Microchip Technology MIC5245-3.3BMM

Overview

MIC5245-3.3BMM from Microchip Technology is a 3.3 V fixed-output, 150 mA low-dropout (LDO) linear regulator in an 8-pin MSOP package with thermal shutdown, current limit, and reverse-battery protection; designed for powering microcontrollers, sensors, and RF modules in space-constrained industrial and portable systems.

For engineers reviewing the MIC5245-3.3BMM datasheet, MIC5245-3.3BMM pinout, MIC5245-3.3BMM application, or MIC5245-3.3BMM equivalent, key selection criteria include dropout voltage at full load, ground current vs. load, PSRR at 1 kHz, thermal performance in MSOP-8, and compatibility with ceramic output capacitors ≥1 µF.

Technical Context

The MIC5245-3.3BMM uses a PNP pass transistor architecture enabling ultra-low dropout (170 mV at 150 mA), stable operation with 1 µF–10 µF ceramic output capacitors, and inherent reverse-battery protection without external components. It integrates internal current limiting and thermal foldback to prevent damage during overload or high ambient temperature conditions.

Its quiescent current remains stable at 120 µA across load (0–150 mA) and input voltage (4.3 V–16 V), supporting battery-powered applications requiring long standby life. The device achieves 70 dB PSRR at 1 kHz and maintains regulation down to 3.3 V ±2% over line, load, and temperature variations.

Key Specifications

Pinout & Package

Package: 8-pin MSOP (3.0 mm × 3.0 mm, 0.65 mm pitch), exposed thermal pad (EP) connected to GND for enhanced thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with MCP1703-3302E/MB and TSS721AIDR, the MIC5245-3.3BMM offers the lowest dropout and best thermal performance in its footprint, making it optimal for compact, battery-sensitive designs where input headroom is limited and thermal management is constrained.

Availability

MIC5245-3.3BMM is available at Aetrix Electronics and suitable for industrial sensor nodes, portable medical devices, and automotive body control modules requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for MIC5245-3.3BMM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a U.S.-based semiconductor company specializing in microcontrollers, analog, and mixed-signal ICs for industrial, automotive, and consumer applications.

The MIC5245 series is part of Microchip's precision LDO portfolio, engineered for space-constrained, low-noise, and battery-critical systems where dropout, quiescent current, and robust protection features are design-defining.

FAQ

What is the minimum input voltage required for MIC5245-3.3BMM to maintain regulation?

The MIC5245-3.3BMM requires a minimum input voltage of 3.47 V to sustain 3.3 V output at full 150 mA load, based on its 170 mV dropout specification. At lighter loads, the required input decreases proportionally-for example, 3.35 V suffices at 50 mA. Input below the dropout threshold causes output to track input minus dropout, not regulation.

Does MIC5245-3.3BMM require an external capacitor on the EN pin for noise immunity?

No, the MIC5245-3.3BMM does not require an external capacitor on the EN pin. Its enable threshold is internally set at 1.0 V (typical), with hysteresis of 0.1 V, providing sufficient noise margin for direct connection to GPIO or open-drain logic. Adding capacitance may slow turn-on/turn-off timing but is not necessary for reliable operation of the MIC5245-3.3BMM.

Can MIC5245-3.3BMM operate with a 10 µF tantalum output capacitor?

Yes, the MIC5245-3.3BMM is stable with 10 µF tantalum output capacitors, though Microchip's datasheet specifies guaranteed stability with 1 µF–10 µF ceramic types (X7R/X5R). Tantalum capacitors with ESR < 1 Ω are acceptable, but ceramic is preferred for lower ESR, smaller size, and better temperature stability in the MIC5245-3.3BMM application.

Is the thermal pad (EP) on MIC5245-3.3BMM electrically isolated or must it be connected to GND?

The exposed thermal pad (EP) on the MIC5245-3.3BMM is electrically connected to GND internally and must be soldered to a PCB GND copper pour. Leaving it floating degrades thermal performance and risks exceeding junction temperature limits. Proper EP connection reduces θ_JA from >200°C/W to ≤120°C/W, ensuring safe operation of the MIC5245-3.3BMM at full load in still air.

What protection features are integrated into MIC5245-3.3BMM?

The MIC5245-3.3BMM integrates reverse-battery protection (withstands –16 V input), thermal shutdown with foldback current limiting, and internal short-circuit current limiting. These protections operate autonomously without external components, safeguarding both the MIC5245-3.3BMM and downstream circuitry during fault conditions such as incorrect battery insertion or sustained overload.