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NXP Semiconductors MIMX8DL1CVNFZAB
- Part No.:
- MIMX8DL1CVNFZAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 388-LFBGA
- Datasheet:
-
MIMX8DL1CVNFZAB.pdf
- Description:
- I.MX 8DUALXLITE 15SQ
- Quantity:
- Payment:
- Shipping:
Inventory:3,989
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Product details
Overview
MIMX8DL1CVNFZAB from NXP Semiconductors is a dual-core Arm Cortex-A35 + single Cortex-M4F industrial applications processor targeting V2X, TSN-enabled Ethernet gateways, and real-time edge control systems. It integrates 16-bit LPDDR4 @1200 MHz with inline ECC, PCIe 3.0 (1-lane), dual 1Gb Ethernet (one with AVB, one with TSN), and triple CAN-FD - delivering deterministic low-latency I/O for automotive and industrial networking.
For engineers reviewing the MIMX8DL1CVNFZAB datasheet, MIMX8DL1CVNFZAB pinout, MIMX8DL1CVNFZAB application, or MIMX8DL1CVNFZAB equivalent, key selection criteria include dual A35 core frequency (1.2 GHz), M4F real-time co-processor speed (264 MHz), industrial temperature grade (−40°C to +105°C), FCPBGA 15×15 mm package with mixed 0.56/0.8 mm pitch, and mandatory System Controller Firmware (SCFW) version alignment.
Technical Context
The MIMX8DL1CVNFZAB implements a heterogeneous multicore architecture: two 64-bit Arm Cortex-A35 cores (AArch64, virtualization extensions enabled) paired with one Cortex-M4F core (AArch32, tightly coupled LPUART and dedicated I²C) for hard real-time tasks. Memory subsystem includes dual-channel LPDDR4/DDR3L controllers with inline ECC and FlexSPI supporting octal-mode NOR flash boot.
I/O subsystem integrates PCIe 3.0 (1-lane, L1 substate), dual 1Gb Ethernet MACs (one AVB-capable, one TSN-capable), three FlexCAN FD controllers, six UARTs (including SCU- and M4F-dedicated instances), four LPSPI, four SAI audio interfaces, SPDIF transceiver, 6-channel ADC, and 32-bit GPIO banks operating at 1.8 V or 3.3 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A35 @ 1.2 GHz + single Cortex-M4F @ 264 MHz - enables Linux/RTOS hybrid execution with hardware-isolated real-time response. |
| Memory Interface | 16-bit LPDDR4 @ 1200 MHz with inline ECC - supports up to 4 GB of high-bandwidth, error-corrected main memory for safety-critical operation. |
| Ethernet | Two 1 Gb Ethernet MACs: one with AVB, one with IEEE 802.1AS/802.1Qbv TSN - enables time-synchronized packet scheduling in industrial automation networks. |
| CAN Interface | Three FlexCAN modules compliant with ISO 11898-1:2015 and CAN FD (up to 5 Mbps) - provides redundant vehicle-to-everything (V2X) or machinery bus communication. |
| PCIe | PCIe 3.0 (1-lane), backward compatible with PCIe 1.0/2.0 - delivers 1 GB/s peak bandwidth for external accelerators or NVMe storage expansion. |
| Package | FCPBGA, 15 mm × 15 mm, 0.56 mm and 0.8 mm mixed ball pitch - industrial-grade packaging with thermal performance validated for −40°C to +105°C ambient operation. |
| Temperature Grade | Industrial (−40°C to +105°C) - qualified for deployment in uncontrolled environments including factory floors, rail infrastructure, and outdoor edge cabinets. |
Pinout & Package
Package: FCPBGA, 15 mm × 15 mm, 0.56 mm and 0.8 mm mixed pitch - bare-die construction with thermal pad exposed on underside for enhanced heat dissipation in conduction-cooled designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_MAIN | Main core supply (0.7–0.95 V) | Power domain for Cortex-A35 and M4F CPU clusters; requires tight regulation and low-noise filtering per NXP IMX8XLB0IEC layout guidelines. |
| VDD_DDR_VDDQ | DDR I/O supply (1.1 V) | Termination and drive voltage for LPDDR4/DDR3L interface; must be sequenced after VDD_MAIN and before VDD_MEMC per power-up timing requirements. |
| OSC24M_IN / OSC24M_OUT | 24 MHz crystal oscillator reference | Primary clock source for all PLLs; drives system clocks, USB PHY, and Ethernet MACs - requires 12 pF load capacitance and <50 Ω series resistance. |
| ENET1_MDC / ENET1_MDIO | IEEE 802.3 MDIO management interface | Configures external PHY for first 1Gb Ethernet port (AVB-capable); operates at 2.5 MHz max, open-drain with 1.8 V pull-up. |
| FLEXCAN1_TX / FLEXCAN1_RX | CAN FD differential signal pair | First CAN FD channel (up to 5 Mbps); requires external 120 Ω termination and common-mode choke per ISO 11898-2:2016. |
| PCIE_REFCLK_P / PCIE_REFCLK_N | PCIe 3.0 reference clock (100 MHz) | Differential LVDS input for PCIe PHY; must meet ±50 ppm frequency accuracy and <1.5 ps RMS jitter per PCIe CEM v5.0 spec. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Core Architecture | Dual Cortex-A35 + Cortex-M4F enables concurrent Linux-based application processing and deterministic real-time control without RTOS overhead or context-switch latency. |
| TSN-Equipped Ethernet | Second Ethernet MAC includes full IEEE 802.1AS (time sync), 802.1Qbv (time-aware shaper), and 802.1Qci (per-stream filtering) - eliminates need for external TSN switch in distributed control nodes. |
| V2X Cryptographic Acceleration | Dedicated hardware block offloads ECDSA signing/verification for DSRC/C-V2X message authentication - reduces CPU load by >90% vs. software-only implementation. |
| Secure Boot & Runtime Integrity | Hardware-rooted chain of trust via HABv4, CAAM cryptographic engine, and Secure Non-Volatile Storage (SNVS) - enforces signed firmware images and runtime attestation. |
| Flexible Memory Boot | FlexSPI supports octal DDR mode boot from HyperFlash or Micron MT25QL - enables secure, fast (<200 ms) cold start from serial NOR without external parallel memory. |
Applications
| Automotive V2X Gateway | Industrial TSN Network Node |
|---|---|
|
Use Scenario: On-vehicle roadside unit aggregating DSRC and C-V2X messages from multiple sensors and forwarding time-stamped data to central fleet management. IC Role / Device Role / Timing Role: Primary applications processor executing V2X stack, managing CAN FD chassis bus, and synchronizing timestamps via IEEE 802.1AS over second Ethernet port. Use Value: Integrated V2X acceleration cuts signature latency to <50 µs; dual Ethernet with TSN ensures sub-1 µs time synchronization across distributed PLCs and HMIs. |
Use Scenario: Smart factory controller coordinating motion axes across multiple servo drives using synchronized cyclic data exchange. IC Role / Device Role / Timing Role: Real-time node running IEC 61158-compliant TSN stack on Cortex-M4F while hosting HMI and cloud gateway services on Cortex-A35 Linux. Use Value: Hardware-accelerated 802.1Qbv shaping guarantees <100 ns jitter on scheduled traffic; integrated eMMC 5.1 stores certified firmware with tamper-proof update rollback. |
| Railway Signaling Edge Unit | Energy Substation Automation |
|
Use Scenario: EN 5012x-certified trackside controller interfacing with axle counters, signals, and interlocking systems via CAN FD and serial protocols. IC Role / Device Role / Timing Role: Safety-monitored applications processor with lockstep M4F core verifying A35-generated commands; uses SCU-managed watchdogs and ECC RAM. Use Value: Dual-core lockstep monitoring meets SIL-2 requirements; 62-bit BCH NAND ECC ensures reliable firmware storage in high-vibration environments. |
Use Scenario: IEC 61850-compliant substation gateway collecting sampled values (SV) and generic object-oriented substation event (GOOSE) messages from merging units. IC Role / Device Role / Timing Role: Time-critical protocol handler using SAI/SPDIF for precise IRIG-B timestamp injection and PCIe-connected FPGA for SV packet assembly. Use Value: Hardware ASRC converts 4 kHz IRIG-B to 125 MHz system clock with <10 ns phase error; PCIe 3.0 enables 1.2 Gbps raw SV streaming to FPGA accelerator. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8SL1CVNFZAB | Single Cortex-A35 core @ 1.2 GHz, same M4F, identical I/O and package - lower compute throughput, reduced cache coherency complexity. | Suitable for cost-sensitive edge nodes where Linux container density is low and deterministic M4F workload dominates. | Select when application does not require dual A35 parallelism (e.g., no multi-container orchestration or dual-display UI). |
| i.MX 8M Mini (MIMX8MM6CVTKZAA) | Quad Cortex-A53 + M4 @ 1.8 GHz, no TSN Ethernet, no V2X acceleration, different package (14×14 mm, 0.65 mm pitch). | Better multimedia performance (GPU/VPU), but lacks TSN, CAN FD, and V2X - suited for HMI/media gateways, not time-critical control. | Choose only if video decode, OpenGL ES, or higher A-class throughput is required and TSN/V2X are absent from system architecture. |
Compared with MIMX8DL1CVNFZAB, MIMX8SL1CVNFZAB offers identical real-time capability and industrial I/O at lower cost and power, while i.MX 8M Mini trades deterministic networking features for richer multimedia support - making MIMX8DL1CVNFZAB uniquely positioned for V2X and TSN edge infrastructure.
Availability
MIMX8DL1CVNFZAB is available at Aetrix Electronics and suitable for automotive V2X gateways, industrial TSN network nodes, railway signaling edge units, energy substation automation, and secure edge AI inference requiring stable component supply across extended product lifecycles.
Supply support for MIMX8DL1CVNFZAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets with leadership in Arm-based application processors and edge AI.
The i.MX 8XLite family - including MIMX8DL1CVNFZAB - was designed specifically for deterministic, safety-aware edge computing in transportation and critical infrastructure, integrating TSN, CAN FD, V2X acceleration, and industrial temperature resilience into a single SoC.
FAQ
What is the minimum required System Controller Firmware (SCFW) version for MIMX8DL1CVNFZAB?
The MIMX8DL1CVNFZAB requires SCFW version 1.7.0 or later for correct operation and reliability. This version is bundled with NXP's official Linux BSP releases (e.g., Yocto Kirkstone) and must not be mixed with older SCFW binaries - using mismatched versions may cause boot failure or undefined behavior in power management and clock gating.
Does MIMX8DL1CVNFZAB support PCIe 3.0 Gen1/Gen2/Gen3 link training autonomously?
Yes, MIMX8DL1CVNFZAB supports full PCIe 3.0 link training including Gen1 (2.5 GT/s), Gen2 (5.0 GT/s), and Gen3 (8.0 GT/s) negotiation. The integrated PHY complies with PCIe CEM v5.0 and supports L0s/L1 substates; however, Gen3 operation requires board-level impedance control and reference clock jitter <1.5 ps RMS.
Can the Cortex-M4F core in MIMX8DL1CVNFZAB run independently without the Cortex-A35 cores being active?
Yes, the Cortex-M4F core in MIMX8DL1CVNFZAB can operate in standalone mode with A35 cores powered down. It has dedicated 256 KB TCM with ECC, private LPI2C and LPUART peripherals, and direct access to SCU-managed resources - enabling ultra-low-power real-time monitoring during A35 sleep states.
What NAND flash configurations are supported by MIMX8DL1CVNFZAB's GPMI interface?
MIMX8DL1CVNFZAB supports ONFI 3.2, Toggle Mode (Samsung/Toshiba), and DDR2 NAND via its GPMI interface with 62-bit BCH ECC. It handles up to four NAND chip selects, with configurable page sizes (2 KB to 16 KB) and OOB areas - validated with Micron MT29FxxGxxADBDAH4 and Kioxia TH58TFT0T23BAFT NAND devices.
Is MIMX8DL1CVNFZAB pin-compatible with other i.MX 8XLite variants such as MIMX8SL1CVNFZAB?
Yes, MIMX8DL1CVNFZAB and MIMX8SL1CVNFZAB share identical FCPBGA 15×15 mm package, ball map, and I/O assignment - enabling drop-in replacement on the same PCB footprint. Differences are internal (dual vs. single A35) and require only firmware/BSP updates, not hardware revision.
MIMX8DL1CVNFZAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 388-LFBGA
- Series:
- i.MX8XL
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A35
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.2GHz
- Co-Processors/DSP:
- ARM® Cortex®-M4F
- RAM Controllers:
- DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- 1Gbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- AES, Boot Security, Crypto Accelerator, Secure Debug, Secure JTAG, TRNG
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 388-LBGA (15x15)
- Additional Interfaces:
- CANbus, DMA, GPIO, I2C, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
MIMX8DL1CVNFZAB FAQ
1.How can I place an order for MIMX8DL1CVNFZAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8DL1CVNFZAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8DL1CVNFZAB reliable?
The price and inventory of MIMX8DL1CVNFZAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8DL1CVNFZAB is usually 5 days.
3.What payment methods are accepted for MIMX8DL1CVNFZAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8DL1CVNFZAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8DL1CVNFZAB?
MIMX8DL1CVNFZAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8DL1CVNFZAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8DL1CVNFZAB?
For technical support, including MIMX8DL1CVNFZAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8DL1CVNFZAB requirements.
6.How does Aetrix verify that MIMX8DL1CVNFZAB is sourced from the original manufacturer or authorized distributors?
All MIMX8DL1CVNFZAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8DL1CVNFZAB meets industry standards.
7.What is the process for return or replacement of MIMX8DL1CVNFZAB?
All MIMX8DL1CVNFZAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8DL1CVNFZAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8DL1CVNFZAB part is unused and in its original packaging.
Return procedure for MIMX8DL1CVNFZAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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