NXP Semiconductors MIMX8DL1CVNFZBA

Overview

MIMX8DL1CVNFZBA from NXP Semiconductors is a dual-core Arm Cortex-A35 + single Cortex-M4F industrial applications processor supporting LPDDR4 @1200 MHz with inline ECC, PCIe 3.0 (1-lane), dual 1Gb Ethernet (one with AVB, one with TSN), and 3× CAN-FD - deployed in edge gateways for industrial automation and vehicle-to-everything (V2X) communication systems.

For engineers reviewing the MIMX8DL1CVNFZBA datasheet, MIMX8DL1CVNFZBA pinout, MIMX8DL1CVNFZBA application, or MIMX8DL1CVNFZBA equivalent, key selection criteria include dual A35 core frequency (1.2 GHz), M4F real-time co-processor speed (264 MHz), industrial temperature grade (−40°C to +105°C), FCPBGA 15×15 mm mixed-pitch package, and hardware-accelerated V2X cryptographic support.

Technical Context

The MIMX8DL1CVNFZBA implements a heterogeneous multicore architecture: two 64-bit Arm Cortex-A35 cores (AArch64/AArch32) with 256 KB shared L2 cache and virtualization extensions, plus one tightly coupled Cortex-M4F core (256 KB TCM, FPU, NVIC) for deterministic real-time control. The System Control Unit (SCU) manages power domains, boot ROMs, PMIC interface via dedicated I²C, and resource domain isolation.

Memory subsystem includes 16-bit LPDDR4 @1200 MHz (with inline ECC), 16-bit DDR3L @933 MHz (ECC), FlexSPI for fast SPI NOR boot, eMMC 5.1/SD 3.0, and NAND with 62-bit BCH ECC. Connectivity integrates PCIe 3.0 (1-lane), dual USB 2.0 OTG, dual uSDHC (one 8-bit eMMC, two 4-bit SD), SPDIF Tx/Rx, ASRC, six-channel ADC, and four SAI interfaces (two full-duplex, two receive-only).

Key Specifications

Pinout & Package

Package: FCPBGA, 15 mm × 15 mm, 0.56 mm and 0.8 mm mixed ball pitch, 561-ball layout. Thermal pad on underside for enhanced heat dissipation in industrial enclosures.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar industrial applications processor applications.

Compared with MIMX8DL1CVNFZBA, MIMX8DL1CVNFZAB offers identical functionality and mechanical fit, while MIMX8SL1CVNFZBA trades one A35 core for reduced power and bill-of-materials cost - both retain full TSN, CAN-FD, PCIe, and V2X acceleration capabilities essential for industrial and transportation edge nodes.

Availability

MIMX8DL1CVNFZBA is available at Aetrix Electronics and suitable for industrial edge gateways, automotive V2X onboard units, railway signaling controllers, and energy substation IEDs requiring stable component supply across extended product lifecycles.

Supply support for MIMX8DL1CVNFZBA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 8XLite family targets cost-sensitive industrial edge applications requiring real-time responsiveness, functional safety, and secure over-the-air updates - with MIMX8DL1CVNFZBA optimized for dual-core Linux + RTOS hybrid deployments.

FAQ

What is the maximum operating frequency of the Cortex-A35 cores in the MIMX8DL1CVNFZBA?

The MIMX8DL1CVNFZBA features two Arm Cortex-A35 cores each operating at a maximum frequency of 1.2 GHz. This speed grade is validated across the full industrial temperature range (−40°C to +105°C) and is supported by the 16-bit LPDDR4 memory interface running at 1200 MHz with inline ECC. The A35 cores implement ARMv8-A architecture with virtualization extensions and share a 256 KB L2 cache with error-correcting code protection.

Does the MIMX8DL1CVNFZBA support Time-Sensitive Networking (TSN) and Audio Video Bridging (AVB)?

Yes, the MIMX8DL1CVNFZBA integrates two independent 1Gb Ethernet controllers: one with AVB extensions (IEEE 802.1AS, 802.1Qat) and one with full TSN support (IEEE 802.1Qbv, 802.1Qbu, 802.1Qci). Hardware timestamping, frame preemption, and traffic shaping are implemented in silicon - enabling sub-100 µs end-to-end jitter for synchronized motion control and professional audio/video streaming without software overhead.

What package type and ball count does the MIMX8DL1CVNFZBA use?

The MIMX8DL1CVNFZBA uses an FCPBGA (Fine-Pitch Chip-scale Ball Grid Array) package measuring 15 mm × 15 mm with a mixed pitch of 0.56 mm and 0.8 mm, containing 561 solder balls. This package includes an exposed thermal pad on the underside for efficient heat transfer to the PCB, and is qualified for industrial temperature operation (−40°C to +105°C). Pin-compatible with other i.MX 8XLite variants including MIMX8SL1CVNFZBA and MIMX8DL1CVNFZAB.

How does the V2X cryptographic accelerator in the MIMX8DL1CVNFZBA improve DSRC/WAVE packet processing?

The dedicated V2X accelerator in the MIMX8DL1CVNFZBA performs ECDSA signing and verification of DSRC/WAVE packets in hardware, reducing latency to under 50 µs per operation. It operates independently of the Cortex-A35 cores, enabling concurrent application processing while meeting ETSI EN 302 637-2 timing requirements. The accelerator interfaces directly with the CAAM security module for protected key storage and supports SHA-256 hashing required for WAVE message authentication.

What are the supported memory types and speeds for the MIMX8DL1CVNFZBA?

The MIMX8DL1CVNFZBA supports 16-bit LPDDR4 memory at up to 1200 MHz with inline ECC, and 16-bit DDR3L at up to 933 MHz with inline ECC. It also includes FlexSPI for booting from quad/octal SPI NOR flash, eMMC 5.1/SD 3.0 host controllers, and a NAND flash controller with 62-bit BCH ECC. Memory interfaces are managed by a unified DDR controller with configurable timing parameters accessible via the SCU firmware interface.