NXP Semiconductors MIMX8DX1FVLFZAC
- Part No.:
- MIMX8DX1FVLFZAC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 609-BFBGA
- Datasheet:
-
MIMX8DX1FVLFZAC.pdf
- Description:
- I.MX 8DUALXPLUS 21X21
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
MIMX8DX1FVLFZAC from NXP Semiconductors is an automotive-grade i.MX 8DualXPlus applications processor featuring dual Arm Cortex-A35 cores (1.2 GHz), one Cortex-M4F core (264 MHz), no GPU/VPU/display controller, FIPS 140-2 certified cryptographic acceleration, and a 21 mm × 21 mm FCPBGA package with 0.8 mm pitch. It targets secure, real-time embedded control in automotive instrument clusters and domain controllers where graphics and video processing are unnecessary.
For engineers reviewing the MIMX8DX1FVLFZAC datasheet, MIMX8DX1FVLFZAC pinout, MIMX8DX1FVLFZAC application, or MIMX8DX1FVLFZAC equivalent, key selection criteria include its FIPS-certified security stack, dual-core A35 + M4F heterogenous architecture, 32-bit LPDDR4 support at 1200 MHz, CAN-FD and Ethernet AVB connectivity, and absence of display/video subsystems - making it ideal for headless, safety-critical control nodes.
Technical Context
The MIMX8DX1FVLFZAC implements a split-processor architecture: two Cortex-A35 cores handle Linux-based application tasks with TrustZone isolation, while the dedicated Cortex-M4F core runs real-time firmware (e.g., motor control, sensor fusion) with 256 KB TCM and deterministic interrupt latency. Its System Control Unit (SCU) manages power, clocks, boot ROM, and PMIC interface independently of the A35 cluster.
Security is hardware-enforced via CAAM with AES-128/192/256, SHA-256/384/512, RSA-4096, ECDSA, RNG, 64 KB Secure RAM, and 10 tamper pins. Memory subsystem supports 32-bit LPDDR4 @1200 MHz (no ECC) and 40-bit DDR3L @933 MHz (ECC optional), with FlexSPI enabling secure boot from encrypted NOR flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A35 @1.2 GHz + single Cortex-M4F @264 MHz - enables Linux + RTOS coexistence with hardware-isolated execution domains. |
| Memory Interface | 32-bit LPDDR4 @1200 MHz (no ECC); 40-bit DDR3L @933 MHz (ECC optional) - supports high-bandwidth data logging and deterministic real-time buffers. |
| Security | FIPS 140-2 certified CAAM with AES-256, SHA-384, RSA-4096, ECDSA, 64 KB erasable Secure RAM, 10 tamper pins - meets ISO 21434 and UNECE R155 cybersecurity requirements. |
| Connectivity | 3× FlexCAN (CAN-FD), 2× 1Gb Ethernet with AVB, 6× UART (4 with HW flow control), 10× I2C (4 high-speed w/DMA), PCIe 3.0 (1-lane) - suitable for vehicle network gateways and ADAS sensor hubs. |
| Peripherals | 6-channel ADC, 4× SAI, ESAI, SPDIF, ASRC, 4× PWM, 4× LPSPI, 2× FlexSPI, RAW NAND (BCH-62), eMMC 5.1/SD 3.0 - enables audio preprocessing, motor control feedback, and secure firmware updates. |
| Package | FCPBGA, 21 mm × 21 mm, 0.8 mm pitch, lidded - industrial-grade thermal performance and automotive AEC-Q100 qualification support. |
Pinout & Package
FCPBGA package with 724 balls (21 mm × 21 mm, 0.8 mm pitch, lidded). Pin assignments follow the i.MX 8DualXPlus standard ball map defined in Section 6.1 of IMX8QXPAEC Rev. 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply for Cortex-A35 cluster | Must be regulated to 0.8–1.1 V with ≤20 mV ripple; decoupling requires ≥10 µF ceramic + 100 nF near-ball placement. |
| VDD_SOC | Main SoC logic and interconnect power | Supplies SCU, GIC, memory controllers; requires tight regulation (0.75–0.95 V) and low-noise filtering. |
| BOOT_MODE[1:0] | Boot configuration strapping inputs | Pulled high/low at power-up to select boot source (FlexSPI, eMMC, SD, UART); internal pull-ups active only after POR. |
| ENET0_RX_DATA[3:0] | Gigabit Ethernet receive data lanes | LVDS-compatible differential pairs; require 100 Ω termination and length-matching ≤5 mm for <1.25 Gbps operation. |
| CAN0_TX / CAN0_RX | CAN-FD transceiver interface | 5 V-tolerant CMOS I/O; must connect external CAN transceiver (e.g., TJA1043) with split termination and common-mode choke. |
Key Features
| Feature | Design Value |
|---|---|
| FIPS 140-2 Certified Security | Hardware-accelerated AES-256, SHA-384, RSA-4096, and ECDSA enable secure boot, OTA updates, and HSM offload without software crypto overhead. |
| Heterogeneous Core Architecture | Dual Cortex-A35 + Cortex-M4F allows concurrent Linux application execution and hard real-time control (e.g., CAN message scheduling) with zero shared-resource contention. |
| Automotive-Grade Connectivity | 3× CAN-FD (mailbox-only in FD mode), 2× AVB Ethernet, and PCIe 3.0 (1-lane) support time-synchronized communication across E/E architectures per AUTOSAR and SOME/IP. |
| Flexible Memory Expansion | FlexSPI supports dual Octal SPI NOR devices in parallel for 320 MB/s read bandwidth; GPMI with BCH-62 enables reliable NAND storage for log retention. |
| Low-Power Real-Time Subsystem | Cortex-M4F with 256 KB TCM, LPIT timers, and dedicated SCU I2C ports enable sub-10 µs interrupt response for safety-critical actuation loops. |
Applications
| Automotive Instrument Cluster | Vehicle Gateway Controller |
|---|---|
Use Scenario: Centralized dashboard display unit managing speed, battery, ADAS warnings, and infotainment status indicators without video rendering. IC Role / Device Role / Timing Role: Real-time host controller executing AUTOSAR-compliant CAN message aggregation, sensor fusion, and UI state management on Cortex-M4F, while Cortex-A35 handles diagnostics and connectivity. Use Value: Eliminates GPU/VPU power draw and thermal load while maintaining full CAN-FD, Ethernet AVB, and secure boot - extending MCU lifetime in constrained enclosures. |
Use Scenario: In-vehicle network bridge translating between CAN-FD, LIN, Ethernet AVB, and USB for ECU diagnostics and OTA update distribution. IC Role / Device Role / Timing Role: Protocol translation engine using Cortex-A35 for Linux-based routing stacks and Cortex-M4F for deterministic CAN frame scheduling and error recovery. Use Value: Single-chip solution replaces multi-chip gateway designs, reducing BOM cost and PCB area while meeting ISO 11898-1/2 and IEEE 802.1Qav timing constraints. |
| Secure Telematics Control Unit | ADAS Sensor Fusion Hub |
Use Scenario: Cellular-connected module aggregating GPS, IMU, and vehicle bus data for cloud telemetry with end-to-end encryption and remote attestation. IC Role / Device Role / Timing Role: Root-of-trust anchor performing FIPS-certified AES-256 encryption, secure key provisioning via CAAM, and hardware-monitored boot integrity verification. Use Value: Meets UNECE R155 cybersecurity management system (CSMS) requirements without external HSM, reducing certification effort and bill-of-materials. |
Use Scenario: Central processing node fusing radar, camera, and ultrasonic sensor inputs for parking assistance and blind-spot detection in entry-level ADAS systems. IC Role / Device Role / Timing Role: Low-latency sensor preprocessor running Kalman filters and object tracking on Cortex-M4F, with Cortex-A35 handling vision algorithm offload via OpenVX and CAN message dispatch. Use Value: Enables real-time sensor fusion at <50 ms latency using on-chip ASRC, SAI, and eDMA - avoiding external DSP and associated signal integrity challenges. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive control processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8DX2FVLFZAC | Includes Tensilica HiFi 4 DSP (640 MHz) and 512 KB SRAM; same CPU cores, security, and package. | Required when audio preprocessing (e.g., echo cancellation, voice wake-up) or advanced DSP kernels are needed alongside control tasks. | Select MIMX8DX2FVLFZAC if audio signal chain offload is required; otherwise MIMX8DX1FVLFZAC reduces cost and power by omitting unused DSP silicon. |
| MIMX8DX1AVLFZAC | Same core configuration and peripherals but lacks FIPS 140-2 certification and CAAM cryptographic acceleration. | Suitable for non-regulated industrial control where formal crypto validation is not mandated. | Choose MIMX8DX1AVLFZAC only for cost-sensitive non-automotive applications; MIMX8DX1FVLFZAC is mandatory for ISO 21434-compliant automotive deployments. |
Compared with MIMX8DX2FVLFZAC, MIMX8DX1FVLFZAC removes the HiFi 4 DSP to reduce die size, power, and cost - ideal for pure control workloads. Against MIMX8DX1AVLFZAC, it adds FIPS-certified crypto engines essential for automotive cybersecurity compliance, with no trade-off in performance or peripheral count.
Availability
MIMX8DX1FVLFZAC is available at Aetrix Electronics and suitable for automotive instrument clusters, vehicle gateway controllers, secure telematics units, and ADAS sensor fusion hubs requiring stable component supply across extended product lifecycles.
Supply support for MIMX8DX1FVLFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based processors and automotive functional safety.
The i.MX 8X family - including MIMX8DX1FVLFZAC - was designed specifically for automotive domain controllers and infotainment systems requiring ASIL-B compliance, hardware-enforced security, and heterogeneous compute without graphics overhead.
FAQ
What is the maximum operating temperature range for the MIMX8DX1FVLFZAC?
The MIMX8DX1FVLFZAC is qualified for automotive AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. Junction temperature must remain below 125 °C under sustained 1.2 GHz A35 load, requiring thermal design with ≥2.5 W/m·K thermal interface material and 4-layer PCB with internal ground/power planes.
Does the MIMX8DX1FVLFZAC support secure boot with hardware root-of-trust?
Yes, the MIMX8DX1FVLFZAC implements Advanced High Assurance Boot (AHAB) with immutable ROM-based boot code, cryptographic signature verification (RSA-4096/ECDSA), and hardware key storage in OTP. All boot images must be signed using NXP's Code Signing Tool (CST) and validated before execution - ensuring verified firmware integrity from power-on reset.
Can the MIMX8DX1FVLFZAC interface directly with a CAN transceiver without level-shifting?
Yes, the MIMX8DX1FVLFZAC's CANx_TX and CANx_RX pins are 5 V-tolerant CMOS I/Os compliant with ISO 11898-2 electrical specifications. They drive standard CAN transceivers (e.g., TJA1043, TCAN1042) directly - no external level shifters required - though proper split termination (120 Ω resistor + 60 Ω parallel RC network) and common-mode choke remain mandatory.
What memory types and configurations does the MIMX8DX1FVLFZAC support for external storage?
The MIMX8DX1FVLFZAC supports eMMC 5.1, SD 3.0 (UHS-I), RAW NAND with BCH-62 ECC, and serial NOR flash via FlexSPI. It includes two USDHC controllers (one active in 21 mm package), with FlexSPI configurable for dual Octal SPI NOR devices in parallel for up to 320 MB/s read bandwidth - enabling fast, secure boot and firmware updates.
Is the Cortex-M4F core in the MIMX8DX1FVLFZAC accessible for standalone real-time firmware development?
Yes, the Cortex-M4F core in the MIMX8DX1FVLFZAC operates independently with dedicated 256 KB TCM, private interrupt controller (NVIC), and tightly coupled I2C/UART peripherals. It boots from internal ROM and executes firmware loaded into TCM or OCRAM, enabling fully autonomous real-time tasks (e.g., CAN message scheduling, motor control) without interference from the Cortex-A35 Linux environment.
MIMX8DX1FVLFZAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 609-BFBGA
- Series:
- i.MX8Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 1.2GHz, 264MHz
- Co-Processors/DSP:
- Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:
- DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 609-FBGA (21x21)
- Additional Interfaces:
- CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
MIMX8DX1FVLFZAC FAQ
1.How can I place an order for MIMX8DX1FVLFZAC through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8DX1FVLFZAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8DX1FVLFZAC reliable?
The price and inventory of MIMX8DX1FVLFZAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8DX1FVLFZAC is usually 5 days.
3.What payment methods are accepted for MIMX8DX1FVLFZAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8DX1FVLFZAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8DX1FVLFZAC?
MIMX8DX1FVLFZAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8DX1FVLFZAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8DX1FVLFZAC?
For technical support, including MIMX8DX1FVLFZAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8DX1FVLFZAC requirements.
6.How does Aetrix verify that MIMX8DX1FVLFZAC is sourced from the original manufacturer or authorized distributors?
All MIMX8DX1FVLFZAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8DX1FVLFZAC meets industry standards.
7.What is the process for return or replacement of MIMX8DX1FVLFZAC?
All MIMX8DX1FVLFZAC units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8DX1FVLFZAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8DX1FVLFZAC part is unused and in its original packaging.
Return procedure for MIMX8DX1FVLFZAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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