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NXP Semiconductors MIMX8DL1AVNFZABR
- Part No.:
- MIMX8DL1AVNFZABR
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 388-LFBGA
- Datasheet:
-
MIMX8DL1AVNFZABR.pdf
- Description:
- I.MX8 DXL 15SQ
- Quantity:
- Payment:
- Shipping:
Inventory:2,671
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Product details
Overview
MIMX8DL1AVNFZABR from NXP Semiconductors is an automotive-grade i.MX 8XLite applications processor featuring dual Arm Cortex-A35 cores @1.2 GHz, one Cortex-M4F core @264 MHz, 16-bit LPDDR4 @1200 MHz with inline ECC, PCIe 3.0 (1-lane), and triple CAN/CAN-FD - deployed in infotainment head units and V2X telematics gateways.
For engineers reviewing the MIMX8DL1AVNFZABR datasheet, MIMX8DL1AVNFZABR pinout, MIMX8DL1AVNFZABR application, or MIMX8DL1AVNFZABR equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FIPS 140-3 non-certified security configuration, bare-die FCPBGA 15×15 mm package with mixed 0.56/0.8 mm pitch, and SCU-managed power domain partitioning.
Technical Context
The MIMX8DL1AVNFZABR implements a heterogeneous multicore architecture: dual AArch64 Cortex-A35 cores support virtualization extensions and run Linux-based infotainment stacks, while the tightly coupled Cortex-M4F handles real-time vehicle bus arbitration and sensor preprocessing. The System Control Unit (SCU) manages boot ROM, resource domain control, and PMIC interface via dedicated I²C.
Memory subsystem includes LPDDR4 @1200 MHz with inline ECC for safety-critical code execution and DDR3L @933 MHz with ECC for legacy compatibility; FlexSPI enables secure fast boot from SPI NOR flash, and GPMI supports NAND with 62-bit BCH ECC for firmware storage resilience.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Cortex-A35 @1.2 GHz + single Cortex-M4F @264 MHz - enables concurrent OS execution and deterministic real-time response. |
| Memory Interface | 16-bit LPDDR4 @1200 MHz with inline ECC - delivers 19.2 GB/s bandwidth and hardware error correction for ASIL-B–aligned memory integrity. |
| Connectivity | 1× PCIe 3.0 (1-lane), 3× CAN/CAN-FD, 2× USB 2.0, 2× Gigabit Ethernet (1× AVB, 1× TSN) - supports ADAS sensor fusion and time-synchronized vehicle networking. |
| Audio & Timing | 4× SAI (2× TX/RX, 2× RX-only), SPDIF Tx/Rx, ASRC supporting 10-channel sample rate conversion - enables multi-zone audio processing without external DSP. |
| Security | CAAM cryptographic accelerator, Secure JTAG (SJC), SNVS with tamper detection, 64 KB secure RAM - provides hardware root of trust for secure boot and OTA updates. |
| Package | FCPBGA, 15×15 mm, 0.56/0.8 mm mixed pitch, bare die - optimized for automotive thermal dissipation and board-level reliability under vibration. |
| Temperature Grade | Automotive: −40°C to +125°C junction - qualified per AEC-Q100 Grade 2 for under-hood and dashboard deployment. |
Pinout & Package
FCPBGA package with 15 mm × 15 mm footprint, 0.56 mm pitch for high-density signal balls and 0.8 mm pitch for power/ground balls - supports controlled impedance routing and thermal pad soldering to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main core supply | 1.0 V ±3% input for Cortex-A35/M4F logic; requires low-noise regulation and local decoupling for timing stability. |
| VDD_DDR_VDDQ | DDR I/O supply | 1.1 V ±3% for LPDDR4/DDR3L data bus - critical for signal integrity in high-speed memory interfaces. |
| OSC24M / OSC32K | Primary clock sources | 24 MHz crystal input for PLL reference; 32 kHz crystal for RTC and low-power wake-up - both routed with tight length matching and guard rings. |
| PCIe_RXn/PCIe_TXn | PCIe differential pair | AC-coupled 100 Ω differential lanes - require strict 8–12 mil trace width, 5-mil spacing, and no stubs for Gen3 compliance. |
| CAN_H/CAN_L | CAN transceiver interface | Three independent differential pairs supporting CAN FD up to 5 Mbps - each requires common-mode choke and 120 Ω termination at node end. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Core Partitioning | Dual A35 cores handle Linux GUI/media stack; M4F runs real-time CAN message filtering and watchdog supervision - eliminates RTOS coexistence complexity. |
| Inline Memory Encryption (IEE) | On-the-fly AES-XTS encryption/decryption of FlexSPI and DRAM traffic - protects firmware images and runtime data without software overhead. |
| ASRC Audio Processing | Hardware-accelerated asynchronous sample rate conversion across 10 channels at ≤−120 dB THD+N - enables simultaneous voice assistant, navigation, and media playback at different sampling rates. |
| Secure Boot with HAB | Hardware Authentication Block enforces signed image verification using eFUSE-stored public keys - prevents unauthorized firmware execution at power-on reset. |
| Resource Domain Controller (RDC) | Configurable firewall gates memory and peripheral access per core - isolates A35 Linux domain from M4F real-time domain and SCU security domain. |
Applications
| Infotainment Head Unit | V2X Telematics Gateway |
|---|---|
Use Scenario: Central display unit integrating navigation, media streaming, Bluetooth telephony, and rear-seat entertainment in premium vehicles. IC Role / Device Role / Timing Role: Primary applications processor executing Android Automotive OS; synchronizes audio/video rendering via ASRC and SAI modules with sub-10 µs jitter. Use Value: Dual A35 cores deliver >2,000 DMIPS for concurrent UI rendering and media decode; integrated TSN Ethernet ensures deterministic OTA update delivery. |
Use Scenario: In-vehicle gateway aggregating DSRC/WAVE, cellular C-V2X, and CAN bus data for cooperative awareness and hazard warning. IC Role / Device Role / Timing Role: Real-time protocol bridge with Cortex-M4F handling CAN FD frame parsing and timestamping; A35 cores run V2X stack and TLS encryption. Use Value: Triple CAN/CAN-FD interfaces enable direct connection to chassis, powertrain, and ADAS ECUs; PCIe 3.0 supports high-bandwidth C-V2X modem offload. |
| ADAS Sensor Fusion Hub | Digital Cluster Controller |
Use Scenario: Aggregation point for camera, radar, and ultrasonic sensor data prior to AI inference on companion SoC or MCU. IC Role / Device Role / Timing Role: Preprocessing engine performing timestamp alignment, packet reassembly, and metadata tagging using eDMA and GPT timers. Use Value: 3× eDMA controllers with 96 total channels enable zero-copy sensor data movement; LPDDR4 ECC prevents silent corruption in safety-critical metadata paths. |
Use Scenario: High-resolution TFT instrument cluster rendering speedometer, ADAS alerts, and navigation turn-by-turn with animated transitions. IC Role / Device Role / Timing Role: Graphics-capable applications processor driving LCDIF controller with 24-bit RGB output and hardware composition engine. Use Value: Integrated 256 KB L2 cache with ECC reduces GPU stall cycles; 3.3 V/1.8 V GPIO supports direct LED dimming and haptic feedback actuation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8DL2AVNFZAB | FIPS 140-3 certified for SECO and V2X subsystems; identical core count, memory, and I/O specs. | Required for government fleet or Tier-1 OEMs mandating cryptographic module validation in telematics systems. | Select when regulatory compliance for secure boot and key management is contractually required. |
| MIMX8SL1AVNFZAB | Single Cortex-A35 core @1.2 GHz; same M4F, memory, and peripheral set; lower thermal envelope. | Suitable for cost-sensitive digital clusters or entry-level infotainment where Linux concurrency demands are reduced. | Choose for BOM cost optimization where dual-core parallelism is unnecessary and thermal budget is constrained. |
Compared with MIMX8DL1AVNFZABR, MIMX8DL2AVNFZAB adds FIPS 140-3 certification for cryptographic operations but shares identical performance and packaging - while MIMX8SL1AVNFZAB trades one A35 core for lower power and cost, retaining full peripheral compatibility for scaled-down automotive HMI designs.
Availability
MIMX8DL1AVNFZABR is available at Aetrix Electronics and suitable for automotive infotainment head units, V2X telematics gateways, and ADAS sensor fusion hubs requiring stable component supply across extended production lifecycles.
Supply support for MIMX8DL1AVNFZABR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The i.MX 8XLite family targets automotive infotainment and V2X applications, delivering scalable multicore performance with integrated safety, security, and real-time capabilities in compact packaging.
FAQ
What is the operating temperature range for MIMX8DL1AVNFZABR?
MIMX8DL1AVNFZABR is rated for automotive Grade 2 operation from −40°C to +125°C junction temperature. This specification meets AEC-Q100 requirements for under-dash and center-console deployment. Thermal design must ensure die temperature remains within this range under worst-case ambient and power dissipation conditions, verified using the device's internal TEMPMON sensor and SCU-controlled throttling.
Does MIMX8DL1AVNFZABR support secure boot, and how is it implemented?
Yes, MIMX8DL1AVNFZABR implements secure boot via the Hardware Authentication Block (HAB) and Secure Non-Volatile Storage (SNVS). During power-on reset, the boot ROM verifies signed images using eFUSE-programmed public keys; only authenticated firmware loads into OCRAM. MIMX8DL1AVNFZABR does not include FIPS 140-3 certification, distinguishing it from MIMX8DL2AVNFZAB variants.
What memory types and speeds are supported by MIMX8DL1AVNFZABR?
MIMX8DL1AVNFZABR supports 16-bit LPDDR4 at 1200 MHz with inline ECC and 16-bit DDR3L at 933 MHz with inline ECC. It also integrates FlexSPI for boot from Quad/Octal SPI NOR flash and GPMI for NAND with 62-bit BCH ECC. These interfaces are electrically and logically distinct - LPDDR4 and DDR3L share the same controller but require separate layout and power domains.
How many CAN interfaces does MIMX8DL1AVNFZABR provide, and what protocols are supported?
MIMX8DL1AVNFZABR integrates three FlexCAN modules supporting both classical CAN 2.0B and CAN with Flexible Data Rate (CAN FD) up to 5 Mbps. Each CAN controller operates independently with dedicated message buffers, FIFOs, and error counters. CAN FD support includes ISO 11898-1:2015 compliant bit-rate switching and payload lengths up to 64 bytes - essential for high-throughput vehicle diagnostics and ADAS data exchange.
Is PCIe 3.0 functionality fully enabled on MIMX8DL1AVNFZABR, and what are the implementation constraints?
MIMX8DL1AVNFZABR includes PCIe 3.0 PHY IP capable of 1-lane operation at 8 GT/s, with backward compatibility to PCIe 1.0 and 2.0. Full Gen3 compliance requires validation with NXP's reference design and PHY tuning parameters; actual link training success depends on board-level signal integrity, AC coupling capacitor selection, and endpoint compatibility. The PCIe controller supports MSI-X and DMA mapping via the SMMU.
MIMX8DL1AVNFZABR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-LFBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 388-LBGA (15x15)
- Additional Interfaces:
- -
MIMX8DL1AVNFZABR FAQ
1.How can I place an order for MIMX8DL1AVNFZABR through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8DL1AVNFZABR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8DL1AVNFZABR reliable?
The price and inventory of MIMX8DL1AVNFZABR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8DL1AVNFZABR is usually 5 days.
3.What payment methods are accepted for MIMX8DL1AVNFZABR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8DL1AVNFZABR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8DL1AVNFZABR?
MIMX8DL1AVNFZABR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8DL1AVNFZABR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8DL1AVNFZABR?
For technical support, including MIMX8DL1AVNFZABR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8DL1AVNFZABR requirements.
6.How does Aetrix verify that MIMX8DL1AVNFZABR is sourced from the original manufacturer or authorized distributors?
All MIMX8DL1AVNFZABR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8DL1AVNFZABR meets industry standards.
7.What is the process for return or replacement of MIMX8DL1AVNFZABR?
All MIMX8DL1AVNFZABR units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8DL1AVNFZABR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8DL1AVNFZABR part is unused and in its original packaging.
Return procedure for MIMX8DL1AVNFZABR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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