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Microchip Technology MIC4744YTSE
- Part No.:
- MIC4744YTSE
- Manufacturer:
- Microchip Technology
- Package:
- 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Datasheet:
-
MIC4744YTSE.pdf
- Description:
- IC REG BUCK ADJ 2A DL 16TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:1,926
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Product details
Overview
MIC4744YTSE from Micrel is a dual-channel, 4 MHz synchronous-capable non-synchronous PWM buck regulator delivering two independent 2A outputs with adjustable output voltage down to 0.6V. It integrates high-side P-Channel MOSFETs with 155 mΩ typical RDS(on), operates from 2.9V–5.5V input, and supports 100% duty cycle for low-dropout operation in point-of-load applications such as FPGA/ASIC core supplies and satellite radio power rails.
For engineers reviewing the MIC4744YTSE datasheet, MIC4744YTSE pinout, MIC4744YTSE application, or MIC4744YTSE equivalent, key selection criteria include its 4 MHz switching frequency enabling ultra-small external components (0.47 µH inductor + 10 µF capacitor), internal compensation supporting >200 kHz closed-loop bandwidth, thermal shutdown and current limit protection, and EPAD-TSSOP-16 package with 35°C/W θJA.
Technical Context
The MIC4744YTSE implements a dual-output, fixed-frequency voltage-mode PWM control architecture with proprietary internal type III compensation-eliminating need for external compensation components while achieving >200 kHz closed-loop bandwidth. Each channel features independent enable (EN1/EN2) and feedback (FB1/FB2) inputs, allowing asynchronous start-up and individual output regulation.
It uses integrated P-Channel high-side switches (no external bootstrap required), requires an external Schottky freewheeling diode per channel, and relies on separate VIN1/VIN2 and PGND1/PGND2 pins with internal anti-parallel diodes connecting respective supply and ground pairs-enabling flexible PCB layout and reduced noise coupling between channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Switching Frequency | 4 MHz ±10% - enables use of sub-1 µH inductors and <10 µF ceramic output capacitors, minimizing board area and cost. |
| Output Current per Channel | 2 A continuous - supports high-current digital loads like FPGA I/O banks or ASIC subsystems without external current sharing. |
| Input Voltage Range | 2.9 V to 5.5 V - compatible with single-cell Li-ion, USB 5V, and 3.3V/5V system rails. |
| Feedback Reference Voltage | 0.6 V ±2% - sets minimum output voltage and defines resistor-divider ratio for precise output programming. |
| Max Duty Cycle | 100% - allows operation with VOUT ≈ VIN, critical for low-dropout scenarios such as post-regulation of 3.3V rails. |
| High-Side RDS(on) | 155 mΩ typical at VIN = 3.6 V - contributes to >90% peak efficiency and reduces thermal stress vs. discrete switch solutions. |
| Junction Temp Range | –40°C to +125°C - qualified for automotive infotainment and industrial embedded environments. |
Pinout & Package
The MIC4744YTSE is housed in a 16-pin Exposed-Pad TSSOP (EPAD-TSSOP) package measuring 5 mm × 4.4 mm × 1.2 mm, with thermal pad (EPAD) electrically and thermally connected to GND. The exposed pad must be soldered to a dedicated PCB ground plane for optimal thermal performance (θJA = 35°C/W).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| EN1, EN2 | Logic-level enable inputs | Active-high control: logic low disables corresponding channel, reducing quiescent current to <10 µA; must not float. |
| FB1, FB2 | Feedback inputs | Connect to resistor divider from output to set VOUT = 0.6 V × (1 + R1/R2); input bias current <1 nA minimizes divider error. |
| VIN1, VIN2 | Power inputs | Supply pins for respective channel high-side MOSFETs; each requires local 10 µF ceramic bypass to PGND1/PGND2. |
| SW1, SW2 | Switch node outputs | Connect directly to inductor; high dV/dt nodes requiring short, low-inductance routing away from sensitive analog traces. |
| PGND1, PGND2 | Power ground returns | Low-impedance return paths for MOSFET drive current; internally tied via anti-parallel diodes to reduce cross-talk. |
| SGND | Signal ground reference | Analog ground for error amplifier and bias circuitry; must be separated from PGND to avoid noise injection into feedback path. |
| BIAS | Bias supply input | Internally powered via 10 Ω resistor from VIN; requires 0.1 µF ceramic capacitor to SGND for clean reference generation. |
| EPAD | Thermal & electrical ground | Exposed copper pad on bottom surface; must be soldered to large PCB GND copper area for thermal dissipation and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated 2A P-Channel MOSFETs | Eliminates need for external high-side switches and gate drivers, reducing BOM count and layout complexity. |
| 4 MHz fixed-frequency PWM | Enables use of 0.47 µH inductors and 10 µF ceramic output capacitors-cutting solution size by >40% vs. 500 kHz alternatives. |
| Internal type III compensation | Removes requirement for external compensation network while maintaining >80° phase margin across load/line/temp variations. |
| 100% duty cycle capability | Supports dropout conditions where VOUT approaches VIN, e.g., 3.3V output from 3.6V battery rail without efficiency collapse. |
| Independent dual-channel control | EN1/EN2 and FB1/FB2 allow staggered power-up, dynamic voltage scaling per rail, and fault isolation between domains. |
Applications
| FPGA Core Power Supply | Automotive Satellite Radio |
|---|---|
Use Scenario: Providing tightly regulated 1.2V/1.8V dual-rail power to Xilinx Artix-7 FPGA banks with fast transient response to logic switching. IC Role / Device Role / Timing Role: Dual-channel buck regulator supplying independent, dynamically scalable core and I/O voltages with 200 kHz bandwidth for sub-100 ns load-step recovery. Use Value: Enables reliable FPGA configuration and high-speed serial interface operation under varying computational load without brownout or overshoot. | Use Scenario: Generating 3.3V and 5.0V rails in compact satellite radio head units operating in vehicle cabins with wide ambient temperature swings. IC Role / Device Role / Timing Role: Dual-output DC-DC converter delivering stable, low-noise power to RF front-end and audio DAC stages under 12V battery input with ripple <20 mVpp. Use Value: Meets automotive EMC requirements and maintains SNR >95 dB in audio playback by minimizing switching noise coupling into analog signal paths. |
| HD Set-Top Box SoC Power | Computer Peripheral Power |
Use Scenario: Supplying 1.0V core and 1.8V memory rails to Broadcom BCM7271 SoC in HD STB designs with strict thermal envelope constraints. IC Role / Device Role / Timing Role: High-efficiency dual buck regulator operating at 4 MHz to minimize inductor size and support thermal derating up to +125°C junction temperature. Use Value: Achieves >92% peak efficiency at full load, reducing heatsink requirements and enabling fanless enclosure design. | Use Scenario: Delivering 1.2V GPU core and 3.3V interface power in compact graphics cards or multifunction printers with space-constrained PCB layouts. IC Role / Device Role / Timing Role: Ultra-compact dual regulator using 3 mm × 3 mm footprint-compatible inductors and MLCCs to meet IPC-7351 density targets. Use Value: Reduces total power stage area by 35% versus discrete controller + MOSFET solutions, freeing space for additional connectivity features. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output buck regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS54290RGER | 2.2 MHz switching, integrated high-/low-side FETs, requires external compensation; 3.5V–60V input range. | Better suited for high-input-voltage industrial systems; lacks 4 MHz speed for ultra-compact designs. | Select when input exceeds 5.5V or synchronous operation is mandatory; not drop-in due to different pinout and control scheme. |
| RT8205AZSP | 1.5 MHz, dual 2A synchronous buck, 2.7V–5.5V input, integrated compensation, smaller 3 mm × 3 mm QFN. | Superior light-load efficiency via DCM mode; lower RDS(on) but no 100% duty cycle support. | Prefer for battery-powered devices needing >85% efficiency at 10 mA load; unsuitable for low-dropout linear-regulator-replacement use cases. |
Compared with MIC4744YTSE, TPS54290RGER offers wider input range but higher minimum on-time limits low-VOUT capability, while RT8205AZSP improves light-load efficiency at the expense of dropout flexibility-making MIC4744YTSE uniquely balanced for compact, medium-input, high-transient-demand point-of-load designs.
Availability
MIC4744YTSE is available at Aetrix Electronics and suitable for FPGA/ASIC core supplies, automotive satellite radio power rails, HD STB SoC power delivery, and computer peripheral power management requiring stable component supply across extended temperature and long production lifecycles.
Supply support for MIC4744YTSE includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Micrel Inc. was a U.S.-based analog and mixed-signal semiconductor company headquartered in San Jose, CA, specializing in power management, timing, and interface ICs before its acquisition by Microchip Technology in 2015.
The MIC4744 belongs to Micrel's high-frequency dual buck regulator product line, designed specifically for space-constrained, high-transient-response point-of-load applications in broadband, automotive infotainment, and digital consumer electronics.
FAQ
What is the maximum achievable output voltage accuracy for MIC4744YTSE over temperature?
The MIC4744YTSE features a precision 0.6 V feedback reference with ±2% tolerance over –40°C to +125°C junction temperature. When used with 1% resistors in the feedback divider, total output voltage error remains within ±2.5% across full operating range-verified in Electrical Characteristics Table on page 5 of the March 2009 datasheet. This accuracy enables reliable regulation for FPGA core rails and other tight-tolerance digital loads.
Does MIC4744YTSE support forced PWM mode or only PFM/pulse-skipping at light load?
The MIC4744YTSE operates exclusively in PWM mode with fixed 4 MHz frequency and does not include forced PWM or PFM modes. At light loads, it maintains constant frequency but reduces effective duty cycle-resulting in discontinuous conduction mode (DCM) with pulse-skipping behavior that improves light-load efficiency. This is confirmed in Application Information section (page 11) and Typical Characteristics plots showing efficiency curves collapsing at low current.
Can MIC4744YTSE be used with ceramic output capacitors smaller than 10 µF?
Yes-MIC4744YTSE is explicitly characterized for stable operation with either 4.7 µF (with 1 µH inductor) or 10 µF (with 0.47 µH inductor) ceramic output capacitors, as stated in Features and Component Selection sections (pages 1 and 13). Using values outside this range risks loop instability due to its type III internal compensation, which assumes fixed LC pole location near 73.4 kHz. Deviations require re-evaluation of phase margin via Bode analysis.
What is the recommended PCB layout practice for the EPAD on MIC4744YTSE?
The EPAD on MIC4744YTSE must be soldered to a solid, low-thermal-resistance PCB ground plane using ≥4 thermal vias (0.3 mm diameter) spaced evenly beneath the pad and connected to inner-layer ground planes. Per Layout Recommendations (page 10), this achieves the specified 35°C/W θJA; insufficient thermal relief causes junction temperature rise beyond +125°C rating under 2A/channel load, triggering thermal shutdown.
Is MIC4744YTSE pin-compatible with MIC4744YML?
No-MIC4744YTSE (EPAD-TSSOP-16) and MIC4744YML (3 mm × 3 mm MLF®-16) share identical electrical functionality and pin functions but differ in physical pin mapping, package dimensions, and thermal characteristics. Pin numbering differs significantly (e.g., EN1 is pin 11 in MLF but pin 1 in EPAD-TSSOP), and the MLF has 0.5 mm pitch vs. TSSOP's 0.65 mm pitch. Direct PCB replacement is not possible without layout revision.
MIC4744YTSE Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 16-TSSOP (0.173", 4.40mm Width) Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 2
- Voltage - Input (Min):
- 2.9V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 5.5V
- Current - Output:
- 2A
- Frequency - Switching:
- 4MHz
- Synchronous Rectifier:
- No
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-TSSOP-EP
MIC4744YTSE FAQ
1.How can I place an order for MIC4744YTSE through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC4744YTSE on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC4744YTSE reliable?
The price and inventory of MIC4744YTSE are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC4744YTSE is usually 5 days.
3.What payment methods are accepted for MIC4744YTSE?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC4744YTSE transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC4744YTSE?
MIC4744YTSE orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC4744YTSE order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC4744YTSE?
For technical support, including MIC4744YTSE datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC4744YTSE requirements.
6.How does Aetrix verify that MIC4744YTSE is sourced from the original manufacturer or authorized distributors?
All MIC4744YTSE products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC4744YTSE meets industry standards.
7.What is the process for return or replacement of MIC4744YTSE?
All MIC4744YTSE units undergo pre-shipment inspection (PSI). If there is an issue with MIC4744YTSE, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC4744YTSE part is unused and in its original packaging.
Return procedure for MIC4744YTSE:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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