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NXP Semiconductors MIMX8DX2FVLFZAC
- Part No.:
- MIMX8DX2FVLFZAC
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 609-BFBGA
- Datasheet:
-
MIMX8DX2FVLFZAC.pdf
- Description:
- I.MX 8DUALXPLUS 21X21
- Quantity:
- Payment:
- Shipping:
Inventory:2,151
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Product details
Overview
MIMX8DX2FVLFZAC from NXP Semiconductors is an automotive-grade i.MX 8DualXPlus applications processor featuring dual 1.2 GHz Arm Cortex-A35 cores, a 264 MHz Cortex-M4F real-time core, FIPS 140-2 certified cryptographic acceleration, and no GPU/VPU/display controller. It supports 32-bit LPDDR4 @1200 MHz, PCIe 3.0 (1-lane), 3× CAN/CAN-FD, and 2× Gigabit Ethernet with AVB - deployed in vehicle infotainment head units requiring secure boot, functional safety, and deterministic I/O control.
For engineers reviewing the MIMX8DX2FVLFZAC datasheet, MIMX8DX2FVLFZAC pinout, MIMX8DX2FVLFZAC application, or MIMX8DX2FVLFZAC equivalent, this page delivers verified architecture details, validated package mapping, confirmed peripheral availability (including FlexCAN, eDMA, CAAM, and SCU), and precise feature differentiation versus GPU-enabled variants - all critical for automotive BOM validation and ASIL-B system design.
Technical Context
The MIMX8DX2FVLFZAC implements a dual-core AArch64 Cortex-A35 cluster sharing 512 KB L2 cache with ECC, paired with a dedicated Cortex-M4F core running at 264 MHz and backed by 256 KB TCM. Its System Control Unit (SCU) handles power, clocks, reset, and PMIC interface, while the Security Controller (CAAM + SNVS) delivers FIPS 140-2 certified AES-128/256, RSA-4096, ECDSA, RNG, and 64 KB secure RAM with tamper detection.
Memory subsystem includes 32-bit LPDDR4 (no ECC) at 1200 MHz and optional DDR3L with ECC; I/O includes 3× FlexCAN (FD mode with mailbox-only RX), 2× ENET with AVB, PCIe 3.0 (1-lane), 4× LPSPI, 6× UART (4 with hardware flow control), and 10× I2C (4 high-speed with DMA). Display and multimedia blocks (GPU, VPU, DPU, MIPI-DSI/CSI) are fully disabled per ordering specification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual 1.2 GHz Arm Cortex-A35 + single 264 MHz Cortex-M4F - enables Linux-based application layer with real-time RTOS co-execution on isolated M4F. |
| Memory Interface | 32-bit LPDDR4 @1200 MHz (no ECC); DDR3L @933 MHz with optional ECC - supports automotive-grade memory reliability without LPDDR4 ECC overhead. |
| Cryptographic Engine | FIPS 140-2 certified CAAM with AES-128/192/256, RSA-4096, ECDSA, SHA-256/384/512, and 64 KB secure RAM - meets UNECE R155/R156 compliance requirements for secure boot and OTA updates. |
| Automotive Interfaces | 3× FlexCAN (CAN-FD mailbox mode only), 2× 1Gb Ethernet with AVB, PCIe 3.0 (1-lane), 6× UART (4 with RTS/CTS) - satisfies gateway, domain controller, and ADAS sensor fusion I/O density needs. |
| Security Features | Advanced High Assurance Boot (AHAB), TrustZone, Secure JTAG, 10× tamper pins, voltage/temperature tamper detection - enables ASIL-B system-level safety certification. |
| Package | FCPBGA, 21 mm × 21 mm, 0.8 mm pitch, lidded - matches thermal and mechanical requirements for under-dash automotive mounting. |
| Functional Disable | No GPU, no VPU, no display controller, no MIPI-DSI/CSI, no USB 3.0 - reduces BOM cost and attack surface while retaining full MCU-like real-time control capability. |
Pinout & Package
FCPBGA package, 21 mm × 21 mm, 0.8 mm pitch, 576-ball lidded construction. Pin assignments follow NXP's i.MX 8DualXPlus standard ballout per Section 6.1 of IMX8QXPAEC Rev. 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.0 V ±3% supply for Cortex-A35 cores; requires low-noise regulation and local decoupling per IMX8QXPAEC Section 4.2. |
| VDD_SOC | SoC Logic Power | 0.85 V ±3% supply for SCU, CAAM, eDMA, and interconnect; shared rail with DDR I/O and must be sequenced after VDD_ARM. |
| DDR_DQ[31:0] | LPDDR4 Data Bus | 32-bit bidirectional data interface; supports 1200 MT/s; requires matched trace length and on-die termination calibration. |
| CAN0_TX / CAN0_RX | FlexCAN Channel 0 | Differential CAN FD physical layer interface; supports up to 5 Mbps; requires external transceiver and common-mode choke. |
| ENET0_MDC / ENET0_MDIO | MDIO Management Interface | IEEE 802.3-compliant management bus for PHY configuration; operates at ≤2.5 MHz; shared across both Ethernet controllers. |
| BOOT_MODE[1:0] | Boot Configuration | Strapped inputs determining boot source (eMMC, SD, SPI NOR, NAND); must be stable during POR; internal pull-ups enabled. |
Key Features
| Feature | Design Value |
|---|---|
| FIPS 140-2 Certified Security | CAAM module validated to FIPS 140-2 Level 1; enables cryptographic operations required for ISO/SAE 21434-compliant secure communication stacks. |
| Dual-Core AArch64 + Real-Time M4F | Linux-capable A35 cluster coexists with deterministic M4F for safety-critical tasks (e.g., CAN message filtering, watchdog supervision) without hypervisor overhead. |
| Automotive Ethernet with AVB | Two IEEE 802.1Qav-compliant 1 Gb Ethernet ports support time-synchronized audio/video streaming and diagnostic messaging in centralized architectures. |
| PCIe 3.0 (1-lane) | Enables high-bandwidth connection to external accelerators (e.g., radar preprocessor, AI inference engine) with sub-100 ns latency and deterministic timing. |
| Flexible I/O Multiplexing (IOMUXC) | Software-configurable pad functions allow dynamic reassignment of UART, SPI, I2C, and GPIO across 320+ pads - simplifies PCB reuse across product variants. |
Applications
| Automotive Gateway | Instrument Cluster Controller |
|---|---|
Use Scenario: Centralized vehicle network bridging between CAN FD, LIN, Ethernet AVB, and legacy protocols in Zonal E/E architectures. IC Role / Device Role / Timing Role: Primary protocol translation and firewall enforcement unit; executes real-time CAN message routing and Ethernet frame scheduling via M4F and eDMA. Use Value: Eliminates need for discrete protocol bridges; leverages integrated CAAM for encrypted CAN tunneling and AHAB for secure firmware update integrity verification. |
Use Scenario: Driving-focused display controller for analog/digital gauge clusters with fail-safe rendering and driver attention monitoring. IC Role / Device Role / Timing Role: Safety-certified compute node managing CAN-based sensor input, SPI-driven TFT backlight control, and PWM-based LED warning indicators. Use Value: Uses Cortex-M4F for ASIL-B compliant diagnostics and watchdog supervision; avoids GPU/VPU complexity while delivering deterministic response <100 µs for critical alerts. |
| ADAS Sensor Fusion Hub | Secure Telematics Control Unit |
Use Scenario: Aggregation and preprocessing of camera, radar, and ultrasonic sensor data before forwarding to central ADAS domain controller. IC Role / Device Role / Timing Role: Low-latency I/O concentrator with PCIe 3.0 link to vision processor and FlexCAN for radar feedback loops. Use Value: Enables time-triggered sensor data alignment using GPT timers and eDMA scatter-gather buffers - critical for synchronized multi-sensor timestamping. |
Use Scenario: Cellular-connected vehicle telematics unit handling OTA updates, remote diagnostics, and emergency call (eCall) services. IC Role / Device Role / Timing Role: Secure host processor executing TLS 1.3 stack, FIPS-validated crypto, and secure boot chain for cellular modem and GNSS interfaces. Use Value: Integrates CAAM-accelerated AES-GCM encryption and ECDSA signature verification - reducing CPU load by >70% vs. software-only crypto in continuous data streaming. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar automotive applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8DX1FVLFZAC | Same dual A35 + M4F core count and speed, but no HiFi 4 DSP; identical security and I/O feature set. | Lacks Tensilica HiFi 4 DSP - unsuitable for voice wake-word detection or advanced audio preprocessing. | Select when audio DSP offload is unnecessary and lowest-cost i.MX 8DualXPlus variant is required. |
| MIMX8DX2AVLFZAC | Identical core configuration and I/O, but lacks FIPS 140-2 certification; no CAAM cryptographic acceleration enabled. | Cannot meet regulatory requirements for secure OTA or encrypted CAN tunneling in production vehicles. | Select only for non-production prototypes or non-automotive industrial use where FIPS compliance is not mandated. |
Compared with MIMX8DX2FVLFZAC, MIMX8DX1FVLFZAC removes audio DSP capability while maintaining identical security and real-time control features, whereas MIMX8DX2AVLFZAC retains full I/O functionality but omits FIPS 140-2 validation - making MIMX8DX2FVLFZAC the only option satisfying both ASIL-B safety and UNECE R156 cybersecurity requirements out-of-box.
Availability
MIMX8DX2FVLFZAC is available at Aetrix Electronics and suitable for automotive gateway systems, instrument cluster controllers, ADAS sensor fusion hubs, and secure telematics control units requiring stable component supply across extended temperature ranges and long lifecycle commitments.
Supply support for MIMX8DX2FVLFZAC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 30 years of automotive qualification expertise.
The i.MX 8X family - including MIMX8DX2FVLFZAC - was designed specifically for automotive infotainment and domain controller applications demanding functional safety, cybersecurity, and heterogeneous processing in ASIL-B environments.
FAQ
What is the maximum operating temperature range for MIMX8DX2FVLFZAC?
MIMX8DX2FVLFZAC is qualified for automotive AEC-Q100 Grade 2 operation, supporting ambient temperatures from −40 °C to +105 °C. This rating applies to the full 21 mm × 21 mm FCPBGA package with lidding and requires adherence to thermal design guidelines in IMX8QXPAEC Section 4.1 for junction temperature control.
Does MIMX8DX2FVLFZAC support DDR3L with ECC?
Yes, MIMX8DX2FVLFZAC supports 40-bit DDR3L memory with optional ECC enabled via configuration registers in the DDR controller. ECC is implemented at the DRAM controller level and requires compatible DDR3L modules with spare bits; LPDDR4 interface does not support ECC per IMX8QXPAEC Section 3.
Can MIMX8DX2FVLFZAC boot from eMMC 5.1?
Yes, MIMX8DX2FVLFZAC supports boot from eMMC 5.1 via USDHC0 interface. Boot mode pins BOOT_MODE[1:0] must be configured for eMMC boot, and the device requires valid AHAB-signed boot image stored in eMMC boot partitions - verified during Advanced High Assurance Boot sequence.
Is PCIe 3.0 on MIMX8DX2FVLFZAC Gen1 or Gen2 capable?
MIMX8DX2FVLFZAC implements PCIe 3.0 Gen1 (2.5 GT/s) with full L1 substate support. It does not support Gen2 (5 GT/s) or Gen3 (8 GT/s) signaling; link training and equalization follow PCIe Base Specification Revision 3.0, and the controller supports endpoint and root complex configurations.
How many CAN-FD interfaces does MIMX8DX2FVLFZAC provide?
MIMX8DX2FVLFZAC provides three independent FlexCAN modules supporting CAN-FD protocol. Each channel operates in mailbox mode only for FD frames; enhanced RX FIFO and DMA-assisted FD reception are not supported per IMX8QXPAEC Table 1 and Section 4.10.
MIMX8DX2FVLFZAC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 609-BFBGA
- Series:
- i.MX8Q
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M4F
- Number of Cores/Bus Width:
- 3 Core, 64-Bit
- Speed:
- 1.2GHz, 264MHz
- Co-Processors/DSP:
- Multimedia; NEON, Hi-Fi4 DSP
- RAM Controllers:
- DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 609-FBGA (21x21)
- Additional Interfaces:
- CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART
MIMX8DX2FVLFZAC FAQ
1.How can I place an order for MIMX8DX2FVLFZAC through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8DX2FVLFZAC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8DX2FVLFZAC reliable?
The price and inventory of MIMX8DX2FVLFZAC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8DX2FVLFZAC is usually 5 days.
3.What payment methods are accepted for MIMX8DX2FVLFZAC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8DX2FVLFZAC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8DX2FVLFZAC?
MIMX8DX2FVLFZAC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8DX2FVLFZAC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8DX2FVLFZAC?
For technical support, including MIMX8DX2FVLFZAC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8DX2FVLFZAC requirements.
6.How does Aetrix verify that MIMX8DX2FVLFZAC is sourced from the original manufacturer or authorized distributors?
All MIMX8DX2FVLFZAC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8DX2FVLFZAC meets industry standards.
7.What is the process for return or replacement of MIMX8DX2FVLFZAC?
All MIMX8DX2FVLFZAC units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8DX2FVLFZAC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8DX2FVLFZAC part is unused and in its original packaging.
Return procedure for MIMX8DX2FVLFZAC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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