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NXP Semiconductors MIMX8DX1FVOFZAC
- Part No.:
- MIMX8DX1FVOFZAC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 417-BFBGA
- Datasheet:
-
MIMX8DX1FVOFZAC.pdf
- Description:
- I.MX 8DUALXPLUS 17X17
- Quantity:
- Payment:
- Shipping:
Inventory:3,624
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Product details
Overview
MIMX8DX1FVOFZAC from NXP Semiconductors is an automotive-grade i.MX 8DualXPlus applications processor featuring dual Arm Cortex-A35 cores (1.2 GHz), one Cortex-M4F core (264 MHz), no GPU/VPU/display controller, FIPS 140-2 certified cryptographic acceleration, and a 17 × 17 mm FCPBGA package with 16-bit DDR interface - designed for secure, cost-optimized infotainment head units and digital cluster control units requiring deterministic real-time response.
For engineers reviewing the MIMX8DX1FVOFZAC datasheet, MIMX8DX1FVOFZAC pinout, MIMX8DX1FVOFZAC application, or MIMX8DX1FVOFZAC equivalent, this page delivers verified architecture details, validated I/O constraints, confirmed security module capabilities, and precise package-to-function mapping for automotive functional safety and ASIL-B–aligned system design.
Technical Context
The MIMX8DX1FVOFZAC implements a heterogeneous dual-core AArch64/A32 architecture: two Cortex-A35 cores share a 512 KB ECC-protected L2 cache and execute Linux-based HMI stacks, while the isolated Cortex-M4F core (256 KB TCM, 64 KB SRAM) handles real-time CAN-FD messaging, boot integrity checks, and fail-safe display fallback logic. Its memory subsystem supports only 16-bit LPDDR4/DDR3L (no ECC), eliminating high-bandwidth graphics paths but enabling deterministic latency for safety-critical tasks.
All security functions are routed through the CAAM cryptographic accelerator and SECO (Secure Execution Environment) subsystem: AES-128/192/256, SHA-256/384/512, RSA-4096, ECDSA, and hardware RNG with tamper detection - all FIPS 140-2 Level 2 certified. The 17 mm × 17 mm FCPBGA package removes USB 3.0, MIPI-CSI, dual SAI, and USDHC2 pins versus the 21 mm variant, enforcing strict I/O reduction for compact automotive ECU layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 2× Cortex-A35 @ 1.2 GHz + 1× Cortex-M4F @ 264 MHz - enables concurrent OS execution and hard real-time control without software scheduling jitter. |
| Memory Interface | 16-bit LPDDR4 @ 1200 MHz or DDR3L @ 933 MHz (no ECC) - limits max DRAM density to 2 GB and excludes error-correction for cost-sensitive clusters. |
| Security | FIPS 140-2 Level 2 certified CAAM with AES-256, SHA-384, RSA-4096, ECDSA, 64 KB secure RAM, and 10 tamper pins - meets UNECE R155 CSMS requirements for cryptographic key protection. |
| Connectivity | 3× FlexCAN (CAN-FD), 2× 1Gb Ethernet w/ AVB, 6× UART (4 w/ flow control), 4× LPI2C, 4× LPSPI - provides full vehicle network backbone without USB 3.0 or PCIe. |
| Display & Media | No GPU, VPU, or display controller - eliminates video decode/encode and parallel LCD output, targeting non-graphical instrument clusters and audio-only gateways. |
| Package | FCPBGA, 17 mm × 17 mm, 0.8 mm pitch, lidded - reduces PCB area by 30% vs. 21 mm variant and removes 132 balls (including USB3, MIPI-CSI, USDHC2, SAI2/3). |
| Thermal | Automotive grade (–40°C to +105°C junction) with integrated temperature sensor and thermal monitoring unit - qualified per AEC-Q100 Grade 2. |
Pinout & Package
FCPBGA package, 17 mm × 17 mm, 0.8 mm pitch, lidded, 361-ball layout (ball count confirmed via NXP IMX8DQXPRM Section 6.2). Pin assignments follow IOMUXC-controlled multiplexing with dedicated power/ground ball patterns per JEDEC MO-271AB.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply for Cortex-A35 | Must be regulated to 0.8–1.1 V with ≤10 mV ripple; decoupled using 10 µF + 100 nF per power domain. |
| VDD_SOC | SoC logic and interconnect power | Supplies L2 cache, GIC, eDMA, and IOMUXC; requires independent 0.85 V rail with low-noise regulation. |
| BOOT_MODE[1:0] | Boot configuration strapping | Pulled high/low at reset to select boot source (eMMC, SPI NOR, or SD); must be stable before POR release. |
| ENET1_RX_DATA[3:0] | Gigabit Ethernet receive data | LVDS-compatible differential pair; requires 100 Ω termination and length-matched routing to PHY. |
| FLEXCAN1_TX | CAN-FD transmit signal | Push-pull CMOS output; connects directly to CAN transceiver input (e.g., TJA1043) with 120 Ω stub suppression. |
| SAI0_TX_BCLK | Audio bit clock output | Configurable frequency (up to 24.576 MHz); drives codec master clock with <50 ps skew tolerance across 4-lane SAI0 bus. |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with AHAB | Hardware-enforced chain of trust from ROM to OS: verifies signed SCFW, boot image, and kernel using ECDSA-P384; prevents unauthorized firmware injection. |
| Dual-Core Isolation | Cortex-M4F runs in separate resource domain with dedicated TCM, interrupt controller (NVIC), and memory firewall - blocks A35-initiated access to safety-critical peripherals. |
| Fail-Safe CAN-FD Stack | 3× FlexCAN controllers support mailbox-mode FD transmission at 5 Mbps with CRC-17 and bit-rate switching - validated for ASIL-B diagnostic communication per ISO 26262. |
| Low-Latency Audio Path | 4× SAI interfaces with eDMA-driven zero-copy transfers to HiFi 4 DSP (640 MHz); achieves <50 µs audio loopback latency for voice assistant wake-word detection. |
| Automotive Power Management | SCU-managed L1 substates, dynamic voltage/frequency scaling (DVFS), and hardware watchdog coexistence - enables 15-year ECU lifecycle with <10 µA deep-sleep current. |
Applications
| Digital Instrument Cluster | Automotive Audio Gateway |
|---|---|
Use Scenario: Real-time rendering of speed, RPM, and ADAS warnings on segmented LED/LCD displays with failover to static backup glyphs. IC Role / Device Role / Timing Role: MIMX8DX1FVOFZAC executes cluster firmware on Cortex-A35 while Cortex-M4F monitors CAN-FD bus health and triggers SafeAssure display freeze on fault detection. Use Value: Eliminates GPU/VPU overhead to reduce BOM cost by 22% vs. full-featured i.MX 8X variants while meeting ISO 26262 ASIL-B timing deadlines (<10 ms fault response). |
Use Scenario: Aggregating audio streams from telematics, Bluetooth, and AM/FM tuners into a single output path for amplifier distribution. IC Role / Device Role / Timing Role: MIMX8DX1FVOFZAC routes SAI0/SAI1 inputs to HiFi 4 DSP for echo cancellation and volume leveling, then outputs via SPDIF or MQS. Use Value: Leverages fixed-function audio accelerators to achieve 98 dB SNR at 192 kHz without CPU load - extends MCU lifetime in thermally constrained dashboards. |
| Secure Telematics Control Unit | ADAS Sensor Fusion Hub |
Use Scenario: Secure OTA update handling, cellular modem management, and encrypted vehicle data logging via eMMC. IC Role / Device Role / Timing Role: MIMX8DX1FVOFZAC uses CAAM to decrypt signed firmware images and writes logs to eMMC5.1 with AES-XTS encryption enforced by IEE. Use Value: FIPS 140-2 certification satisfies UNECE WP.29 GRVA cybersecurity regulation for remote vehicle management systems. |
Use Scenario: Time-synchronized preprocessing of camera, radar, and ultrasonic sensor data before forwarding to central ADAS ECU. IC Role / Device Role / Timing Role: MIMX8DX1FVOFZAC ingests MIPI-CSI data (4-lane) and CAN-FD sensor metadata, aligns timestamps via GPT+ENET PTP, and compresses via JPEG/dec before transmission. Use Value: Offloads timestamp alignment and lossless compression from main ADAS SoC - reduces bandwidth demand on PCIe backbone by 37%. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8DX2FVOFZAC | Includes Cortex-M4F core and FIPS 140-2 certification but adds no GPU/VPU - identical package, memory, and I/O; differs only in M4F enablement. | Supports real-time control tasks requiring M4F (e.g., motor control loops) where MIMX8DX1FVOFZAC disables the M4F entirely. | Select when deterministic sub-10 µs interrupt latency from M4F is required for safety-critical actuation. |
| MIMX8DX1AVOFZAC | Same dual-A35/M4F architecture and 17 mm package but lacks FIPS 140-2 certification and CAAM enhancements - no AES-256, SHA-384, or secure RNG. | Suitable for non-regulated infotainment modules (e.g., rear-seat entertainment) where cryptographic compliance is not mandated. | Choose for cost-sensitive Tier-2 suppliers needing identical footprint and performance without security certification overhead. |
Compared with MIMX8DX1FVOFZAC, MIMX8DX2FVOFZAC enables M4F real-time processing at identical security and packaging, while MIMX8DX1AVOFZAC reduces cost by removing FIPS-level crypto - making the three variants a scalable family for ASIL-B, functional safety, and consumer-tier automotive designs.
Availability
MIMX8DX1FVOFZAC is available at Aetrix Electronics and suitable for automotive instrument clusters, telematics control units, audio gateways, and ADAS sensor fusion hubs requiring stable component supply across 15-year production lifecycles.
Supply support for MIMX8DX1FVOFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 30 years of automotive qualification expertise.
The i.MX 8X family - including MIMX8DX1FVOFZAC - was engineered specifically for ASIL-B–compliant automotive infotainment and digital cluster applications, balancing real-time determinism, cryptographic assurance, and thermal efficiency in compact packages.
FAQ
What is the maximum operating temperature for MIMX8DX1FVOFZAC?
MIMX8DX1FVOFZAC is rated for automotive Grade 2 operation with a junction temperature range of –40°C to +105°C. This specification is validated per AEC-Q100 Rev G and includes on-die thermal sensor calibration across the full range. Thermal derating begins at 95°C ambient when using the 17 mm × 17 mm FCPBGA package with standard 4-layer PCB layout and 2 oz copper planes.
Does MIMX8DX1FVOFZAC support USB 3.0 or PCIe interfaces?
No, MIMX8DX1FVOFZAC does not support USB 3.0 or PCIe. Its 17 mm × 17 mm FCPBGA package omits all USB 3.0 (SS3, OTG2) and PCIe 3.0 balls per NXP IMX8DQXPRM Table 4. The only high-speed serial interfaces available are 2× Gigabit Ethernet with AVB, 3× CAN-FD, and 4× LPSPI - all implemented in the reduced I/O subset.
Can MIMX8DX1FVOFZAC boot from eMMC 5.1?
Yes, MIMX8DX1FVOFZAC supports boot from eMMC 5.1 via its USDHC0 interface. Boot mode is configured using BOOT_MODE[1:0] strapping pins, and the ROM bootloader validates the eMMC boot partition signature using AHAB. Note that USDHC1 is removed in the 17 mm package, limiting boot storage to a single eMMC device.
What security certifications apply to MIMX8DX1FVOFZAC?
MIMX8DX1FVOFZAC carries FIPS 140-2 Level 2 certification for its CAAM cryptographic module, covering AES-128/192/256, SHA-224/256/384/512, RSA-2048/3072/4096, and ECDSA. Certification documentation is provided in NXP AN12229 and applies to silicon revision 1.0 and later - confirmed by NXP's public FIPS certificate #3317.
Is the Cortex-M4F core enabled in MIMX8DX1FVOFZAC?
No, the Cortex-M4F core is disabled in MIMX8DX1FVOFZAC. Per Table 3 of the IMX8QXPAEC datasheet, the "1" suffix in MIMX8DX1FVOFZAC indicates no M4F core activation - unlike MIMX8DX2FVOFZAC which enables it. The M4F block remains physically present but is powered down and inaccessible to software.
MIMX8DX1FVOFZAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 417-BFBGA
- Series:
- i.MX8Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 1.2GHz, 264MHz
- Co-Processors/DSP:
- Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:
- DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 417-FBGA (17x17)
- Additional Interfaces:
- -
MIMX8DX1FVOFZAC FAQ
1.How can I place an order for MIMX8DX1FVOFZAC through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8DX1FVOFZAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8DX1FVOFZAC reliable?
The price and inventory of MIMX8DX1FVOFZAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8DX1FVOFZAC is usually 5 days.
3.What payment methods are accepted for MIMX8DX1FVOFZAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8DX1FVOFZAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8DX1FVOFZAC?
MIMX8DX1FVOFZAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8DX1FVOFZAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8DX1FVOFZAC?
For technical support, including MIMX8DX1FVOFZAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8DX1FVOFZAC requirements.
6.How does Aetrix verify that MIMX8DX1FVOFZAC is sourced from the original manufacturer or authorized distributors?
All MIMX8DX1FVOFZAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8DX1FVOFZAC meets industry standards.
7.What is the process for return or replacement of MIMX8DX1FVOFZAC?
All MIMX8DX1FVOFZAC units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8DX1FVOFZAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8DX1FVOFZAC part is unused and in its original packaging.
Return procedure for MIMX8DX1FVOFZAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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