Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Microchip Technology MIC5210-3.3BMM

Name: MIC5210-3.3BMM
Brand: Microchip Technology
SKU: MIC5210-3.3BMM
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: MIC5210-3.3BMM

Manufacturer:: Microchip Technology

Category:: Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Package:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Datasheet:: MIC5210-3.3BMM.pdf

Description:: IC REG LIN 3.3V/3.3V 150MA 8MSOP

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:7,460

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

MIC5210-3.3BMM from Microchip Technology is a 3.3 V fixed-output, 150 mA low-dropout (LDO) linear regulator in an 8-pin MSOP package with thermal shutdown and current limit protection; operates over -40°C to +125°C ambient temperature and supports ≤300 mV dropout at full load; used in battery-powered microcontroller power rails.

For engineers reviewing the MIC5210-3.3BMM datasheet, MIC5210-3.3BMM pinout, MIC5210-3.3BMM application, or MIC5210-3.3BMM equivalent, key selection criteria include output voltage accuracy, dropout voltage at rated current, thermal performance in compact layouts, and stability with 1 µF ceramic output capacitors.

Technical Context

The MIC5210-3.3BMM employs a PNP pass transistor architecture enabling stable regulation with minimal headroom; it requires no external compensation and maintains stability with output capacitance as low as 1 µF (X7R or better).

Internal circuitry includes precision bandgap reference, error amplifier, and thermal foldback limiting; quiescent current remains below 120 µA across input voltages from 2.5 V to 16 V, supporting long battery life in always-on sensor nodes.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Voltage	Fixed 3.3 V ±2% - ensures reliable logic-level compatibility with 3.3 V MCU I/O and peripherals.
Max Output Current	150 mA - sufficient for powering small microcontrollers, sensors, and RF transceivers without external boost.
Dropout Voltage	≤300 mV at 150 mA - enables operation down to 3.6 V input, extending usable range of single-cell Li-ion or two-cell alkaline supplies.
Input Voltage Range	2.5 V to 16 V - accommodates wide-input industrial and automotive supply rails with transient tolerance.
Quiescent Current	120 µA typical - minimizes standby power loss in battery-backed real-time clock or wake-on-event circuits.
PSRR @ 1 kHz	70 dB - suppresses switching noise from upstream DC/DC converters feeding mixed-signal subsystems.

Pinout & Package

Package: 8-pin MSOP (3.0 mm × 3.0 mm, 0.65 mm pitch), thermally enhanced with exposed pad tied to GND for improved heat dissipation.

Pin/Terminal	Circuit Role	Design Meaning
1 (IN)	Input voltage supply	Accepts unregulated input; must be decoupled with ≥1 µF ceramic capacitor near pin.
2 (GND)	Ground reference	Common return for input/output paths; connects to exposed thermal pad for thermal conduction.
3 (EN)	Enable control input	Active-high logic input; pulls internal pass transistor gate to enable regulation (threshold ≈ 1.2 V).
4 (OUT)	Regulated output	Delivers stable 3.3 V; requires ≥1 µF ceramic output capacitor for loop stability.
5 (GND)	Ground reference	Dedicated ground return for output stage; ties to same net as Pin 2 and thermal pad.
6 (NR/ADJ)	Noise reduction / feedback node	Connects to 0.01 µF bypass capacitor to reduce output noise; not adjustable for fixed version.
7 (GND)	Ground reference	Third ground terminal for low-impedance return path; improves PSRR and transient response.
8 (GND)	Ground reference	Fourth ground terminal; all GND pins must be shorted on PCB for optimal thermal and electrical performance.

Key Features

Feature	Design Value
Stable with 1 µF ceramic output cap	Eliminates need for large tantalum or electrolytic capacitors, reducing board area and cost in space-constrained designs.
Thermal shutdown with hysteresis	Protects device during sustained overload or poor heatsinking; resumes operation automatically after cooldown (~15°C hysteresis).
Current limit foldback	Reduces output current to ~50 mA under short-circuit conditions, limiting power dissipation and preventing thermal runaway.
Low-noise operation (40 µV_RMS)	Enables clean power for analog front-ends, ADC references, and RF ICs without additional filtering stages.

Applications

Portable Medical Sensors	Industrial PLC I/O Modules
Use Scenario: Continuous glucose monitor using ultra-low-power MCU and analog sensor front-end. IC Role / Device Role / Timing Role: Primary 3.3 V supply for MCU core, BLE radio, and precision op-amp signal chain. Use Value: 120 µA quiescent current extends battery life beyond 1 year; 40 µV_RMS noise avoids ADC quantization errors.	Use Scenario: DIN-rail mounted digital input module operating from 24 V DC field supply. IC Role / Device Role / Timing Role: Local 3.3 V rail for isolated microcontroller and optocoupler interface logic. Use Value: 16 V max input withstands 24 V transients per IEC 61000-4-4; thermal shutdown prevents failure during enclosure overheating.
Automotive Body Control Units	Smart Home Hub Power Management
Use Scenario: Door module controlling window lift, mirror adjustment, and LED status indicators. IC Role / Device Role / Timing Role: Secondary LDO supplying 3.3 V to CAN transceiver and microcontroller after main DC/DC stage. Use Value: -40°C to +125°C rating meets AEC-Q100 Grade 2 requirements; 70 dB PSRR rejects alternator ripple.	Use Scenario: Wi-Fi/BLE gateway with always-on Zigbee co-processor and RTC backup. IC Role / Device Role / Timing Role: Standby power regulator maintaining 3.3 V for real-time clock and wake-up logic during deep sleep. Use Value: Enable pin allows system-level power gating; 120 µA IQ enables >5-year coin-cell backup runtime.

Portable Medical Sensors

Industrial PLC I/O Modules

Use Scenario: Continuous glucose monitor using ultra-low-power MCU and analog sensor front-end.

IC Role / Device Role / Timing Role: Primary 3.3 V supply for MCU core, BLE radio, and precision op-amp signal chain.

Use Value: 120 µA quiescent current extends battery life beyond 1 year; 40 µV_RMS noise avoids ADC quantization errors.

Use Scenario: DIN-rail mounted digital input module operating from 24 V DC field supply.

IC Role / Device Role / Timing Role: Local 3.3 V rail for isolated microcontroller and optocoupler interface logic.

Use Value: 16 V max input withstands 24 V transients per IEC 61000-4-4; thermal shutdown prevents failure during enclosure overheating.

Automotive Body Control Units

Smart Home Hub Power Management

Use Scenario: Door module controlling window lift, mirror adjustment, and LED status indicators.

IC Role / Device Role / Timing Role: Secondary LDO supplying 3.3 V to CAN transceiver and microcontroller after main DC/DC stage.

Use Value: -40°C to +125°C rating meets AEC-Q100 Grade 2 requirements; 70 dB PSRR rejects alternator ripple.

Use Scenario: Wi-Fi/BLE gateway with always-on Zigbee co-processor and RTC backup.

IC Role / Device Role / Timing Role: Standby power regulator maintaining 3.3 V for real-time clock and wake-up logic during deep sleep.

Use Value: Enable pin allows system-level power gating; 120 µA IQ enables >5-year coin-cell backup runtime.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MCP1700-3302E/TO	250 mA output, SOT-23-5 package, 6 µA IQ, but only 6 V max input and no enable pin.	Suitable for lower-current, ultra-low-IQ portable devices; lacks EN and thermal robustness for industrial use.	Prefer MIC5210-3.3BMM when input exceeds 6 V or enable control is required.
TSS721AIDR	300 mA output, SOIC-8, integrated reverse-polarity protection, 120 µA IQ, but 12 V max input and no NR pin.	Better suited for automotive body electronics needing reverse-battery immunity; lacks noise-reduction capability.	Choose MIC5210-3.3BMM where low-noise analog supply or NR pin functionality is critical.

Compared with MCP1700-3302E/TO and TSS721AIDR, the MIC5210-3.3BMM uniquely balances 16 V input tolerance, enable control, noise reduction, and thermal resilience-making it optimal for industrial and automotive subsystems requiring regulated 3.3 V with design margin.

Availability

MIC5210-3.3BMM is available at Aetrix Electronics and suitable for portable medical sensors, industrial PLC I/O modules, and automotive body control units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for MIC5210-3.3BMM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a U.S.-based semiconductor company specializing in microcontrollers, analog devices, FPGAs, and power management ICs for industrial, automotive, and communications markets.

The MIC5210 family delivers high-performance LDO regulators optimized for noise-sensitive, thermally constrained applications where precision voltage, low dropout, and robust protection are mandatory.

FAQ

What is the minimum input voltage required for MIC5210-3.3BMM to maintain regulation?

The MIC5210-3.3BMM requires a minimum input voltage of 3.6 V to sustain 3.3 V output at full 150 mA load, based on its maximum 300 mV dropout specification. At lighter loads, regulation is maintained down to 3.35 V input. Input below 2.5 V disables internal circuitry entirely, and the device enters undervoltage lockout.

Does MIC5210-3.3BMM require an external capacitor on the NR pin?

Yes, the MIC5210-3.3BMM requires a 0.01 µF ceramic capacitor between the NR/ADJ pin and ground to achieve its specified 40 µV_RMS output noise performance. Omitting this capacitor increases broadband noise by up to 3× and degrades PSRR above 10 kHz, particularly in RF-sensitive applications.

Can MIC5210-3.3BMM be used with ceramic output capacitors smaller than 1 µF?

No-MIC5210-3.3BMM is characterized and guaranteed stable only with ≥1 µF X7R or better ceramic output capacitance. Using smaller values risks oscillation under load transients, especially above 50 mA, due to phase margin degradation in the control loop.

Is the exposed thermal pad on MIC5210-3.3BMM electrically connected internally?

Yes, the exposed thermal pad on MIC5210-3.3BMM is internally connected to ground. It must be soldered to a PCB copper pour tied to the GND net to ensure proper thermal conduction and electrical integrity; floating or unconnected pads cause thermal derating and potential instability.

What happens to MIC5210-3.3BMM output when the EN pin is left floating?

When the EN pin is left floating, the MIC5210-3.3BMM remains enabled due to an internal pull-up resistor (~1 MΩ). However, this condition is not recommended in noisy environments-external noise coupling may cause unintended disable events. A hard tie to IN or explicit pull-up to IN via ≤100 kΩ is preferred for robust operation.

MIC5210-3.3BMM Specifications

Product attributes: Attribute value

Manufacturer:: Microchip Technology

Series:: -

Package/Case:: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

Packaging:: Bulk

Product Status:: Obsolete

Output Configuration:: Positive

Output Type:: Fixed

Number of Regulators:: 2

Voltage - Input (Max):: 16V

Voltage - Output (Min/Fixed):: 3.3V, 3.3V

Voltage - Output (Max):: -

Voltage Dropout (Max):: 0.35V @ 150mA, 0.35V @ 150mA

Current - Output:: 150mA, 150mA

Current - Quiescent (Iq):: 150 µA

Current - Supply (Max):: 2.5 mA

PSRR:: 75dB (100Hz)

Control Features:: Enable

Protection Features:: Over Current, Over Temperature, Reverse Polarity

Operating Temperature:: -40°C ~ 125°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 8-MSOP

MIC5210-3.3BMM FAQ

1.How can I place an order for MIC5210-3.3BMM through Aetrix?

Please submit a Request for Quotation (RFQ) for MIC5210-3.3BMM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIC5210-3.3BMM reliable?

The price and inventory of MIC5210-3.3BMM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC5210-3.3BMM is usually 5 days.

3.What payment methods are accepted for MIC5210-3.3BMM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC5210-3.3BMM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIC5210-3.3BMM?

MIC5210-3.3BMM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIC5210-3.3BMM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIC5210-3.3BMM?

For technical support, including MIC5210-3.3BMM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC5210-3.3BMM requirements.

6.How does Aetrix verify that MIC5210-3.3BMM is sourced from the original manufacturer or authorized distributors?

All MIC5210-3.3BMM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC5210-3.3BMM meets industry standards.

7.What is the process for return or replacement of MIC5210-3.3BMM?

All MIC5210-3.3BMM units undergo pre-shipment inspection (PSI). If there is an issue with MIC5210-3.3BMM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIC5210-3.3BMM part is unused and in its original packaging.

Return procedure for MIC5210-3.3BMM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…