Microchip Technology MIC5304-XDYMT-TR
- Part No.:
- MIC5304-XDYMT-TR
- Manufacturer:
- Microchip Technology
- Package:
- 6-UFDFN Exposed Pad, 6-TMLF®
- Datasheet:
-
MIC5304-XDYMT-TR.pdf
- Description:
- IC REG LIN 1.85/3.15V 6TMLF
- Quantity:
- Payment:

- Shipping:

Inventory:4,123
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIC5304-XDYMT from Micrel Inc. is a single-channel, 150mA low-dropout linear regulator with dual fixed output voltage selection (3.15V/1.85V) controlled by a logic-level VSEL pin, designed for power management in portable electronics requiring dynamic voltage scaling. It operates from 2.3V to 5.5V input, delivers 85mV dropout at 150mA load, and consumes only 24µA quiescent current - enabling extended battery life in memory card programming and handheld devices.
For engineers reviewing the MIC5304-XDYMT datasheet, MIC5304-XDYMT pinout, MIC5304-XDYMT application, or MIC5304-XDYMT equivalent, key selection criteria include its dual-voltage selectability, ultra-low operating current, thermal shutdown protection, compatibility with 1µF ceramic capacitors, and operation in the compact 1.6mm × 1.6mm Thin MLF® package.
Technical Context
The MIC5304-XDYMT integrates a precision bandgap reference, resistor divider network, and CMOS pass element to deliver stable dual-output regulation without external feedback components. Its VSEL pin directly controls internal resistor tap selection, enabling fast 35–100µs transitions between 3.15V and 1.85V outputs while maintaining <±2% output voltage accuracy across –40°C to +125°C.
It features active-high enable (EN) control, ground-referenced NC pin, and an exposed thermal pad (E PAD) internally connected to GND. The device uses internal current limiting (275–750mA) and thermal shutdown to protect against fault conditions, with junction-to-ambient thermal resistance θJA = 92°C/W in its 6-pin Thin MLF® package.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Current | 150mA max - supports moderate-power subsystems like SD card interfaces or camera sensor bias rails. |
| Quiescent Current | 24µA typical - enables multi-week standby in always-on portable applications without significant battery drain. |
| Dropout Voltage | 85mV @ 150mA - allows operation with minimal headroom (e.g., 3.6V input → 3.15V output), preserving battery energy near end-of-discharge. |
| Output Voltage Options | 3.15V (VSEL=High) / 1.85V (VSEL=Low) - provides hardware-selectable voltage scaling for memory I/O vs. core logic domains. |
| Input Voltage Range | 2.3V to 5.5V - compatible with single-cell Li-ion (3.0–4.2V), Li-polymer, and regulated 3.3V/5V system rails. |
| Capacitor Requirement | Stable with 1µF ceramic CIN/COUT - eliminates need for bulky tantalum or electrolytic capacitors, reducing board area and cost. |
| Protection Features | Thermal shutdown + current limit - prevents damage during short-circuit or overtemperature events without external circuitry. |
Pinout & Package
Package: 6-pin 1.6mm × 1.6mm Thin MLF® (MT) with exposed thermal pad (E PAD) internally connected to GND - optimized for thermal performance and space-constrained portable PCBs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 VIN | Supply Input | Primary DC input rail (2.3–5.5V); requires 1µF ceramic bypass to GND for stability. |
| 2 GND | Ground Reference | Power and signal return path; must be connected to PCB ground plane with low-impedance trace. |
| 3 VSEL | Voltage Select Control | Logic-level input (0.2V low / 1.2V high) that selects between 3.15V and 1.85V outputs; must not float. |
| 4 EN | Enable Input | Active-high digital control (0.01–1µA input current); pulls VOUT to zero when low, drawing ≤1µA shutdown current. |
| 5 NC | No Connect | Not internally bonded - electrically isolated; no routing or connection required on PCB. |
| 6 VOUT | Regulated Output | Delivers selected voltage (3.15V or 1.85V) with ±2% accuracy; requires 1µF ceramic capacitor to GND. |
| E PAD | Exposed Thermal Pad | Internally tied to GND; must be soldered to thermal copper pour for effective heat dissipation and EMI reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Fixed Output Selection | Hardware-selectable 3.15V/1.85V outputs via single VSEL pin - eliminates need for external resistors or DAC control in voltage-scaling designs. |
| Ultra-Low Quiescent Current | 24µA typical operating current - extends battery runtime in always-on monitoring circuits and sleep-mode peripherals. |
| Fast Voltage Transition | 35–100µs output switching between voltages - supports rapid power-state changes in memory controllers and audio codecs. |
| Minimal External Components | Stable with only two 1µF X5R/X7R ceramic capacitors - reduces BOM count, PCB footprint, and cost versus traditional LDOs. |
| Robust Fault Protection | Integrated thermal shutdown and current limiting - ensures safe operation under overload, short-circuit, or high-ambient conditions. |
Applications
| SD Card Power Management | Mobile Phone Baseband Core |
|---|---|
|
Use Scenario: Supplying dual-voltage I/O and core logic for SDHC/SDXC memory cards during read/write and sleep states. IC Role / Device Role / Timing Role: Dual-output LDO providing 3.15V for card interface signaling and 1.85V for internal controller logic based on host command. Use Value: Enables hardware-triggered voltage scaling without software intervention, reducing average power by >30% during idle periods. |
Use Scenario: Powering baseband processor subsystems requiring separate 3.15V analog supply and 1.85V digital core rail. IC Role / Device Role / Timing Role: Single-package dual-LDO replacing discrete regulators to minimize layout complexity and leakage paths. Use Value: Reduces component count by one regulator IC and associated passives, cutting PCB area by ~25% versus dual-single-LDO solution. |
| Digital Camera Sensor Bias | Portable Media Player Audio Codec |
|
Use Scenario: Delivering clean, low-noise bias to CMOS image sensors with dynamic gain control requiring voltage adjustment. IC Role / Device Role / Timing Role: Low-noise LDO supplying sensor analog front-end (3.15V) and digital back-end (1.85V) from shared battery rail. Use Value: Achieves 90µVRMS output noise and 65dB PSRR at 1kHz - preserves SNR in high-resolution imaging pipelines. |
Use Scenario: Powering stereo audio codec ICs that switch between full-performance (3.15V) and low-power playback (1.85V) modes. IC Role / Device Role / Timing Role: Voltage-selectable regulator synchronized with codec's power mode register to avoid brownout during transition. Use Value: Eliminates need for external GPIO-controlled enable sequencing, simplifying firmware and reducing startup latency by ~200µs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-voltage LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS799315DSER | Single 3.15V fixed output; no VSEL pin or second voltage option; 1.5µA quiescent current; 100mA output rating. | Only supports fixed 3.15V use cases; unsuitable for systems requiring dynamic 1.85V/3.15V switching. | Select when only one output voltage is needed and ultra-low IQ (<2µA) is prioritized over dual-voltage flexibility. |
| NCP114AMX315TBG | Single 3.15V output; 25µA IQ; 150mA rating; no VSEL functionality; requires external resistor divider for adjustable variants. | Lacks integrated dual-voltage selection - additional logic or MCU GPIO required to switch between two regulators. | Choose if existing design already uses NCP114 family and dual-voltage capability can be implemented externally with minimal layout impact. |
Compared with MIC5304-XDYMT, TPS799315DSER offers lower quiescent current but no voltage selectability, while NCP114AMX315TBG matches output current and IQ but requires external circuitry to achieve dual-voltage operation - making MIC5304-XDYMT uniquely suited for space- and component-count-sensitive dual-rail applications.
Availability
MIC5304-XDYMT is available at Aetrix Electronics and suitable for mobile phones, digital cameras, and portable media players requiring stable component supply with guaranteed long-term availability and RoHS-compliant packaging.
Supply support for MIC5304-XDYMT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Micrel Inc. was a U.S.-based semiconductor company specializing in analog, power management, and timing solutions before its acquisition by Microchip Technology in 2015. Known for high-efficiency, small-footprint regulators and Ethernet PHYs.
The MIC5304 series was developed specifically for portable electronics demanding dual-voltage LDO functionality in sub-2mm² packages - targeting memory card interfaces, handheld UI subsystems, and battery-powered sensor nodes.
FAQ
What are the exact output voltages supported by the MIC5304-XDYMT?
The MIC5304-XDYMT provides two factory-trimmed, fixed output voltages: 3.15V when the VSEL pin is driven high (≥1.2V), and 1.85V when VSEL is driven low (≤0.2V). These values are specified across –40°C to +125°C with ±2% total accuracy including line, load, and temperature variation - confirmed in the Electrical Characteristics table of the November 2008 datasheet.
Can the MIC5304-XDYMT operate with input voltages below 2.3V?
No. The MIC5304-XDYMT has a minimum specified input voltage of 2.3V per its Absolute Maximum and Operating Ratings. Below this threshold, regulation is not guaranteed, dropout behavior becomes unpredictable, and output voltage may fall outside tolerance - especially critical when sourcing 150mA load at 1.85V output where VIN must exceed 1.935V (1.85V + 85mV dropout) but still meets the 2.3V absolute minimum.
Is the NC pin on the MIC5304-XDYMT required to be grounded or left floating?
The NC (pin 5) on the MIC5304-XDYMT is not internally connected and must remain unconnected - neither grounded nor tied to any signal. Routing or soldering to this pin risks mechanical stress on the bond wire or contamination-induced leakage; the datasheet explicitly states it is "not internally connected" and shows no functional role in the Pin Description or Functional Diagram.
How does the MIC5304-XDYMT handle thermal overload conditions?
The MIC5304-XDYMT incorporates internal thermal shutdown circuitry that disables the pass element when junction temperature exceeds +125°C. Once tripped, the device remains off until die temperature falls below the hysteresis threshold (~110°C), then automatically resumes regulation. This protection is independent of EN and VSEL states and is validated across all operating conditions in the Absolute Maximum Ratings section.
What capacitor dielectric types are recommended for use with the MIC5304-XDYMT?
X5R and X7R ceramic dielectrics are recommended for both input and output capacitors of the MIC5304-XDYMT. These offer stable capacitance over temperature (±15% for X7R), low ESR, and reliable performance at 1µF/6.3V rating. Y5V and Z5U dielectrics are explicitly discouraged due to >50% capacitance loss over temperature - risking instability and violating the 1µF minimum requirement under worst-case conditions.
MIC5304-XDYMT-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 6-UFDFN Exposed Pad, 6-TMLF®
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.85V, 3.15V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.15V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 35 µA
- Current - Supply (Max):
- -
- PSRR:
- 65dB ~ 50dB (1kHz ~ 20kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TMLF® (1.6x1.6)
MIC5304-XDYMT-TR FAQ
1.How can I place an order for MIC5304-XDYMT-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC5304-XDYMT-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC5304-XDYMT-TR reliable?
The price and inventory of MIC5304-XDYMT-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC5304-XDYMT-TR is usually 5 days.
3.What payment methods are accepted for MIC5304-XDYMT-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC5304-XDYMT-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC5304-XDYMT-TR?
MIC5304-XDYMT-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC5304-XDYMT-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC5304-XDYMT-TR?
For technical support, including MIC5304-XDYMT-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC5304-XDYMT-TR requirements.
6.How does Aetrix verify that MIC5304-XDYMT-TR is sourced from the original manufacturer or authorized distributors?
All MIC5304-XDYMT-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC5304-XDYMT-TR meets industry standards.
7.What is the process for return or replacement of MIC5304-XDYMT-TR?
All MIC5304-XDYMT-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC5304-XDYMT-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC5304-XDYMT-TR part is unused and in its original packaging.
Return procedure for MIC5304-XDYMT-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIC5304-XDYMT-TR Tags

-
MIC5504-1.8YM5-TR
Microchip Technology

-
MIC5504-3.3YM5-TR
Microchip Technology

-
MIC5365-3.0YC5-TR
Microchip Technology

-
MIC5365-1.8YC5-TR
Microchip Technology

-
MIC5365-2.5YC5-TR
Microchip Technology

-
MIC5365-3.3YC5-TR
Microchip Technology

-
MIC5365-3.3YD5-TR
Microchip Technology

-
MIC5317-3.3YM5-TR
Microchip Technology

-
TLV1117LV33DCYR
Texas Instruments

-
MIC5317-3.3YMT-TZ
Microchip Technology

-
MIC5528-3.3YMT-TR
Microchip Technology

-
TLV75801PDRVR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

