flow into powered-down downstream circuitry during hot-plug or partial system resets.
Integrated Inductor & Filtering	On-module 0.47 µH inductor + input/output ripple-dampening caps - eliminates external magnetics and reduces layout sensitivity, accelerating design cycle for compact SSD and embedded AI modules.
Output Discharge on Disable	10 Ω internal pull-down activated when EN = GND - actively discharges output capacitance to prevent floating rail issues and ensure deterministic power-down behavior.

Applications

FPGA Core Power Supply	SSD Controller Rail
Use Scenario: Powers 28 nm/16 nm FPGA core logic requiring tightly regulated 0.9V ±1.5% at up to 6A peak current with fast load transients during configuration and compute bursts. IC Role / Device Role / Timing Role: Primary synchronous buck regulator with remote sense and I²C-adjustable slew rate to match FPGA VCCINT ramp requirements. Use Value: ±1.5% accuracy and ultra-fast transient response (<100 µs recovery from 0.5A→6A step) maintain logic integrity during clock domain crossings and bitstream loading.	Use Scenario: Supplies NVMe SSD controller ICs (e.g., Phison E16, Silicon Motion SM2262) requiring stable 0.9V core voltage under bursty NAND flash access patterns. IC Role / Device Role / Timing Role: High-current, low-noise DC-DC module with CISPR32 Class B compliance to meet SSD enclosure-level EMC limits. Use Value: Integrated inductor and optimized layout reduce board area by >40% vs discrete solutions while maintaining <10 mV p-p output ripple at 6A.
Low-Voltage ASIC Power	Portable Edge AI Module
Use Scenario: Delivers 0.9V to heterogeneous ASICs (e.g., vision processors, crypto accelerators) with dynamic DVFS profiles and strict thermal envelope constraints. IC Role / Device Role / Timing Role: I²C-configurable current limit (3.5–10 A) and thermal warning (118°C) support adaptive power capping and firmware-controlled throttling. Use Value: Programmable enable delay (0.25–3 ms) enables precise sequencing with memory and interface rails, avoiding bus contention during boot.	Use Scenario: Powers battery-operated edge AI inference modules (e.g., Coral Dev Board derivatives) where 2.4–5.5V input range matches Li-ion voltage swing and shutdown current <2 µA extends standby time. IC Role / Device Role / Timing Role: Single-chip power solution integrating inductor, MOSFETs, and control to replace 12+ discrete components in space-limited PCBs. Use Value: 100% duty-cycle operation sustains regulation down to 2.4V input, maximizing usable battery capacity and runtime between charges.

FPGA Core Power Supply

SSD Controller Rail

Use Scenario: Powers 28 nm/16 nm FPGA core logic requiring tightly regulated 0.9V ±1.5% at up to 6A peak current with fast load transients during configuration and compute bursts.

IC Role / Device Role / Timing Role: Primary synchronous buck regulator with remote sense and I²C-adjustable slew rate to match FPGA VCCINT ramp requirements.

Use Value: ±1.5% accuracy and ultra-fast transient response (<100 µs recovery from 0.5A→6A step) maintain logic integrity during clock domain crossings and bitstream loading.

Use Scenario: Supplies NVMe SSD controller ICs (e.g., Phison E16, Silicon Motion SM2262) requiring stable 0.9V core voltage under bursty NAND flash access patterns.

IC Role / Device Role / Timing Role: High-current, low-noise DC-DC module with CISPR32 Class B compliance to meet SSD enclosure-level EMC limits.

Use Value: Integrated inductor and optimized layout reduce board area by >40% vs discrete solutions while maintaining <10 mV p-p output ripple at 6A.

Low-Voltage ASIC Power

Portable Edge AI Module

Use Scenario: Delivers 0.9V to heterogeneous ASICs (e.g., vision processors, crypto accelerators) with dynamic DVFS profiles and strict thermal envelope constraints.

IC Role / Device Role / Timing Role: I²C-configurable current limit (3.5–10 A) and thermal warning (118°C) support adaptive power capping and firmware-controlled throttling.

Use Value: Programmable enable delay (0.25–3 ms) enables precise sequencing with memory and interface rails, avoiding bus contention during boot.

Use Scenario: Powers battery-operated edge AI inference modules (e.g., Coral Dev Board derivatives) where 2.4–5.5V input range matches Li-ion voltage swing and shutdown current <2 µA extends standby time.

IC Role / Device Role / Timing Role: Single-chip power solution integrating inductor, MOSFETs, and control to replace 12+ discrete components in space-limited PCBs.

Use Value: 100% duty-cycle operation sustains regulation down to 2.4V input, maximizing usable battery capacity and runtime between charges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current, I²C-programmable buck regulator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MIC33M650-FAYMP-TR	Same pinout, identical 53-pin B1QFN package, but fixed 0.9V output (non-I²C-programmable); lacks slew rate, OCP, and soft-start configurability.	Targeted at cost-sensitive, static-voltage applications where firmware control is unnecessary; no runtime VOUT adjustment or fault telemetry.	Select when I²C interface adds complexity or risk, and 0.9V is sufficient across all operating conditions.
TPS62480RRVR	6A buck converter with I²C interface, but no integrated inductor; requires external 0.33 µH inductor and has higher BOM count; 2.7–5.5V input range.	Better suited for thermally constrained environments where inductor placement flexibility is needed; lacks CISPR32 Class B certification out-of-box.	Select when board-level thermal management permits discrete magnetics and higher layout effort is acceptable for fine-grained thermal optimization.

Compared with MIC33M656-FAYMP-TR, MIC33M650-FAYMP-TR offers lower cost and simpler bring-up but forfeits dynamic voltage control and diagnostics, while TPS62480RRVR provides greater thermal design freedom at the expense of increased component count, layout complexity, and unverified EMI performance.

Availability

MIC33M656-FAYMP-TR is available at Aetrix Electronics and suitable for FPGA core supplies, SSD controller rails, and low-voltage ASIC power applications requiring stable component supply, long-term lifecycle assurance, and full production traceability.

Supply support for MIC33M656-FAYMP-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog devices, and power management ICs, with deep expertise in mixed-signal design and embedded control solutions.

The MIC33M656 product line delivers fully integrated, high-current DC-DC power modules targeting space-constrained, high-performance computing applications such as SSDs, FPGAs, and AI accelerators where reliability, efficiency, and programmability are critical.

FAQ

What is the default output voltage of the MIC33M656-FAYMP-TR at power-up?

The MIC33M656-FAYMP-TR powers up with a factory-programmed default output voltage of 0.9V. This value is stored in nonvolatile configuration memory and remains active until overwritten via the I²C interface. The device supports subsequent reprogramming to any value between 0.6V and 1.28V in 5 mV increments, allowing flexible adaptation to different FPGA or ASIC core requirements without hardware modification. The 0.9V default ensures safe initialization for common low-voltage logic families.

Does the MIC33M656-FAYMP-TR require external compensation components?

No, the MIC33M656-FAYMP-TR does not require external compensation components. Its Constant-On-Time (COT) control architecture with HyperLight Load® mode is internally compensated and optimized for stability across its full operating range (2.4V–5.5V input, 0.6V–1.28V output). The integrated inductor, input/output capacitors, and internal feedback network eliminate the need for external RC networks or type-II/type-III compensators-reducing design risk, BOM count, and layout sensitivity while ensuring robust transient response under varying load and temperature conditions.

How does the MIC33M656-FAYMP-TR handle pre-biased outputs during start-up?

The MIC33M656-FAYMP-TR implements safe start-up with pre-biased output capability: when enabled, it detects existing voltage on the VOUT pin and initiates a controlled ramp without forcing reverse current into downstream circuitry. This avoids potential damage to powered peripherals or data corruption in partially active systems. The feature relies on internal current limiting and gate drive timing adjustments, and functions independently of I²C configuration-ensuring reliability during hot-plug events, partial system resets, or multi-rail sequencing where output rails may already be energized.

Can the MIC33M656-FAYMP-TR be configured while disabled (EN = GND)?

Yes, the MIC33M656-FAYMP-TR retains full I²C functionality while disabled. As long as PVIN remains above the 2.225V UVLO threshold, the I²C slave interface (address 0x5B) remains active, allowing host processors to configure registers-including output voltage, slew rate, current limit, and enable delay-prior to asserting EN. This enables "pre-configure-and-enable" power sequencing, where settings are validated before power delivery begins, reducing debug cycles and improving system reliability during boot.

What thermal management provisions does the MIC33M656-FAYMP-TR include?

The MIC33M656-FAYMP-TR incorporates four dedicated exposed thermal pads-EP_OUT, EP_SW, EP_PGND, and EP_PVIN-each electrically tied to its respective internal node. These pads must be connected via thermal vias to internal or bottom-layer copper planes to achieve the specified 45°C/W θJA. The device also includes latch-off thermal shutdown at 165°C with 22°C hysteresis and a thermal warning flag at 118°C, accessible via I²C status registers. Together, these features enable predictable thermal behavior and support robust thermal design in high-density SSD and FPGA carrier boards.

MIC33M656-FAYMP-TR Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: HyperLight Load®

Package/Case:: 53-PowerBFQFN Module

Packaging:: Tape & Reel (TR)

Product Status:: Active

Function:: Step-Down

Output Configuration:: Positive

Topology:: Buck

Output Type:: Programmable

Number of Outputs:: 1

Voltage - Input (Min):: 2.4V

Voltage - Input (Max):: 5.5V

Voltage - Output (Min/Fixed):: 0.6V

Voltage - Output (Max):: 1.28V

Current - Output:: 6A

Frequency - Switching:: 1.6MHz, 2.2MHz

Synchronous Rectifier:: Yes

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 53-B1QFN (6x10)

MIC33M656-FAYMP-TR FAQ

1.How can I place an order for MIC33M656-FAYMP-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MIC33M656-FAYMP-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIC33M656-FAYMP-TR reliable?

The price and inventory of MIC33M656-FAYMP-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC33M656-FAYMP-TR is usually 5 days.

3.What payment methods are accepted for MIC33M656-FAYMP-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC33M656-FAYMP-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIC33M656-FAYMP-TR?

MIC33M656-FAYMP-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIC33M656-FAYMP-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIC33M656-FAYMP-TR?

For technical support, including MIC33M656-FAYMP-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC33M656-FAYMP-TR requirements.

6.How does Aetrix verify that MIC33M656-FAYMP-TR is sourced from the original manufacturer or authorized distributors?

All MIC33M656-FAYMP-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC33M656-FAYMP-TR meets industry standards.

7.What is the process for return or replacement of MIC33M656-FAYMP-TR?

All MIC33M656-FAYMP-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC33M656-FAYMP-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIC33M656-FAYMP-TR part is unused and in its original packaging.

Return procedure for MIC33M656-FAYMP-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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