NXP Semiconductors MIMX8ML3DVNLZAB
- Part No.:
- MIMX8ML3DVNLZAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 548-LFBGA
- Datasheet:
-
MIMX8ML3DVNLZAB.pdf
- Description:
- IC MPU I.MX8ML 1.8GHZ 548LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:116
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Product details
Overview
MIMX8ML3DVNLZAB from NXP is a dual-core Arm® Cortex®-A53 applications processor operating up to 1.8 GHz, integrating a 2.3 TOPS Neural Processing Unit (NPU), dual-camera ISP supporting up to 12 MP resolution and 375 MP/s input rate, and HDMI 2.0a transmitter with eARC - designed for edge AI vision systems in smart home security hubs and industrial gateways.
For engineers reviewing the MIMX8ML3DVNLZAB datasheet, MIMX8ML3DVNLZAB pinout, MIMX8ML3DVNLZAB application, or MIMX8ML3DVNLZAB equivalent, key selection considerations include its dual-core CPU+NPU co-processing capability, 2× MIPI-CSI (4-lane each), 2× GbE with TSN support, LPDDR4/DDR4 inline ECC memory interface, and industrial temperature rating (−40°C to 105°C junction).
Technical Context
The MIMX8ML3DVNLZAB implements a heterogeneous compute architecture: two Cortex-A53 cores handle general-purpose OS and application tasks, while the dedicated 2.3 TOPS NPU accelerates neural network inference-enabling real-time human pose detection, multi-object surveillance, and >40,000-word speech recognition without cloud dependency. Its integrated Cadence Tensilica HiFi 4 DSP operates at 800 MHz for low-power voice preprocessing.
A dual-channel ISP supports simultaneous 2× HD or 1× 12 MP camera inputs with HDR, fisheye dewarp, and high-contrast scene enhancement. The SoC includes a Cortex-M7 core at 800 MHz for deterministic real-time control, CAN FD interfaces, and hardware-enforced security via Arm TrustZone®, CAAM, and secure boot with eFuse key storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core Count & Type | 2 × Arm Cortex-A53 @ up to 1.8 GHz - delivers ~10,800 DMIPS for Linux/Android application workloads with thermal headroom for sustained operation. |
| Neural Processing Unit | 2.3 TOPS NPU - enables on-device ML inference for vision and voice models without offloading to cloud or external accelerator. |
| Image Signal Processor | Dual-channel ISP supporting 2× MIPI-CSI (4-lane) up to 12 MP resolution and 375 MP/s aggregate throughput - enables stereo vision or high-res single-sensor capture with real-time dewarp and HDR. |
| Video Codec | H.265/H.264 encode/decode at 1080p60 - reduces bandwidth for local streaming or cloud upload; H.265 offers ~2× compression efficiency vs. H.264. |
| Memory Interface | 32-bit LPDDR4/DDR4 with inline ECC - ensures data integrity for industrial reliability and SIL-level system certification readiness. |
| Connectivity | 2× Gigabit Ethernet (1× with IEEE 1588/TSN), 2× USB 3.0/2.0 Type-C, PCIe Gen3 (1-lane), 2× CAN FD - supports deterministic industrial networking and high-bandwidth peripheral expansion. |
| Security | Arm TrustZone®, CAAM, secure JTAG, eFuse key storage, RTIC - provides hardware-rooted protection against firmware tampering, rollback, and physical attacks. |
Pinout & Package
Package: 15 mm × 15 mm, 0.5 mm pitch, 493-ball BGA (depopulated); RoHS-compliant, industrial-grade packaging rated for −40°C to 105°C junction temperature.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply for Cortex-A53 cluster | Must be regulated to 0.8–1.1 V with tight ripple (<15 mVpp); decoupling required per NXP layout guidelines. |
| DDR_DQ[31:0] | LPDDR4/DDR4 data bus (32-bit) | Supports inline ECC; requires matched-length routing and controlled impedance (40 Ω ±10%) for signal integrity. |
| MIPI_CSI0_CLK_P/N | Differential clock for first MIPI-CSI interface | Drives 4-lane camera sensor; requires 100 Ω differential impedance and <5 ps skew vs. data lanes. |
| HDMI_TX_HPD | Hot-plug detect input for HDMI sink | Active-high signal pulled up externally; used by firmware to trigger display enumeration and EDID read. |
| ENET1_MDC/MDIO | Management Data Clock/Input-Output for GbE PHY | Configures 2× GbE MACs; MDIO bus supports up to 32 PHY addresses for multi-port switch integration. |
| GPIO1_IO02 | General-purpose I/O with interrupt capability | Configurable as wake-up source from deep-sleep mode; supports 3.3 V tolerant input and 12 mA drive strength. |
Key Features
| Feature | Design Value |
|---|---|
| Dual-core Cortex-A53 + NPU co-processing | Enables concurrent OS execution and real-time ML inference - eliminates need for separate AI accelerator IC in cost- and space-constrained edge devices. |
| Dual MIPI-CSI (4-lane each) with ISP | Supports synchronized stereo vision or high-resolution single-sensor capture with hardware-accelerated dewarp and HDR - reduces host CPU load and latency. |
| HDMI 2.0a Tx with eARC | Delivers uncompressed audio over HDMI link with backward compatibility to ARC; enables premium soundbar integration without secondary audio codec. |
| Cortex-M7 real-time coprocessor | Handles time-critical tasks (CAN FD messaging, motor control loops, sensor fusion) independently of Linux kernel scheduling - improves determinism and reduces jitter. |
| Inline DDR ECC + L2 cache ECC | Prevents silent data corruption in safety-critical industrial deployments; meets requirements for IEC 61508 SIL-2 and ISO 13849 PLd system-level certification paths. |
Applications
| Smart Home Security Hub | Industrial Gateway |
|---|---|
Use Scenario: Local AI-powered video analytics for intrusion detection, facial recognition, and motion classification in residential alarm systems. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based inference engine, ISP pipeline, and encrypted video streaming stack. Use Value: Eliminates cloud dependency for privacy-sensitive processing; 2.3 TOPS NPU sustains >15 FPS inference on YOLOv5s while maintaining sub-2W system power. |
Use Scenario: Protocol-agnostic edge gateway aggregating Modbus, CAN FD, and EtherNet/IP data from factory floor sensors and PLCs. IC Role / Device Role / Timing Role: Central compute node running real-time Linux with TSN-aware networking stack and deterministic Cortex-M7 control loop handler. Use Value: Dual GbE with TSN enables sub-100 µs time synchronization across distributed I/O nodes; CAN FD support replaces external transceivers in automotive-grade diagnostics. |
| Smart Retail POS Terminal | Healthcare Patient Monitor |
Use Scenario: Touch-enabled retail kiosk performing on-device product recognition, targeted ad rendering, and contactless payment processing. IC Role / Device Role / Timing Role: Multimedia-capable SoC driving dual 1080p displays via HDMI + MIPI-DSI while managing secure payment crypto operations. Use Value: OpenGL ES 3.1 + Vulkan GPU renders rich UIs at 60 FPS; secure boot and CAAM ensure PCI-DSS compliance for EMV transaction handling. |
Use Scenario: Portable patient monitor capturing multi-channel biosignals (ECG, SpO₂, respiration) with real-time anomaly detection and local alerting. IC Role / Device Role / Timing Role: Low-latency signal processor using PDM microphone inputs and ASRC for synchronized sensor fusion, with NPU analyzing waveform patterns. Use Value: 8-channel PDM input supports direct connection to MEMS microphones; 2.3 TOPS NPU enables real-time arrhythmia classification without sending raw ECG to cloud. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8ML8DVNLZAB | Quad-core Cortex-A53 (1.8 GHz), same NPU/ISP/video blocks - adds 10,800 DMIPS CPU headroom and full GPU feature set (OpenCL FP, Vulkan). | Required for Android-based HMIs with complex 3D graphics or multi-camera 4Kp30 pipelines. | Select when higher general-purpose throughput is needed without changing PCB layout - pin-compatible upgrade path. |
| MIMX8ML6DVNLZAB | Same dual-core CPU and package, but no NPU - retains ISP, video codec, and connectivity features. | Suitable for vision-only applications (e.g., barcode scanning, basic object counting) where ML inference is handled externally or omitted. | Choose for cost-optimized designs needing ISP and dual MIPI-CSI but not on-device neural inference. |
Compared with MIMX8ML3DVNLZAB, the MIMX8ML8DVNLZAB offers higher CPU performance and full GPU capabilities for richer UIs, while the MIMX8ML6DVNLZAB removes the NPU to reduce BOM cost - both maintain identical pinout, memory interface, and industrial temperature rating.
Availability
MIMX8ML3DVNLZAB is available at Aetrix Electronics and suitable for smart home security hubs, industrial gateways, and healthcare patient monitors requiring stable component supply across 10+ year production lifecycles.
Supply support for MIMX8ML3DVNLZAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.
The i.MX 8M Plus family - including MIMX8ML3DVNLZAB - was engineered to deliver scalable edge AI with integrated NPU, ISP, and TSN-capable networking for industrial and consumer intelligent edge devices.
FAQ
What is the maximum operating frequency of the Cortex-A53 cores in the MIMX8ML3DVNLZAB?
The MIMX8ML3DVNLZAB features two Arm Cortex-A53 cores rated for operation up to 1.8 GHz under industrial conditions (−40°C to 105°C junction temperature). This frequency is maintained with appropriate thermal design and voltage regulation; actual sustained clock speed depends on thermal headroom and power delivery stability in the target PCB layout.
Does the MIMX8ML3DVNLZAB include hardware support for real-time Ethernet protocols?
Yes, the MIMX8ML3DVNLZAB integrates two Gigabit Ethernet MACs, one of which supports IEEE 1588 Precision Time Protocol, Audio Video Bridging (AVB), and Time-Sensitive Networking (TSN) - enabling deterministic, low-jitter communication for industrial control loops and synchronized multi-node sensor networks.
Can the MIMX8ML3DVNLZAB directly interface with MIPI-CSI camera sensors?
Yes, the MIMX8ML3DVNLZAB includes two native MIPI-CSI interfaces, each supporting up to four data lanes and a differential clock pair. It supports sensor resolutions up to 12 MP per interface and provides hardware-accelerated ISP functions including HDR merging and fisheye dewarp - eliminating need for external image processing ICs.
What security features are implemented in the MIMX8ML3DVNLZAB for secure boot?
The MIMX8ML3DVNLZAB implements hardware-rooted secure boot using CAAM cryptographic acceleration, eFuse-based key storage, and immutable ROM code that validates signed firmware images before execution. It supports encrypted boot, rollback protection, and runtime integrity checking (RTIC) to prevent unauthorized firmware modification or malware injection.
Is the MIMX8ML3DVNLZAB pin-compatible with other i.MX 8M Plus derivatives?
Yes, the MIMX8ML3DVNLZAB uses the same 15 mm × 15 mm, 0.5 mm pitch, 493-ball BGA package as other i.MX 8M Plus variants including MIMX8ML6DVNLZAB and MIMX8ML8DVNLZAB - enabling single-PCB designs with build-to-order flexibility across performance tiers without layout changes.
MIMX8ML3DVNLZAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 548-LFBGA
- Series:
- i.MX8ML
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.8GHz
- Co-Processors/DSP:
- ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
- RAM Controllers:
- DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HTML, LVDS, MIPI-CSI, MIPI-DSI
- Ethernet:
- GbE (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2), USB 3.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, CAAM, RDC
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 548-LFBGA (15x15)
- Additional Interfaces:
- CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
MIMX8ML3DVNLZAB FAQ
1.How can I place an order for MIMX8ML3DVNLZAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8ML3DVNLZAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8ML3DVNLZAB reliable?
The price and inventory of MIMX8ML3DVNLZAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8ML3DVNLZAB is usually 5 days.
3.What payment methods are accepted for MIMX8ML3DVNLZAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8ML3DVNLZAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8ML3DVNLZAB?
MIMX8ML3DVNLZAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8ML3DVNLZAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8ML3DVNLZAB?
For technical support, including MIMX8ML3DVNLZAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8ML3DVNLZAB requirements.
6.How does Aetrix verify that MIMX8ML3DVNLZAB is sourced from the original manufacturer or authorized distributors?
All MIMX8ML3DVNLZAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8ML3DVNLZAB meets industry standards.
7.What is the process for return or replacement of MIMX8ML3DVNLZAB?
All MIMX8ML3DVNLZAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8ML3DVNLZAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8ML3DVNLZAB part is unused and in its original packaging.
Return procedure for MIMX8ML3DVNLZAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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