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Microchip Technology MIC5399-SGYMX-TR
- Part No.:
- MIC5399-SGYMX-TR
- Manufacturer:
- Microchip Technology
- Package:
- 8-XFDFN Exposed Pad
- Datasheet:
-
MIC5399-SGYMX-TR.pdf
- Description:
- IC REG LINEAR 1.8V/3.3V 8DFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,300
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Product details
Overview
MIC5399-SGYMX-TR from Microchip Technology is a dual-channel, low-power LDO regulator with independent 300 mA outputs, ±2% output voltage accuracy, and integrated output discharge circuitry and enable pull-down resistors. It delivers fixed 3.3V and 1.8V outputs in an ultra-thin 8-lead X2DFN package (1.6 mm × 1.2 mm), optimized for space-constrained battery-powered portable electronics such as smartphones and medical wearables.
For engineers reviewing the MIC5399-SGYMX-TR datasheet, MIC5399-SGYMX-TR pinout, MIC5399-SGYMX-TR application, or MIC5399-SGYMX-TR equivalent, key selection criteria include dual-output independence, 160 mV dropout at full load, 37 µA typical quiescent current per LDO, stability with 1 µF ceramic capacitors, and thermal shutdown protection across –40°C to +125°C.
Technical Context
The MIC5399-SGYMX-TR integrates two fully independent linear regulators sharing only ground and thermal paths - each with dedicated VIN, VOUT, and EN pins. Its architecture supports separate input supplies (2.5V–5.5V) and enables precise sequencing via active-high enables with internal 4 MΩ pull-downs on both EN1 and EN2.
When disabled, the device activates internal 25 Ω NFET discharge paths on both outputs to rapidly deplete external capacitors - a critical feature for system-level power-down integrity. It achieves 60 dB PSRR at 1 kHz and maintains regulation down to zero load without oscillation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | 3.3V (LDO1) and 1.8V (LDO2) - fixed, factory-trimmed outputs requiring no external feedback components. |
| Max Output Current | 300 mA per channel - supports simultaneous high-current loads like RF transceivers and application processors. |
| Dropout Voltage | 160 mV at 300 mA - enables operation from single-cell Li-ion (3.6V nominal) while sustaining 3.3V/1.8V rails. |
| Quiescent Current | 37 µA per LDO (typ.) - minimizes standby power loss in always-on subsystems such as real-time clocks or sensors. |
| Accuracy | ±2% over –40°C to +125°C - ensures reliable logic-level compliance for I/O interfaces and memory subsystems. |
| PSRR | 60 dB at 1 kHz - suppresses switching noise from adjacent DC/DC converters feeding shared input rails. |
| Thermal Shutdown | Active at +125°C junction - protects against sustained overload in compact PCB layouts with limited airflow. |
Pinout & Package
Package: 8-lead Extra Thin DFN (X2DFN), 1.6 mm × 1.2 mm × 0.35 mm body, exposed thermal pad (ePad) connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4 | GND | Common analog/digital ground reference; ePad must be soldered to PCB ground plane for thermal and electrical performance. |
| 2 | VOUT1 | 3.3V regulated output; requires ≥1 µF ceramic capacitor to ground for stability and transient response. |
| 3 | VOUT2 | 1.8V regulated output; independently regulated and discharged when EN2 = low. |
| 5 | EN2 | Active-high enable for LDO2; internal 4 MΩ pull-down ensures safe default-off state during MCU reset or floating control lines. |
| 6 | VIN2 | Input supply for LDO2; accepts 2.5V–5.5V; decoupling capacitor required between VIN2 and GND. |
| 7 | VIN1 | Input supply for LDO1; electrically isolated from VIN2 - allows optimization of input sources (e.g., buck vs. battery). |
| 8 | EN1 | Active-high enable for LDO1; same pull-down behavior as EN2 - eliminates need for external biasing resistors. |
| EP | ePad | Exposed thermal pad; must be connected to solid GND copper area with ≥4 thermal vias for thermal resistance reduction. |
Key Features
| Feature | Design Value |
|---|---|
| Independent power inputs | Enables mixed-supply designs - e.g., VIN1 from PMIC buck, VIN2 from coin cell - without cross-regulation coupling. |
| Output discharge circuit | 25 Ω internal NFET per output discharges VOUT1/VOUT2 within microseconds upon disable - prevents back-powering or latch-up in multi-rail systems. |
| Enable pull-down resistor | 4 MΩ internal resistor on EN1/EN2 guarantees defined OFF state during boot, sleep, or signal glitches - removes external pull-down components. |
| Stable with 1 µF ceramic caps | Eliminates need for large bulk capacitance; reduces BOM count and board area in ultra-portable form factors. |
| Low dropout at full load | 160 mV dropout at 300 mA allows >95% efficiency at 3.3V out from 3.6V input - extends battery runtime in portable devices. |
Applications
| Smartphone Power Management | Portable Medical Sensor Hub |
|---|---|
Use Scenario: Dual-rail power for application processor core (1.8V) and I/O interface (3.3V) in LTE-enabled handsets. IC Role / Device Role / Timing Role: Primary dual-LDO regulator providing sequenced, low-noise, independently enabled supplies. Use Value: Enables fast power-state transitions via independent EN pins and eliminates external discharge FETs using integrated 25 Ω NFETs. |
Use Scenario: Powering ECG front-end analog circuitry (1.8V) and BLE radio subsystem (3.3V) in wearable patch monitors. IC Role / Device Role / Timing Role: Low-quiescent, high-accuracy dual regulator ensuring sensor precision and wireless link reliability. Use Value: ±2% accuracy maintains ADC reference stability; 37 µA quiescent current extends battery life beyond 7 days in intermittent-sampling mode. |
| DSC & PMP Audio Subsystem | Industrial Handheld Terminal |
Use Scenario: Supplying DSP core (1.8V) and audio codec (3.3V) in digital still cameras with real-time image processing. IC Role / Device Role / Timing Role: Dual LDO delivering clean, low-ripple power to noise-sensitive analog and digital blocks. Use Value: 60 dB PSRR at 1 kHz suppresses switching noise from camera flash drivers and autofocus motors. |
Use Scenario: Powering ARM Cortex-M4 MCU (1.8V) and RS-485 transceiver (3.3V) in ruggedized barcode scanners. IC Role / Device Role / Timing Role: Industrial-grade dual LDO supporting extended temperature operation (–40°C to +125°C). Use Value: Thermal shutdown and current limiting protect against field-induced overloads; X2DFN package withstands mechanical shock and vibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIC5399-SMYMX-TR | Fixed 3.3V/2.8V outputs instead of 3.3V/1.8V; identical package, enable/discharge features, and specs. | Suitable for systems requiring 2.8V I/O rail (e.g., LPDDR2 memory) rather than 1.8V logic core. | Select MIC5399-SMYMX-TR if 2.8V output is needed; otherwise MIC5399-SGYMX-TR provides optimal voltage pairing for modern low-VDD cores. |
| TPL7407LDR | Single 300 mA LDO with 3.3V output only; no second channel, no discharge circuit, no enable pull-down; SOT-23-5 package. | Requires two discrete devices to replicate dual-rail functionality; lacks auto-discharge and tri-state-safe enable. | Use only when space permits two separate regulators and discharge timing is managed externally via GPIO-controlled FETs. |
Compared with MIC5399-SMYMX-TR, MIC5399-SGYMX-TR offers better voltage matching for 1.8V-core + 3.3V-peripheral architectures; compared with TPL7407LDR, it reduces component count by 50%, eliminates layout complexity for dual-rail sequencing, and adds critical safety features like automatic output discharge.
Availability
MIC5399-SGYMX-TR is available at Aetrix Electronics and suitable for smartphone power management, portable medical sensor hubs, DSC audio subsystems, and industrial handheld terminals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for MIC5399-SGYMX-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog devices, and power management ICs, serving automotive, industrial, and consumer markets with high-reliability semiconductor solutions.
The MIC5399 family is designed specifically for dual-rail, low-power portable electronics - integrating output discharge, enable pull-down, and ultra-small packaging to reduce system-level design effort and bill-of-materials cost.
FAQ
What are the fixed output voltages of the MIC5399-SGYMX-TR?
The MIC5399-SGYMX-TR provides factory-set outputs of 3.3V on VOUT1 and 1.8V on VOUT2. These values are laser-trimmed during production and require no external resistive feedback network. The voltage option "SG" in the part number explicitly denotes this 3.3V/1.8V configuration per Microchip's Product Identification System.
Does the MIC5399-SGYMX-TR require external pull-down resistors on its enable pins?
No. The MIC5399-SGYMX-TR includes internal 4 MΩ pull-down resistors on both EN1 and EN2 pins, ensuring a defined OFF state when control signals are tri-stated or unconnected. This eliminates the need for external components and improves system robustness during power-up, reset, or firmware initialization sequences.
How does the output discharge function work in the MIC5399-SGYMX-TR?
When either EN1 or EN2 is driven low, the MIC5399-SGYMX-TR activates an internal 25 Ω NFET between the corresponding VOUT pin and GND. This provides a controlled discharge path for the output capacitor, reducing VOUT to near-zero within microseconds. This prevents back-powering of upstream circuitry and supports clean power-down sequencing in multi-rail systems.
What package type and dimensions does the MIC5399-SGYMX-TR use?
The MIC5399-SGYMX-TR uses an 8-lead Extra Thin DFN (X2DFN) package measuring 1.6 mm × 1.2 mm × 0.35 mm with an exposed thermal pad (ePad). Per Microchip Drawing C04-01260 Rev B, the pitch is 0.4 mm, terminal width is 0.18 mm, and the ePad size is 1.30 mm × 0.30 mm - optimized for high-density portable PCB layouts.
Can the MIC5399-SGYMX-TR operate with ceramic output capacitors smaller than 10 µF?
Yes. The MIC5399-SGYMX-TR is specifically characterized and guaranteed stable with ≥1 µF X5R/X7R ceramic output capacitors - no larger values are required. Increasing capacitance beyond 1 µF yields negligible improvement in transient response or PSRR, and may increase start-up time or risk overshoot during enable transitions.
MIC5399-SGYMX-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 2
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.8V, 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.38V @ 300mA, 0.38V @ 300mA
- Current - Output:
- 300mA, 300mA
- Current - Quiescent (Iq):
- 55 µA
- Current - Supply (Max):
- 130 µA
- PSRR:
- 60dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DFN (1.2x1.6)
MIC5399-SGYMX-TR FAQ
1.How can I place an order for MIC5399-SGYMX-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC5399-SGYMX-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC5399-SGYMX-TR reliable?
The price and inventory of MIC5399-SGYMX-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC5399-SGYMX-TR is usually 5 days.
3.What payment methods are accepted for MIC5399-SGYMX-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC5399-SGYMX-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC5399-SGYMX-TR?
MIC5399-SGYMX-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC5399-SGYMX-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC5399-SGYMX-TR?
For technical support, including MIC5399-SGYMX-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC5399-SGYMX-TR requirements.
6.How does Aetrix verify that MIC5399-SGYMX-TR is sourced from the original manufacturer or authorized distributors?
All MIC5399-SGYMX-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC5399-SGYMX-TR meets industry standards.
7.What is the process for return or replacement of MIC5399-SGYMX-TR?
All MIC5399-SGYMX-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC5399-SGYMX-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC5399-SGYMX-TR part is unused and in its original packaging.
Return procedure for MIC5399-SGYMX-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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