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NXP Semiconductors MIMX8DL1AVNFZBA
- Part No.:
- MIMX8DL1AVNFZBA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 388-LFBGA
- Datasheet:
-
MIMX8DL1AVNFZBA.pdf
- Description:
- I.MX 8DUALXLITE A1 PRODUCTION PN
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
MIMX8DL1AVNFZBA from NXP Semiconductors is an automotive-grade i.MX 8XLite applications processor featuring dual Arm Cortex-A35 cores @1.2 GHz, one Cortex-M4F core @264 MHz, 16-bit LPDDR4 @1200 MHz with inline ECC, PCIe 3.0 (1-lane), and triple CAN-FD - deployed in infotainment head units and V2X telematics gateways.
For engineers reviewing the MIMX8DL1AVNFZBA datasheet, MIMX8DL1AVNFZBA pinout, MIMX8DL1AVNFZBA application, or MIMX8DL1AVNFZBA equivalent, key selection criteria include automotive temperature grade (−40°C to +125°C), FIPS 140-3 non-certified security configuration, SCU-managed power domains, and mixed-pitch FCPBGA-376 package compatibility with i.MX 8X platform design rules.
Technical Context
The MIMX8DL1AVNFZBA implements a heterogeneous multicore architecture: dual Cortex-A35 cores execute Linux-based infotainment stacks with AArch64 virtualization support, while the Cortex-M4F handles real-time vehicle bus arbitration, sensor fusion, and safety-critical boot firmware via dedicated LPUART and LPI2C interfaces.
Its System Control Unit (SCU) manages power states, clock gating, reset sequencing, and PMIC communication over a dedicated I²C channel; memory subsystems include LPDDR4/DDR3L with inline ECC, FlexSPI for secure boot from NOR flash, and GPMI with BCH-62 ECC for NAND storage - all coordinated under Resource Domain Controller (RDC) enforcement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A35 @1.2 GHz + single Cortex-M4F @264 MHz - enables concurrent OS execution and deterministic real-time control without RTOS co-location overhead. |
| Memory Interface | 16-bit LPDDR4 @1200 MHz with inline ECC - delivers 19.2 GB/s bandwidth and fault-tolerant operation for graphics and multimedia buffers. |
| Connectivity | 1× PCIe 3.0 (1-lane), 2× USB 2.0, 2× 1Gb Ethernet (1× AVB, 1× TSN), 3× CAN-FD - supports camera link, OTA update routing, and time-synchronized ADAS data aggregation. |
| Analog & I/O | 6-channel 12-bit ADC, 32-bit GPIO (3.3 V/1.8 V), 4× LPSPI, 6× UART (including SCU- and M4F-dedicated instances) - enables direct sensor interfacing and legacy automotive peripheral integration. |
| Security | CAAM cryptographic accelerator, SECO subsystem, Secure JTAG (SJC), 64 KB secure RAM - provides hardware-enforced key management and tamper detection but excludes FIPS 140-3 certification. |
| Package | FCPBGA, 15 mm × 15 mm, 0.56 mm / 0.8 mm mixed pitch, 376-ball layout - matches i.MX 8X mechanical footprint for drop-in PCB reuse across automotive platforms. |
Pinout & Package
Package: FCPBGA-376, 15 mm × 15 mm, 0.56 mm / 0.8 mm mixed ball pitch, bare die construction per NXP Package Drawing SOT1222-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main core supply | 1.0 V ±3% input for Cortex-A35/M4F logic; requires low-noise regulation and dedicated decoupling per IMX8XLB0AEC Section 3.2.4. |
| VDD_DDR_VDDQ | DDR I/O supply | 1.1 V ±3% for LPDDR4/DDR3L DQ/DQS; must be sequenced after VDD_MAIN and before VDD_MEMC per power-up timing requirements. |
| OSC24M / OSC32K | Primary clock sources | 24 MHz crystal input (PLL reference) and 32 kHz crystal (RTC/SCU always-on domain); both require external load capacitors and isolation from noisy traces. |
| BOOT_MODE[3:0] | Boot configuration | Strapped at power-on to select boot device (FlexSPI NOR, eMMC, SD, NAND); values defined in IMX8XLB0AEC Table 4-1 and require pull-up/pull-down resistors. |
| PCIe_TXP/N, PCIe_RXP/N | PCIe 3.0 differential pair | AC-coupled 100 Ω differential signaling interface supporting Gen3 speed; requires controlled impedance routing and length matching ≤5 mil. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Core Partitioning | Separate A35 (Linux-capable) and M4F (real-time deterministic) execution environments with dedicated interrupt controllers (GIC-500 + NVIC), enabling ASIL-B–compliant software partitioning. |
| Automotive Memory Reliability | LPDDR4 and DDR3L interfaces with inline ECC detect and correct single-bit errors transparently - eliminating need for software ECC overhead in safety-critical memory regions. |
| Secure Boot Enforcement | Hardware-rooted boot flow using HAB (High Assurance Boot) with OCOTP fuses and CAAM-backed signature verification - prevents unauthorized firmware execution at power-on. |
| Time-Sensitive Networking Support | Integrated TSN-capable Ethernet controller (IEEE 802.1AS/1Qbv/1Qci) with hardware timestamping and traffic shaping - enables deterministic latency for camera video streaming and sensor fusion. |
| Functional Safety Ready I/O | GPIOs with configurable slew rate, drive strength, and pull-up/down options; all I/O banks support fail-safe state retention during SCU-initiated low-power modes per ISO 26262 ASIL-B requirements. |
Applications
| Infotainment Head Unit | Digital Cluster Display |
|---|---|
|
Use Scenario: Centralized audio/video processing, navigation rendering, and smartphone projection (Android Auto/CarPlay) in Tier-1 dashboard systems. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based QNX or AGL middleware; Cortex-A35 handles UI rendering and media decode, Cortex-M4F manages CAN gateway bridging and display backlight PWM. Use Value: Dual A35 cores deliver >2.5 K DMIPS for concurrent 1080p video decode and voice assistant inference; integrated SPDIF/SAI eliminates external audio codec BOM cost. |
Use Scenario: Real-time rendering of vehicle status, ADAS alerts, and navigation turn-by-turn on TFT-LCD instrument clusters. IC Role / Device Role / Timing Role: Graphics and safety monitor SoC; A35 runs Qt-based UI with GPU acceleration, M4F executes ASIL-B–compliant cluster watchdog supervision and CAN message filtering. Use Value: On-chip LCDIF controller drives 1280×720@60 Hz displays directly; TSN Ethernet synchronizes HUD overlay timing with ADAS camera streams. |
| V2X Telematics Gateway | ADAS Sensor Fusion Hub |
|
Use Scenario: DSRC/C-V2X message signing, validation, and forwarding between OBU, RSU, and cloud services in connected vehicle ECUs. IC Role / Device Role / Timing Role: Cryptographic offload processor; V2X subsystem performs ECDSA signing/verification, SECO manages key lifecycle, SCU enforces secure boot chain. Use Value: Dedicated V2X cryptographic accelerator achieves <50 μs packet signing latency; FIPS 140-3 not required allows lower-cost qualification path for OEM deployment. |
Use Scenario: Aggregation and preprocessing of radar, camera, and ultrasonic sensor data prior to AI inference on companion SoC. IC Role / Device Role / Timing Role: Preprocessing node; GPMI reads raw sensor logs from NAND, ASRC resamples multi-source audio inputs, eDMA channels move data to OCRAM for M4F feature extraction. Use Value: 62-bit BCH ECC on NAND ensures integrity of long-term sensor recording; 4× LPSPI interfaces connect to radar MMICs with deterministic sub-μs sampling alignment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8DL2AVNFZAB | FIPS 140-3 certified (SECO + V2X subsystems); identical core count, memory, and I/O specs. | Required for government fleet or defense-connected vehicle programs mandating cryptographic module validation. | Select when FIPS compliance is contractually mandated; same PCB layout and thermal profile as MIMX8DL1AVNFZBA. |
| MIMX8SL1AVNFZAB | Single Cortex-A35 core @1.2 GHz; otherwise identical memory, connectivity, and package. | Suitable for cost-sensitive entry-level infotainment or digital radio modules where dual-core Linux concurrency is unnecessary. | Choose for reduced BOM cost and lower dynamic power; retains full peripheral compatibility and SCU firmware stack. |
Compared with MIMX8DL1AVNFZBA, MIMX8DL2AVNFZAB adds FIPS 140-3 certification at no performance or layout penalty, while MIMX8SL1AVNFZAB reduces core count to cut cost and power - both maintain identical pinout, thermal envelope, and automotive qualification.
Availability
MIMX8DL1AVNFZBA is available at Aetrix Electronics and suitable for automotive infotainment head units, digital instrument clusters, and V2X telematics gateways requiring stable component supply across extended product lifecycles.
Supply support for MIMX8DL1AVNFZBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The i.MX 8XLite family targets cost-optimized automotive infotainment and telematics applications, delivering scalable performance from single-core to dual-core configurations while maintaining functional safety and security foundations aligned with ISO 26262 and EVITA standards.
FAQ
What is the operating temperature range for MIMX8DL1AVNFZBA?
MIMX8DL1AVNFZBA is qualified for automotive temperature grade −40°C to +125°C (junction), validated per AEC-Q100 Grade 2 requirements. This enables deployment in engine bay–adjacent telematics modules and under-dash infotainment units without derating. Thermal design must maintain case temperature below 105°C per IMX8XLB0AEC Section 3.1.3.
Does MIMX8DL1AVNFZBA support secure boot, and how is it implemented?
Yes, MIMX8DL1AVNFZBA implements hardware-enforced secure boot via High Assurance Boot (HAB) with OCOTP fuse-controlled boot policy, CAAM-backed signature verification, and SECO-managed key storage. The boot ROM validates signed images before loading SCFW or Linux kernel, preventing unauthorized firmware execution - a capability confirmed in IMX8XLB0AEC Section 4 and TN00196.
What are the supported memory types and maximum bandwidth for MIMX8DL1AVNFZBA?
MIMX8DL1AVNFZBA supports 16-bit LPDDR4 @1200 MHz (19.2 GB/s peak) and 16-bit DDR3L @933 MHz (14.9 GB/s peak), both with inline ECC. It also supports eMMC 5.1, SD 3.0 UHS-I, RAW NAND with BCH-62 ECC, and Quad/Octal SPI NOR via FlexSPI - all detailed in IMX8XLB0AEC Table 1 and Section 3.8.
Is MIMX8DL1AVNFZBA pin-compatible with other i.MX 8X family members?
Yes, MIMX8DL1AVNFZBA uses the same FCPBGA-376, 15 mm × 15 mm, 0.56/0.8 mm mixed-pitch package as MIMX8DL2AVNFZAB, MIMX8DL3AVNFZAB, and all i.MX 8SL variants - enabling shared PCB layouts across dual-core and single-core configurations per NXP Package Drawing SOT1222-1.
What development tools and software support are available for MIMX8DL1AVNFZBA?
MIMX8DL1AVNFZBA is supported by NXP's MCUXpresso SDK, Linux BSP (Yocto Project), Android BSP, and i.MX 8X Evaluation Kit (MCIMX8X-EVK). SCFW binary version ≥1.7.0 is mandatory per IMX8XLB0AEC Section "System Controller Firmware (SCFW) Requirements", and reference designs include hardware schematics and layout guidelines in IMX8XLB0AEC Appendix A.
MIMX8DL1AVNFZBA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-LFBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 388-LBGA (15x15)
- Additional Interfaces:
- -
MIMX8DL1AVNFZBA FAQ
1.How can I place an order for MIMX8DL1AVNFZBA through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8DL1AVNFZBA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8DL1AVNFZBA reliable?
The price and inventory of MIMX8DL1AVNFZBA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8DL1AVNFZBA is usually 5 days.
3.What payment methods are accepted for MIMX8DL1AVNFZBA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8DL1AVNFZBA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8DL1AVNFZBA?
MIMX8DL1AVNFZBA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8DL1AVNFZBA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8DL1AVNFZBA?
For technical support, including MIMX8DL1AVNFZBA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8DL1AVNFZBA requirements.
6.How does Aetrix verify that MIMX8DL1AVNFZBA is sourced from the original manufacturer or authorized distributors?
All MIMX8DL1AVNFZBA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8DL1AVNFZBA meets industry standards.
7.What is the process for return or replacement of MIMX8DL1AVNFZBA?
All MIMX8DL1AVNFZBA units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8DL1AVNFZBA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8DL1AVNFZBA part is unused and in its original packaging.
Return procedure for MIMX8DL1AVNFZBA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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