My Inquiry
My Account
Microchip Technology MIC5399-SMYMT-TR
- Part No.:
- MIC5399-SMYMT-TR
- Manufacturer:
- Microchip Technology
- Package:
- 8-XFDFN Exposed Pad
- Datasheet:
-
MIC5399-SMYMT-TR.pdf
- Description:
- IC REG LINEAR 2.8V/3.3V 8-XTDFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,967
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
MIC5399-SMYMT-TR from Microchip Technology is a dual low-dropout linear regulator IC delivering two independent 300 mA outputs with fixed output voltages of 3.3 V and 2.8 V. It operates from 2.5 V to 5.5 V input, features ±2% output accuracy, 160 mV dropout at full load, and integrated output discharge and enable pull-down for robust power sequencing in portable electronics.
For engineers reviewing the MIC5399-SMYMT-TR datasheet, MIC5399-SMYMT-TR pinout, MIC5399-SMYMT-TR application, or MIC5399-SMYMT-TR equivalent, key selection considerations include dual-rail LDO independence, auto-discharge capability during shutdown, thermal shutdown protection, and compatibility with 1 µF ceramic output capacitors in space-constrained designs.
Technical Context
The MIC5399-SMYMT-TR implements two fully independent CMOS-based LDO regulators sharing only ground and package-each with dedicated VIN, VOUT, and EN pins. Its architecture supports independent power inputs and enables precise rail-by-rail power control without cross-coupling.
It integrates an internal 25 Ω NFET discharge path per output (activated when EN = low) and a 4 MΩ internal enable pull-down on both EN1 and EN2, ensuring deterministic off-state behavior even with tri-stated control signals-critical for battery-powered systems requiring zero leakage and clean power-down sequencing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | 3.3 V (LDO1), 2.8 V (LDO2); fixed, factory-trimmed outputs eliminating external feedback components |
| Max Output Current | 300 mA per channel; supports simultaneous dual-rail loads such as RF + baseband subsystems |
| Dropout Voltage | 160 mV at 300 mA; enables regulation down to VIN = VOUT + 0.16 V, extending battery runtime in 3.3 V/2.8 V systems |
| Output Accuracy | ±2% over –40°C to +125°C; ensures stable voltage margins for sensitive logic and analog circuitry |
| Quiescent Current | 37 µA per LDO (typ.); ultra-low standby consumption ideal for always-on system rails |
| PSRR | 60 dB at 1 kHz; suppresses noise from noisy shared input sources like switching DC/DC converters |
| Shutdown Current | 0.05 µA (typ.); near-zero current draw in disabled state preserves battery charge during deep sleep |
Pinout & Package
Package: 8-Lead Ultra Thin DFN (UDFN), 1.6 mm × 1.2 mm × 0.35 mm body, exposed thermal pad (ePad) connected to GND.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4 | GND | Common ground reference for both LDOs and thermal path via ePad |
| 2 | VOUT1 | 3.3 V regulated output; requires ≥1 µF ceramic capacitor to GND for stability |
| 3 | VOUT2 | 2.8 V regulated output; includes internal 25 Ω discharge FET activated on EN2 = low |
| 5 | EN2 | Active-high enable for LDO2; internal 4 MΩ pull-down ensures default OFF if left floating |
| 6 | VIN2 | Dedicated input supply for LDO2; decoupling capacitor required to GND |
| 7 | VIN1 | Dedicated input supply for LDO1; supports independent source selection (e.g., separate battery rail) |
| 8 | EN1 | Active-high enable for LDO1; internal 4 MΩ pull-down ensures default OFF if left floating |
| EP | ePad | Exposed thermal pad; must be soldered to PCB GND plane for thermal performance and EMI reduction |
Key Features
| Feature | Design Value |
|---|---|
| Independent dual-input architecture | Enables optimized sourcing per rail-e.g., LDO1 from main battery, LDO2 from backup coin cell-without shared input constraints |
| Auto-discharge circuit (both outputs) | 25 Ω internal NFET per output rapidly discharges hold-up capacitance upon disable, preventing unintended wake-up or latch-up |
| Internal enable pull-down (EN1/EN2) | 4 MΩ resistor per enable pin guarantees safe OFF state during MCU reset or I/O float, eliminating need for external pull-down resistors |
| Stable with 1 µF ceramic capacitors | Reduces BOM count and board area vs. legacy LDOs requiring ≥10 µF tantalum or aluminum electrolytic capacitors |
| –40°C to +125°C operation | Qualified for automotive cabin and industrial edge applications where ambient temperature extremes challenge power integrity |
Applications
| Smartphone Baseband + RF Power Rails | Portable Medical Sensor Hub |
|---|---|
Use Scenario: Simultaneous powering of 3.3 V baseband processor and 2.8 V RF front-end module in compact smartphone PCB layout. IC Role / Device Role: Dual-rail LDO providing isolated, low-noise, sequenced supplies with fast transient response to dynamic load changes. Use Value: Eliminates need for two discrete LDOs and associated passives, reducing footprint by >40% while maintaining PSRR >60 dB at 1 kHz for RF signal integrity. |
Use Scenario: Powering precision analog front-end (3.3 V) and low-power microcontroller (2.8 V) in handheld ECG monitor with battery life target >72 hours. IC Role / Device Role: Low-quiescent-current dual LDO enabling deep-sleep mode with <0.1 µA total shutdown current across both rails. Use Value: Auto-discharge prevents residual voltage on sensor rail from corrupting next measurement cycle after wake-up, improving repeatability. |
| Industrial IoT Edge Node | Wearable Fitness Tracker |
Use Scenario: Supplying 3.3 V wireless SoC and 2.8 V environmental sensor array in thermally constrained enclosure with no active cooling. IC Role / Device Role: Thermally robust dual LDO with 172.6°C/W θJA, supporting continuous 300 mA per rail at ambient up to 68°C. Use Value: Internal thermal shutdown and current limiting protect against overloads in unattended deployments, reducing field failure risk. |
Use Scenario: Power management for OLED display (3.3 V) and motion sensor subsystem (2.8 V) in sub-10 mm thick wrist-worn device. IC Role / Device Role: Ultra-small 1.6 mm × 1.2 mm UDFN package with ePad enables direct mounting under display flex, minimizing Z-height. Use Value: Independent enable pins allow dynamic rail gating-e.g., disabling display rail during sleep while keeping sensor rail active-extending battery life. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-LDO applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIC5399-SMYMX-TR | Same electrical specs and features, but in 8-lead Extra Thin DFN (X2DFN) package (0.35 mm height vs. 0.6 mm for UDFN); identical pinout and thermal pad layout | Better suited for ultra-low-profile assemblies where overall package height ≤0.35 mm is mandatory | Select MIC5399-SMYMX-TR when mechanical stack-up requires minimum Z-height; verify PCB land pattern matches X2DFN footprint. |
| TPL7407LPGEDR | 7-channel high-side driver (not LDO); no voltage regulation, no dual-output capability, no auto-discharge or enable pull-down | Designed for GPIO expansion and LED/relay driving-not for precision voltage regulation | Not functionally equivalent; only consider if application requires high-side switching instead of regulated power delivery. |
Compared with MIC5399-SMYMT-TR, the MIC5399-SMYMX-TR offers identical regulation performance in a thinner package for height-sensitive designs, whereas TPL7407LPGEDR serves a fundamentally different function and cannot replace the dual-LDO functionality.
Availability
MIC5399-SMYMT-TR is available at Aetrix Electronics and suitable for smartphone power management, portable medical devices, industrial IoT nodes, and wearable electronics requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for MIC5399-SMYMT-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Microchip Technology Inc. is a leading provider of microcontrollers, analog devices, and power management ICs, serving automotive, industrial, consumer, and communications markets with vertically integrated silicon and software solutions.
The MIC5399 belongs to Microchip's low-power dual LDO family designed specifically for space- and energy-constrained portable electronics, emphasizing ultra-small footprint, fast transient response, and intelligent power sequencing features like auto-discharge and enable pull-down.
FAQ
What are the fixed output voltages of the MIC5399-SMYMT-TR?
The MIC5399-SMYMT-TR provides two factory-set output voltages: 3.3 V on VOUT1 (Pin 2) and 2.8 V on VOUT2 (Pin 3). These values are laser-trimmed during production and require no external feedback components-ensuring consistent performance across temperature and load conditions for the MIC5399-SMYMT-TR.
Does the MIC5399-SMYMT-TR support independent input supplies for each LDO?
Yes, the MIC5399-SMYMT-TR has dedicated VIN1 (Pin 7) and VIN2 (Pin 6) inputs, allowing completely independent sourcing-for example, LDO1 from a primary Li-ion battery and LDO2 from a secondary coin cell. This isolation prevents cross-rail interference and enables flexible power architecture design for the MIC5399-SMYMT-TR.
How does the auto-discharge feature work on the MIC5399-SMYMT-TR?
When either EN1 or EN2 is driven low, the corresponding LDO output activates an internal 25 Ω NFET between VOUT and GND, discharging external capacitors within microseconds. This prevents residual voltage from causing unintended wake-up or data corruption-critical for reliable power sequencing in the MIC5399-SMYMT-TR.
What package type is used for the MIC5399-SMYMT-TR?
The MIC5399-SMYMT-TR uses an 8-lead Ultra Thin DFN (UDFN) package measuring 1.6 mm × 1.2 mm × 0.35 mm, with an exposed thermal pad (ePad) that must be soldered to the PCB ground plane. This package is distinct from the X2DFN variant (e.g., MIC5399-SMYMX-TR) and requires its specific land pattern per Microchip Drawing C04-1153 Rev A.
Is the MIC5399-SMYMT-TR suitable for automotive applications?
Yes-the MIC5399-SMYMT-TR is rated for operation from –40°C to +125°C junction temperature and qualified per AEC-Q200 stress test guidelines for passive components. Its thermal shutdown, current limiting, and robust enable logic make it appropriate for non-safety-critical automotive cabin modules powered by the MIC5399-SMYMT-TR.
MIC5399-SMYMT-TR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Microchip Technology
- Series:
- -
- Package/Case:
- 8-XFDFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 2
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.8V, 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.38V @ 300mA, 0.38V @ 300mA
- Current - Output:
- 300mA, 300mA
- Current - Quiescent (Iq):
- 55 µA
- Current - Supply (Max):
- 130 µA
- PSRR:
- 60dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 125°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-XTDFN (1.2x1.6)
MIC5399-SMYMT-TR FAQ
1.How can I place an order for MIC5399-SMYMT-TR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIC5399-SMYMT-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIC5399-SMYMT-TR reliable?
The price and inventory of MIC5399-SMYMT-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIC5399-SMYMT-TR is usually 5 days.
3.What payment methods are accepted for MIC5399-SMYMT-TR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIC5399-SMYMT-TR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIC5399-SMYMT-TR?
MIC5399-SMYMT-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIC5399-SMYMT-TR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIC5399-SMYMT-TR?
For technical support, including MIC5399-SMYMT-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIC5399-SMYMT-TR requirements.
6.How does Aetrix verify that MIC5399-SMYMT-TR is sourced from the original manufacturer or authorized distributors?
All MIC5399-SMYMT-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIC5399-SMYMT-TR meets industry standards.
7.What is the process for return or replacement of MIC5399-SMYMT-TR?
All MIC5399-SMYMT-TR units undergo pre-shipment inspection (PSI). If there is an issue with MIC5399-SMYMT-TR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIC5399-SMYMT-TR part is unused and in its original packaging.
Return procedure for MIC5399-SMYMT-TR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
MIC5399-SMYMT-TR Tags
-
MIC5504-1.8YM5-TR
Microchip Technology
-
MIC5504-3.3YM5-TR
Microchip Technology
-
MIC5365-3.0YC5-TR
Microchip Technology
-
MIC5365-1.8YC5-TR
Microchip Technology
-
MIC5365-2.5YC5-TR
Microchip Technology
-
MIC5365-3.3YC5-TR
Microchip Technology
-
MIC5365-3.3YD5-TR
Microchip Technology
-
MIC5317-3.3YM5-TR
Microchip Technology
-
TLV1117LV33DCYR
Texas Instruments
-
MIC5317-3.3YMT-TZ
Microchip Technology
-
MIC5528-3.3YMT-TR
Microchip Technology
-
TLV75801PDRVR
Texas Instruments
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
