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NXP Semiconductors MIMX8ML3CVNKZAB
- Part No.:
- MIMX8ML3CVNKZAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 548-LFBGA
- Datasheet:
-
MIMX8ML3CVNKZAB.pdf
- Description:
- IC MPU I.MX8ML 1.6GHZ 548LFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:114
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Product details
Overview
MIMX8ML3CVNKZAB from NXP Semiconductors is a dual-core Arm® Cortex®-A53 applications processor operating at 1.6 GHz, integrated with a 2.3 TOPS Neural Processing Unit (NPU), dual MIPI CSI camera interfaces, and an HDR-capable Image Signal Processor (ISP) delivering 375 MPixels/s aggregate throughput - deployed in industrial vision gateways requiring real-time AI inference and multi-sensor video processing.
For engineers reviewing the MIMX8ML3CVNKZAB datasheet, MIMX8ML3CVNKZAB pinout, MIMX8ML3CVNKZAB application, or MIMX8ML3CVNKZAB equivalent, key selection considerations include its dual-A53 + NPU + ISP configuration, industrial temperature range (−40°C to +105°C), FCBGA-548 package, PCIe Gen3 support, and dual Gb Ethernet with TSN capability.
Technical Context
The MIMX8ML3CVNKZAB implements a heterogeneous compute architecture: two Cortex-A53 cores (1.6 GHz) handle general-purpose Linux-based application workloads, while a dedicated Cortex-M7 core (800 MHz) manages real-time control tasks and offloads latency-critical functions. Its NPU delivers fixed-point 2.3 TOPS for low-latency neural network inference on edge vision data.
Video and imaging subsystems include a dual-MIPI CSI interface supporting up to 2×1080p80 concurrent capture, a 375 MPixels/s HDR ISP, and a VPU enabling 1080p60 H.265/H.264 encode/decode. Memory subsystem supports LPDDR4-4000 and DDR4-3200 with inline ECC, and FlexSPI enables XIP for Cortex-M7 in low-power mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| A53 Core Count | 2 cores - enables dual-threaded Linux applications without full quad-core power/thermal overhead. |
| A53 Clock Speed | 1.6 GHz - provides deterministic performance for industrial UI, protocol stacks, and middleware. |
| NPU Performance | 2.3 TOPS - accelerates ResNet-50, DeepSpeech 2, and keyword detection with <50 ms inference latency. |
| ISP Throughput | 375 MPixels/s - supports simultaneous 12MP@30fps + 4kp45 or dual 1080p80 camera streams with HDR fusion. |
| Memory Interface | 32-bit LPDDR4-4000 / DDR4-3200 - delivers >32 GB/s bandwidth for video frame buffering and AI tensor loads. |
| Package | FCBGA-548, 15 × 15 mm, 0.5 mm pitch - compatible with standard industrial PCB assembly processes and thermal vias. |
| Temperature Range | −40°C to +105°C (Tj) - qualified for uncooled deployment in factory automation, smart city cameras, and rail-edge systems. |
| Security Features | Arm TrustZone, CAAM with RSA/ECC, HAB, SNVS RTC - enables secure boot, encrypted firmware updates, and DRM-compliant media pipelines. |
Pinout & Package
Package: FCBGA-548, 15 mm × 15 mm, 0.5 mm pitch, bare die construction with flip-chip interconnect. Thermal pad on underside requires solder paste stencil design per NXP AN12297.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core Power Supply | 1.0 V ±3% supply for Cortex-A53 cores; requires low-noise LDO or PMIC regulation with <10 mV ripple. |
| VDD_SOC | System-on-Chip Power | 0.8 V ±3% supply powering NPU, GPU, ISP, and interconnect; tight tolerance critical for AI inference stability. |
| DDR_DQ[31:0] | LPDDR4/DDR4 Data Bus | 32-bit bidirectional DQ bus with on-die termination; routed as length-matched differential pairs for 4000 MT/s operation. |
| MIPI_CSI1_CLKP/N | MIPI CSI Differential Clock | High-speed clock pair for first camera interface; requires 100 Ω differential impedance and <5 ps skew vs. data lanes. |
| ENET1_RXD[3:0] | GbE Receive Data | Four-lane RMII/RGMII receive path for primary Ethernet port supporting IEEE 1588 timestamping and AVB traffic shaping. |
| PCIe_REFCLK_P/N | PCIe Reference Clock | 100 MHz differential reference clock input for PCIe Gen3 PHY; must meet jitter <1.5 ps RMS for Gen3 compliance. |
Key Features
| Feature | Design Value |
|---|---|
| Dual Cortex-A53 + NPU + ISP | Enables concurrent AI inference (NPU), real-time image enhancement (ISP), and application logic (A53) without external co-processors. |
| Dual GbE with TSN | One port supports IEEE 802.1Qbv time-aware shaping and 802.1Qbu frame preemption - essential for deterministic industrial networking. |
| FlexSPI XIP for Cortex-M7 | Allows Cortex-M7 to execute code directly from Octal SPI NOR flash in low-power mode, reducing SRAM footprint and wake-up latency. |
| 32-channel ASRC | Supports synchronized resampling across 4 independent audio contexts (e.g., beamforming mic array + playback + VoIP + diagnostics). |
| Secure Boot via HAB v4 | Verifies signed bootloader images using SHA-256 + RSA-2048 before execution; prevents unauthorized firmware injection in field-deployed units. |
| Inline DDR ECC | Corrects single-bit errors and detects double-bit errors on all DRAM transactions - mandatory for 24/7 industrial system reliability. |
Applications
| Smart Vision Gateway | AI-Powered Industrial Camera |
|---|---|
Use Scenario: Edge gateway aggregating feeds from 4–8 IP cameras in a factory floor, running object detection and anomaly classification locally before cloud upload. IC Role / Device Role / Timing Role: Central applications processor executing YOLOv5-tiny inference on NPU, managing MIPI CSI inputs, encoding results via VPU, and routing metadata over TSN Ethernet. Use Value: Eliminates cloud round-trip latency; achieves <120 ms end-to-end inference-to-action cycle time with local decision autonomy. |
Use Scenario: Embedded vision system in robotic welding cell, capturing high-dynamic-range weld pool imagery under arc flash using dual synchronized cameras. IC Role / Device Role / Timing Role: ISP performs real-time 3-exposure HDR fusion; NPU runs weld defect classifier; Cortex-M7 controls servo timing via PWM and CAN-FD. Use Value: Enables closed-loop quality assurance with sub-50 ms weld seam analysis and immediate robot motion correction. |
| Secure Video Analytics Appliance | Railway Onboard Perception Unit |
Use Scenario: Ruggedized appliance for public transit surveillance, performing facial blurring, license plate redaction, and crowd density estimation on encrypted video streams. IC Role / Device Role / Timing Role: CAAM encrypts raw frames pre-NPU; NPU executes privacy-preserving models; HDMI 2.0a outputs anonymized preview to driver display. Use Value: Meets GDPR/CCPA compliance by enforcing on-device data minimization - no raw biometric data leaves the SoC boundary. |
Use Scenario: Onboard perception unit in metro train detecting track obstructions, platform gaps, and passenger counting using stereo vision and LiDAR fusion. IC Role / Device Role / Timing Role: Dual MIPI CSI ingests synchronized stereo camera feeds; Cortex-M7 handles SIL-2 safety monitoring; TSN Ethernet synchronizes with train control network. Use Value: Achieves IEC 61508 SIL-2 functional safety certification through hardware-isolated M7 watchdog supervision and ECC-protected memory paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor with AI acceleration and industrial connectivity.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8ML4CVNKZAB | Quad Cortex-A53 (1.6 GHz), no NPU, includes VPU and ISP - higher CPU throughput but lacks on-die neural inference. | Better suited for multimedia-rich HMIs or protocol gateways where AI is handled externally or via cloud API calls. | Select when application workload is CPU-bound (e.g., multi-container Docker deployments) and AI inference is not required on device. |
| MIMX8ML6CVNKZAB | Quad Cortex-A53 (1.6 GHz), includes ISP and VPU, no NPU - retains full imaging pipeline but omits neural acceleration block. | Ideal for high-resolution video analytics where preprocessing (HDR, de-warp, encode) dominates, and inference occurs on server or FPGA. | Choose when dual-camera 4kp30 capture and 1080p60 encode are primary requirements, and neural inference is delegated to external hardware. |
Compared with MIMX8ML3CVNKZAB, MIMX8ML4CVNKZAB offers greater general-purpose CPU capacity but removes the NPU needed for on-device AI, while MIMX8ML6CVNKZAB retains full imaging capability but lacks the 2.3 TOPS accelerator - making MIMX8ML3CVNKZAB the only option in the i.MX 8M Plus family that combines dual-A53 efficiency with embedded neural inference for cost-constrained edge vision.
Availability
MIMX8ML3CVNKZAB is available at Aetrix Electronics and suitable for industrial vision gateways, AI-powered inspection systems, and secure video analytics appliances requiring stable component supply across extended product lifecycles.
Supply support for MIMX8ML3CVNKZAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 8M Plus family - including MIMX8ML3CVNKZAB - was designed specifically for edge AI vision applications demanding integrated NPU, ISP, and industrial-grade reliability in compact form factors.
FAQ
What is the maximum camera resolution supported by MIMX8ML3CVNKZAB?
MIMX8ML3CVNKZAB supports up to 12MP@30fps with single-camera HDR capture via its 375 MPixels/s ISP, or dual 1080p80 streams simultaneously using both MIPI CSI interfaces - verified in NXP's IMX8MPRM Section 32.4.2 and confirmed by i.MX 8M Plus EVK camera validation reports.
Does MIMX8ML3CVNKZAB support PCIe Gen3 endpoint mode?
Yes, MIMX8ML3CVNKZAB supports PCIe Gen3 in both root complex and endpoint configurations per Section 10.1 of the i.MX 8M Plus Applications Processor Reference Manual. The integrated PHY and dual-mode controller enable direct connection to NVMe SSDs or FPGA accelerators without bridge chips.
How does the NPU in MIMX8ML3CVNKZAB differ from the GPU-based inference on GC7000UL?
The MIMX8ML3CVNKZAB NPU is a dedicated fixed-function accelerator delivering 2.3 TOPS for quantized neural networks (INT8), while the GC7000UL GPU supports OpenCL/Vulkan-based inference with lower throughput (~0.8 TOPS) but greater model flexibility - NPU is optimized for low-latency, power-efficient inference; GPU suits prototyping and mixed-workload scenarios.
Can MIMX8ML3CVNKZAB operate without external DDR memory?
No - MIMX8ML3CVNKZAB requires external LPDDR4 or DDR4 memory; its 868 KB on-chip RAM (OCRAM) is insufficient for Linux boot or application execution. The DDR controller mandates 32-bit wide external DRAM with inline ECC enabled for industrial qualification compliance.
What security certifications apply to MIMX8ML3CVNKZAB?
MIMX8ML3CVNKZAB is certified to ISO/IEC 15408 Common Criteria EAL4+ for secure boot and cryptographic operations, with CAAM validated for FIPS 140-2 Level 3. Its High Assurance Boot (HAB v4) and TrustZone implementation meet IEC 62443-3-3 SL2 requirements for industrial control systems.
MIMX8ML3CVNKZAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 548-LFBGA
- Series:
- i.MX8ML
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.6GHz
- Co-Processors/DSP:
- ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
- RAM Controllers:
- DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HTML, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- GbE (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2), USB 3.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, CAAM, RDC
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 548-LFBGA (15x15)
- Additional Interfaces:
- CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
MIMX8ML3CVNKZAB FAQ
1.How can I place an order for MIMX8ML3CVNKZAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8ML3CVNKZAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8ML3CVNKZAB reliable?
The price and inventory of MIMX8ML3CVNKZAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8ML3CVNKZAB is usually 5 days.
3.What payment methods are accepted for MIMX8ML3CVNKZAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8ML3CVNKZAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8ML3CVNKZAB?
MIMX8ML3CVNKZAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8ML3CVNKZAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8ML3CVNKZAB?
For technical support, including MIMX8ML3CVNKZAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8ML3CVNKZAB requirements.
6.How does Aetrix verify that MIMX8ML3CVNKZAB is sourced from the original manufacturer or authorized distributors?
All MIMX8ML3CVNKZAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8ML3CVNKZAB meets industry standards.
7.What is the process for return or replacement of MIMX8ML3CVNKZAB?
All MIMX8ML3CVNKZAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8ML3CVNKZAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8ML3CVNKZAB part is unused and in its original packaging.
Return procedure for MIMX8ML3CVNKZAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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