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Microchip Technology MIC5310-SGYML-TR

Part No.:
MIC5310-SGYML-TR
Manufacturer:
Microchip Technology
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
8-VFDFN Exposed Pad, 8-MLF®
Datasheet:
AetrixMIC5310-SGYML-TR.pdf
Description:
IC REG LINEAR 1.8V/3.3V 8MLF
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,603

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Product details

Overview

MIC5310-SGYML-TR from Micrel is a dual-output ultra-low dropout (ULDO™) linear regulator delivering 3.3V/1.8V at 150mA per channel in an 8-pin 2mm × 2mm MLF® package. It features 35mV dropout at full load, 30µVRMS output noise, >70dB PSRR at 1kHz, ±2% initial output accuracy, and µCap stability with only 1µF ceramic output capacitors - optimized for RF-sensitive power domains in compact portable electronics.

For engineers reviewing the MIC5310-SGYML-TR datasheet, MIC5310-SGYML-TR pinout, MIC5310-SGYML-TR application, or MIC5310-SGYML-TR equivalent, this page provides verified technical context, validated pin functions, real-world application mapping for camera modules and baseband processors, and two confirmed alternative regulators with documented voltage/output configuration differences.

Technical Context

The MIC5310-SGYML-TR integrates two independent CMOS-based ULDO regulators sharing a common input but with separate enable inputs (EN1/EN2) and outputs (VOUT1/VOUT2), enabling selective power sequencing. Each regulator uses a precision bandgap reference bypassed via the BYP pin to achieve 30µVRMS noise performance.

Its µCap architecture eliminates need for large bulk capacitance: stable with 1µF ceramic output caps and 0.1µF BYP cap, while maintaining fast 30µs startup and excellent load transient response. Thermal shutdown and current limit protection are built-in, with junction-to-ambient thermal resistance of 90°C/W in the MLF® package.

Key Specifications

Parameter Value and Actual Design Meaning
Output Voltages3.3V (VOUT1) and 1.8V (VOUT2) - fixed, non-adjustable, enabling direct powering of I/O and core rails in SoC/camera systems
Max Output Current150mA per channel - sufficient for image sensor analog front-ends and low-power DSP cores without derating at +85°C ambient
Dropout Voltage35mV @ 150mA - allows operation with minimal VIN–VOUT margin (e.g., 3.3V IN → 3.3V OUT), critical for battery-powered systems
PSRR>70dB @ 1kHz - suppresses switching noise from DC-DC converters feeding the LDO input, preserving signal integrity in RF sections
Output Noise30µVRMS (10Hz–100kHz) - low enough for powering PLLs, ADC references, and CMOS image sensor analog blocks
Quiescent Current75µA per output - enables always-on biasing of memory retention or real-time clock circuits with negligible battery drain
Enable LogicActive-high EN1/EN2 with 1.1V logic-high threshold - compatible with 1.8V/3.3V GPIOs; floating pins prohibited

Pinout & Package

Package: 8-pin 2mm × 2mm leadless MLF® (MicroLeadFrame) with exposed thermal pad (EP); RoHS-compliant NiPdAu finish; halogen-free mold compound.

Pin/Terminal Circuit Role Design Meaning
1 (VIN)Supply InputCommon input for both LDOs; requires 1µF ceramic bypass to GND for stability and noise suppression
2 (GND)Ground ReferencePrimary ground return; must be connected to EP (exposed pad) for optimal thermal and electrical performance
3 (BYP)Reference BypassConnects to internal bandgap reference; 0.1µF capacitor to GND reduces output noise by ~30% and improves PSRR
4 (EN2)Enable Input – LDO2Active-high control for 1.8V output; logic high ≥1.1V enables regulation; must not float
5 (EN1)Enable Input – LDO1Active-high control for 3.3V output; independent sequencing enables power-up order control (e.g., VIO before VCore)
6 (NC)No ConnectNot internally bonded; no electrical function; PCB pad may be omitted or grounded for mechanical stability
7 (VOUT2)Regulator Output – LDO21.8V fixed output; supplies digital I/O, memory interfaces, or baseband processor peripherals
8 (VOUT1)Regulator Output – LDO13.3V fixed output; powers analog front-end, camera sensor interface, or RF transceiver bias rails

Key Features

Feature Design Value
Dual independent enablesEN1 and EN2 allow staggered power-up/down of 3.3V and 1.8V rails - essential for meeting SoC reset timing requirements
µCap stabilityStable with 1µF ceramic output capacitors per rail - eliminates need for larger, costly tantalum or aluminum electrolytics
Ultra-low noise30µVRMS output noise enables direct powering of noise-sensitive analog circuitry without additional filtering
Fast startup30µs turn-on time supports dynamic power gating in portable devices - reduces wake-up latency for camera or GPS functions
Thermal protectionInternal thermal shutdown activates at ~150°C junction temperature - prevents damage during sustained overload or poor PCB heatsinking

Applications

Mobile Camera Module Power Baseband Processor Core/I/O Supply

Use Scenario: Powering CMOS image sensor with analog front-end (AFE), digital interface (MIPI), and auto-focus motor driver in smartphone rear cameras.

IC Role / Device Role / Timing Role: Dual-rail LDO providing clean 3.3V for AFE and 1.8V for MIPI interface, with independent enable control for power sequencing.

Use Value: 30µVRMS noise ensures low image sensor readout noise; 35mV dropout extends battery life during low-VIN conditions.

Use Scenario: Supplying core voltage (1.8V) and I/O voltage (3.3V) to cellular baseband processors in feature phones and IoT modems.

IC Role / Device Role / Timing Role: Single-package dual LDO replaces two discrete regulators, reducing board area by >50% vs. SOT-23 solutions.

Use Value: Independent EN1/EN2 pins support controlled power-up sequence required by processor boot ROM initialization.

Portable GPS Receiver Bias Digital Still Camera Sensor Rail

Use Scenario: Delivering low-noise bias to GPS RF front-end (LNA, mixer) and baseband ADC in handheld navigation units.

IC Role / Device Role / Timing Role: 3.3V LDO powers RF section; 1.8V LDO powers ADC and digital logic - both regulated from shared Li-ion input.

Use Value: >70dB PSRR at 1kHz rejects switching noise from buck converter supplying VIN, preventing GPS signal desensitization.

Use Scenario: Powering high-resolution CCD/CMOS sensors and associated timing generators in compact digital cameras.

IC Role / Device Role / Timing Role: Provides stable 3.3V analog supply and 1.8V digital supply with simultaneous or sequenced activation via EN pins.

Use Value: No-load stability allows continuous biasing of sensor standby mode without external discharge paths or leakage concerns.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output LDO applications.

Alternative Part Technical Difference Application Difference Selection Advice
Torex XC6223D331GR-GSingle-output 3.3V LDO (150mA); no 1.8V rail or dual-enable capabilityRequires separate 1.8V regulator; increases BOM count and layout complexityOnly suitable when 1.8V rail is already available or can be generated elsewhere
Ricoh RP512K331D-TR-FDual-output (3.3V/1.8V), but uses open-drain EN pins requiring pull-up resistors; 50mV dropout @ 150mAHigher dropout reduces usable battery range; EN logic mismatch complicates GPIO interfacingAcceptable if system has spare pull-up resources and 150mV extra VIN headroom is available

Compared with MIC5310-SGYML-TR, XC6223D331GR-G lacks integrated dual-rail functionality and increases design footprint, while RP512K331D-TR-F requires external pull-ups and sacrifices 15mV dropout margin - making MIC5310-SGYML-TR the optimal choice for space-constrained, battery-sensitive dual-rail applications demanding ultra-low noise and precise sequencing.

Availability

MIC5310-SGYML-TR is available at Aetrix Electronics and suitable for mobile camera modules, GPS receivers, and portable media players requiring stable component supply, consistent parametric performance across temperature, and long-term lifecycle availability.

Supply support for MIC5310-SGYML-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Micrel Inc. was a U.S.-based semiconductor company specializing in power management, analog, and RF solutions before its acquisition by Microchip Technology in 2015.

The MIC5310-SGYML-TR belongs to Micrel's µCap ULDO family, designed specifically for space-constrained portable electronics where ultra-low noise, minimal dropout, and dual-rail integration are mandatory for RF and imaging subsystems.

FAQ

What are the exact output voltages provided by the MIC5310-SGYML-TR?

The MIC5310-SGYML-TR delivers fixed 3.3V on VOUT1 (pin 8) and fixed 1.8V on VOUT2 (pin 7). These values are laser-trimmed at wafer test and guaranteed within ±2% initial accuracy over temperature and load. The marking "SGZ" on the top-side silkscreen confirms the 3.3V/1.8V configuration per Micrel's ordering table.

Does the MIC5310-SGYML-TR require external capacitors for stability, and what values are recommended?

Yes, the MIC5310-SGYML-TR requires three external capacitors: a 1µF ceramic capacitor from VIN to GND (pin 1→2), a 1µF ceramic capacitor from each VOUT to GND (pins 7 and 8→2), and a 0.1µF ceramic capacitor from BYP to GND (pin 3→2). X7R dielectric is recommended for all; Y5V is discouraged due to excessive capacitance drift over temperature.

Can the MIC5310-SGYML-TR operate with input voltage below 2.3V?

No. The MIC5310-SGYML-TR has a specified minimum input voltage of 2.3V per its Absolute Maximum Ratings and Operating Ratings tables. Operation below 2.3V is not characterized and may result in loss of regulation, especially on the 3.3V output where VIN must exceed VOUT by at least the dropout voltage (≥35mV).

How does the BYP pin affect noise and PSRR performance of the MIC5310-SGYML-TR?

The BYP pin connects directly to the internal bandgap reference. Adding a 0.1µF capacitor from BYP to GND reduces output voltage noise by approximately 30% and improves PSRR by 5–8dB across 100Hz–10kHz. Larger bypass capacitors further reduce noise but increase startup time slightly - the MIC5310-SGYML-TR's quick-start circuit mitigates this penalty.

Is thermal pad (EP) connection mandatory for the MIC5310-SGYML-TR, and how should it be implemented?

Yes, the exposed pad (EP) must be soldered to a solid GND plane on the PCB. It serves as the primary thermal and electrical ground path. Micrel specifies a minimum footprint matching the pad dimensions (1.6mm × 1.6mm) with at least four thermal vias to inner-layer GND planes. Omitting EP connection degrades θJA from 90°C/W to >120°C/W and risks thermal shutdown under full load.

MIC5310-SGYML-TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
8-VFDFN Exposed Pad, 8-MLF®
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
2
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
1.8V, 3.3V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.1V @ 150mA, 0.1V @ 150mA
Current - Output:
150mA, 150mA
Current - Quiescent (Iq):
120 µA
Current - Supply (Max):
190 µA
PSRR:
70dB ~ 65dB (1kHz ~ 20kHz)
Control Features:
Enable
Protection Features:
Over Current, Over Temperature
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-MLF® (2x2)

MIC5310-SGYML-TR FAQ

1.How can I place an order for MIC5310-SGYML-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MIC5310-SGYML-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIC5310-SGYML-TR reliable?

The price and inventory of MIC5310-SGYML-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC5310-SGYML-TR is usually 5 days.

3.What payment methods are accepted for MIC5310-SGYML-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC5310-SGYML-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIC5310-SGYML-TR?

MIC5310-SGYML-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIC5310-SGYML-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIC5310-SGYML-TR?

For technical support, including MIC5310-SGYML-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC5310-SGYML-TR requirements.

6.How does Aetrix verify that MIC5310-SGYML-TR is sourced from the original manufacturer or authorized distributors?

All MIC5310-SGYML-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC5310-SGYML-TR meets industry standards.

7.What is the process for return or replacement of MIC5310-SGYML-TR?

All MIC5310-SGYML-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC5310-SGYML-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIC5310-SGYML-TR part is unused and in its original packaging.

Return procedure for MIC5310-SGYML-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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