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Microchip Technology MIC5396-GMYMX-TR

Part No.:
MIC5396-GMYMX-TR
Manufacturer:
Microchip Technology
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
8-XFDFN Exposed Pad
Datasheet:
AetrixMIC5396-GMYMX-TR.pdf
Description:
IC REG LINEAR 1.8V/2.8V 8DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,000

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Product details

Overview

MIC5396-GMYMX-TR from Microchip Technology is a dual low-dropout linear regulator IC delivering two independent 300 mA outputs with fixed 1.8 V and 2.8 V output voltages, ±2% accuracy, 160 mV dropout at full load, and operation from 2.5 V to 5.5 V input. It enables compact, efficient power sequencing in space-constrained portable electronics such as smartphones and medical wearables.

For engineers reviewing the MIC5396-GMYMX-TR datasheet, MIC5396-GMYMX-TR pinout, MIC5396-GMYMX-TR application, or MIC5396-GMYMX-TR equivalent, key selection criteria include dual-output independence, ultra-low quiescent current (37 µA per LDO), stability with 1 µF ceramic capacitors, thermal shutdown, and compatibility with 1.6 mm × 1.2 mm Extra Thin DFN packaging.

Technical Context

The MIC5396-GMYMX-TR integrates two fully independent LDO regulators sharing only ground and package-each with dedicated VIN, VOUT, and EN pins. Its architecture supports separate input rail optimization (e.g., one LDO powered from a buck converter, another from a battery), enabling system-level efficiency gains without cross-regulator coupling.

No internal output discharge circuit or enable pull-down resistor is present-this distinguishes MIC5396 from MIC5397/5398/5399 variants. EN1 and EN2 are active-high CMOS inputs requiring external logic control; floating enables are prohibited and would cause indeterminate output states.

Key Specifications

Parameter Value and Actual Design Meaning
Output Voltage 1.8 V (LDO1) and 2.8 V (LDO2), factory-fixed-no external feedback required; eliminates resistor network layout and tolerance errors.
Output Current 300 mA per channel-supports moderate-power digital cores (e.g., ARM Cortex-M4 peripherals) or RF front-end biasing without derating.
Dropout Voltage 160 mV at 300 mA-enables >95% efficiency at 3.3 V input → 2.8 V output, critical for extending battery runtime in single-cell Li-ion systems.
Accuracy ±2% over –40°C to +125°C-guarantees stable core voltage for processors and sensors across industrial temperature range.
Quiescent Current 37 µA per LDO (typ.)-reduces standby power loss in always-on subsystems like real-time clocks or sensor hubs.
Input Range 2.5 V to 5.5 V-compatible with single-cell Li-ion (2.7–4.2 V), USB-powered (5 V), and multi-rail intermediate bus architectures.
Capacitor Support Stable with ≥1 µF ceramic output capacitors-allows use of small 0402/0603 MLCCs, reducing PCB area and BOM count.

Pinout & Package

Package: 8-Lead Extra Thin DFN (X2DFN), 1.6 mm × 1.2 mm × 0.35 mm body height, exposed thermal pad (ePad) connected to GND. RoHS-compliant, Pb-free matte tin finish.

Pin/Terminal Circuit Role Design Meaning
1, 4 GND Common analog/digital ground reference for both LDOs; must be low-impedance connection to PCB ground plane via ePad vias.
2 VOUT1 Fixed 1.8 V regulated output; requires ≥1 µF ceramic capacitor to GND for stability and transient response.
3 VOUT2 Fixed 2.8 V regulated output; independently decoupled-no shared capacitor allowed between VOUT1 and VOUT2.
5 EN2 Active-high enable for LDO2; CMOS input-must be driven to <0.2 V (logic low) to disable; floating state is forbidden.
6 VIN2 Input supply for LDO2; accepts 2.5–5.5 V; requires local 1 µF ceramic capacitor to GND near pin.
7 VIN1 Input supply for LDO1; electrically isolated from VIN2-enables dual-input flexibility (e.g., battery + PMIC rail).
8 EN1 Active-high enable for LDO1; identical electrical behavior to EN2-requires defined logic level, not floating.
EP ePad Exposed thermal pad-must be soldered to solid GND copper area with ≥4 thermal vias (0.3 mm diameter) for thermal performance.

Key Features

Feature Design Value
Independent dual-input architecture Enables optimized power routing-e.g., VIN1 from high-efficiency buck converter, VIN2 from low-noise LDO-without inter-channel interference.
Low dropout at full load 160 mV @ 300 mA ensures usable headroom down to 2.96 V input for 2.8 V output, supporting brownout resilience in aging batteries.
Ultra-low quiescent current 37 µA per LDO (typ.) reduces no-load power loss to <111 nW per channel-critical for multi-week battery life in IoT endpoints.
Wide operating temperature Specified from –40°C to +125°C junction-validates use in automotive cabin modules, industrial handhelds, and medical diagnostics equipment.
Fast transient response Sub-100 µs turn-on time and minimal output sag under 100 mA step loads-maintains clean supply during processor wake-up bursts.
High PSRR 60 dB @ 1 kHz-rejects switching noise from upstream DC/DC converters, protecting noise-sensitive analog circuits (e.g., ADC references).

Applications

Smartphone Baseband Power Portable Medical Sensor Hub

Use Scenario: Powering application processor I/O rails and sensor interface circuitry in slim-profile smartphones.

IC Role / Device Role / Timing Role: Dual LDO providing isolated 1.8 V (for SDIO/USB PHY) and 2.8 V (for camera ISP) supplies with independent enable control.

Use Value: Eliminates need for two discrete regulators, saving 3.2 mm² PCB area while maintaining rail separation to prevent noise coupling between high-speed interfaces.

Use Scenario: Supplying low-noise bias to ECG front-end amplifiers and BLE SoC in wearable cardiac monitors.

IC Role / Device Role / Timing Role: Delivers clean 1.8 V analog supply (ECG signal chain) and 2.8 V digital supply (BLE radio) from shared Li-ion cell.

Use Value: 60 dB PSRR at 1 kHz suppresses switching ripple from charging IC, ensuring <1 µV RMS noise floor for sub-µV biopotential measurements.

DSC Image Signal Processor Industrial Handheld Scanner

Use Scenario: Regulating power to CMOS image sensor and ISP in digital still cameras with tight thermal constraints.

IC Role / Device Role / Timing Role: Provides 1.8 V core voltage for sensor logic and 2.8 V analog voltage for pixel array bias, each with independent sequencing.

Use Value: 160 mV dropout allows operation down to 2.96 V input-extending usable battery range by ~12% compared to 200 mV-dropout alternatives.

Use Scenario: Powering barcode decoder ASIC and laser driver in ruggedized handheld scanners used in warehouses.

IC Role / Device Role / Timing Role: Supplies 1.8 V to decode logic and 2.8 V to laser diode bias circuit, with independent EN pins enabling sleep/wake coordination.

Use Value: 37 µA quiescent current per LDO limits standby drain to <74 µA total-enabling >6-month shelf life on primary lithium battery.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-LDO applications.

Alternative Part Technical Difference Application Difference Selection Advice
MIC5397-GMYMX-TR Includes auto-discharge circuit on both outputs (25 Ω NFET); same pinout and electrical specs otherwise. Required where rapid output discharge after shutdown is needed (e.g., to meet USB suspend voltage decay requirements). Select MIC5397-GMYMX-TR only if output discharge is mandated; MIC5396-GMYMX-TR avoids unnecessary discharge current in always-on systems.
MIC5399-GMYMX-TR Adds internal 4 MΩ enable pull-down resistors and output discharge; otherwise identical voltage/current specs. Suitable when host MCU GPIOs may float during reset-ensures LDOs remain off until firmware asserts EN. Choose MIC5399-GMYMX-TR for systems with uncontrolled enable lines; MIC5396-GMYMX-TR requires guaranteed logic drive.

Compared with MIC5397-GMYMX-TR and MIC5399-GMYMX-TR, the MIC5396-GMYMX-TR offers lowest system-level complexity for designs with actively controlled enables and no discharge requirement-reducing risk of unintended discharge current paths and simplifying GPIO resource allocation.

Availability

MIC5396-GMYMX-TR is available at Aetrix Electronics and suitable for smartphone power management, portable medical devices, and industrial handheld scanners requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for MIC5396-GMYMX-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and Flash-IP solutions, serving automotive, industrial, communications, and consumer markets with vertically integrated silicon and software.

The MIC5396-GMYMX-TR belongs to Microchip's low-power dual-LDO family designed specifically for space- and efficiency-critical portable electronics, emphasizing minimal footprint, ultra-low IQ, and robust thermal performance in 1.2 mm × 1.6 mm packages.

FAQ

What are the fixed output voltages of the MIC5396-GMYMX-TR?

The MIC5396-GMYMX-TR provides factory-set outputs of 1.8 V on VOUT1 and 2.8 V on VOUT2. These values are trimmed during production and require no external feedback components-ensuring consistent regulation without resistor tolerance drift or layout sensitivity. The MIC5396-GMYMX-TR does not support adjustable output configurations.

Does the MIC5396-GMYMX-TR include an output discharge function?

No, the MIC5396-GMYMX-TR does not include an output discharge circuit. That feature is exclusive to MIC5397 and MIC5399 variants. When disabled, MIC5396-GMYMX-TR outputs remain floating-external bleed resistors must be added if rapid capacitor discharge is required. This design choice minimizes standby current and simplifies biasing in always-on applications.

Can the enable pins of the MIC5396-GMYMX-TR be left unconnected?

No-EN1 and EN2 pins of the MIC5396-GMYMX-TR must never be left floating. They are CMOS inputs with no internal pull-up or pull-down; undefined logic levels may cause erratic output behavior. External pull-down resistors (e.g., 100 kΩ to GND) or active GPIO control are mandatory. MIC5398/MIC5399 variants include internal pull-downs; MIC5396-GMYMX-TR does not.

What package type is used for the MIC5396-GMYMX-TR?

The MIC5396-GMYMX-TR uses an 8-lead Extra Thin DFN (X2DFN) package measuring 1.6 mm × 1.2 mm × 0.35 mm, with an exposed thermal pad (ePad). This package is distinct from the standard UDFN (MT suffix) and offers lower thermal resistance-critical for sustained 300 mA operation in confined spaces. The "MX" in MIC5396-GMYMX-TR explicitly denotes the X2DFN variant.

Is the MIC5396-GMYMX-TR suitable for automotive applications?

The MIC5396-GMYMX-TR is rated for –40°C to +125°C junction temperature and qualified to AEC-Q200 stress test standards per Microchip's product documentation. While not marketed as an automotive-grade part, its temperature range and robust protection features (thermal shutdown, current limiting) support use in non-safety-critical automotive cabin modules-provided system-level qualification is completed. Always verify against specific vehicle OEM requirements before deployment.

MIC5396-GMYMX-TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
8-XFDFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
2
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
1.8V, 2.8V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.38V @ 300mA, 0.38V @ 300mA
Current - Output:
300mA, 300mA
Current - Quiescent (Iq):
55 µA
Current - Supply (Max):
130 µA
PSRR:
60dB (1kHz)
Control Features:
Enable
Protection Features:
Over Current, Over Temperature
Operating Temperature:
-40°C ~ 125°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-DFN (1.2x1.6)

MIC5396-GMYMX-TR FAQ

1.How can I place an order for MIC5396-GMYMX-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for MIC5396-GMYMX-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for MIC5396-GMYMX-TR reliable?

The price and inventory of MIC5396-GMYMX-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC5396-GMYMX-TR is usually 5 days.

3.What payment methods are accepted for MIC5396-GMYMX-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC5396-GMYMX-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for MIC5396-GMYMX-TR?

MIC5396-GMYMX-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your MIC5396-GMYMX-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for MIC5396-GMYMX-TR?

For technical support, including MIC5396-GMYMX-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC5396-GMYMX-TR requirements.

6.How does Aetrix verify that MIC5396-GMYMX-TR is sourced from the original manufacturer or authorized distributors?

All MIC5396-GMYMX-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC5396-GMYMX-TR meets industry standards.

7.What is the process for return or replacement of MIC5396-GMYMX-TR?

All MIC5396-GMYMX-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC5396-GMYMX-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The MIC5396-GMYMX-TR part is unused and in its original packaging.

Return procedure for MIC5396-GMYMX-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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