NXP Semiconductors MIMX8MN3CVTIZAA
- Part No.:
- MIMX8MN3CVTIZAA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 486-LFBGA, FCBGA
- Datasheet:
-
MIMX8MN3CVTIZAA.pdf
- Description:
- IC MPU I.MX8MN 1.4GHZ 486LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:456
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Product details
Overview
MIMX8MN3CVTIZAA from NXP Semiconductors is an industrial-grade i.MX 8M Nano DualLite applications processor featuring dual Arm Cortex-A53 cores (1.4 GHz), one Cortex-M7 core (750 MHz), no GPU, no MIPI DSI, and FCBGA-486 (14 × 14 mm, 0.5 mm pitch) packaging - designed for cost-optimized, low-power embedded HMI and edge AI inference in industrial gateways and smart sensors.
For engineers reviewing the MIMX8MN3CVTIZAA datasheet, MIMX8MN3CVTIZAA pinout, MIMX8MN3CVTIZAA application, or MIMX8MN3CVTIZAA equivalent, key selection considerations include its dual-core A53 + M7 asymmetric architecture, absence of GC7000UL GPU and MIPI DSI, DDR4/LPDDR4 support, industrial temperature range (−40°C to +105°C), and security features including CAAM, TrustZone, and HAB.
Technical Context
The MIMX8MN3CVTIZAA implements a heterogeneous dual-core Cortex-A53 platform with 512 KB L2 cache and Arm NEON/FPU, paired with a dedicated Cortex-M7 for real-time control and low-power firmware execution. It integrates a full suite of industrial I/O: three uSDHC controllers (MMC 5.1/SD 3.0), Gigabit Ethernet with IEEE 1588, four UARTs, four I²C, three SPI, five SAI audio interfaces, and PDM input.
Its memory subsystem supports LPDDR4-3200, DDR4-2400, DDR3L-1600 (16-bit), 8-bit NAND with BCH62 ECC, eMMC 5.1, and QuadSPI with XIP capability for the M7. Security is enforced via TrustZone, Resource Domain Controller (RDC), CAAM with RSA/ECC acceleration, and Secure JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Dual Arm Cortex-A53 @ 1.4 GHz + single Cortex-M7 @ 750 MHz - enables Linux-capable application processing with deterministic real-time firmware offload. |
| GPU / Display | No GC7000UL GPU; no MIPI DSI interface - eliminates display subsystem BOM and power overhead for headless industrial control applications. |
| Memory Interface | 16-bit LPDDR4-3200 / DDR4-2400 / DDR3L-1600 - supports up to 8 GB DRAM with hardware ECC and flexible power domain partitioning. |
| Security Features | Arm TrustZone, CAAM (RSA/ECC/DRM), HAB, SNVS RTC, Secure JTAG - delivers certified boot, cryptographic acceleration, and tamper-resistant storage for industrial IoT. |
| Industrial Rating | −40°C to +105°C junction temperature, Industrial qualification tier - ensures reliable operation in harsh factory and outdoor edge environments. |
| Package | FCBGA-486, 14 × 14 mm, 0.5 mm pitch - compatible with standard PCB assembly processes and thermal management for convection-cooled industrial modules. |
| Connectivity | Gigabit Ethernet (IEEE 1588/AVB/EEE), USB 2.0 OTG, 3× uSDHC (HS400/SDIO3.0), 4× UART, 4× I²C, 3× SPI - meets requirements for protocol gateway and fieldbus edge node integration. |
Pinout & Package
Package: FCBGA-486 (14 × 14 mm, 0.5 mm pitch), plastic, RoHS-compliant. Ball map defined per Section 5.1 (pages 77–92) of IMX8MNIEC Rev. 5. Pin functions are multiplexed via IOMUXC and documented in Tables 5–8 and Appendix A of the datasheet.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM / VDD_SOC | Core logic supply | 1.0 V nominal (±5%) - powers Cortex-A53/M7 CPU clusters and L2 cache; requires tight regulation and local decoupling. |
| NVCC_DRAM | DDR I/O supply | 1.1 V for LPDDR4 or 1.2 V for DDR4 - sets signal voltage level for 16-bit DRAM interface; must be sequenced before VDD_DRAM. |
| BOOT_MODE[3:0] | Boot configuration inputs | Pulled high/low at reset to select boot source (eMMC, SD, SPI NOR, NAND); determines initial firmware load path and security policy. |
| ENET1_RXD[3:0]/TXD[3:0] | Gigabit Ethernet PHY interface | RMII/RGMII-capable differential pairs - supports direct connection to external PHY or integrated transceivers for time-sensitive networking. |
| SAI2_TX_BCLK / SAI2_RX_BCLK | Synchronous audio clock | 49.152 MHz capable - drives multi-channel I²S/TDM audio streams for voice interface or sensor data acquisition without CPU intervention. |
Key Features
| Feature | Design Value |
|---|---|
| Asymmetric dual-core architecture | Separates Linux-based application workload (A53) from deterministic real-time tasks (M7), reducing latency and power vs. monolithic A53-only designs. |
| CAAM cryptographic acceleration | Hardware-accelerated RSA/ECC signing, AES/3DES encryption, and RNG - enables secure OTA updates and DRM without software overhead. |
| QuadSPI with XIP support | Direct code execution from external flash by Cortex-M7 in low-power mode - eliminates RAM footprint for firmware and reduces wake-up latency. |
| uSDHC HS400 DDR mode | 400 MB/s throughput on uSDHC1 - supports high-bandwidth logging, firmware staging, and local media buffering in edge gateways. |
| Secure boot with HAB v4 | Immutable chain-of-trust verified at every boot stage using eFUSE-backed keys - prevents unauthorized firmware execution in production deployments. |
Applications
| Industrial Gateway | Smart Sensor Hub |
|---|---|
|
Use Scenario: Protocol translation between Modbus RTU field devices and cloud MQTT endpoints in factory automation. IC Role / Device Role / Timing Role: Main SoC executing Linux-based edge runtime, managing serial-to-Ethernet bridging, TLS offload, and time-synchronized data batching. Use Value: Dual A53 cores handle concurrent network stacks and application logic; M7 manages precise timer-triggered sampling and watchdog supervision - all within 2.5 W typical power envelope. |
Use Scenario: Multi-modal environmental monitoring node combining PDM microphones, temperature/humidity sensors, and LoRaWAN uplink. IC Role / Device Role / Timing Role: Central controller running lightweight RTOS on M7 for sensor fusion and sleep scheduling, while A53 hosts secure cloud agent and firmware update handler. Use Value: PDM input supports 8-channel audio capture; CAAM accelerates AES-GCM encryption; industrial temp rating ensures reliability in uncontrolled enclosures. |
| Headless Edge AI Appliance | Secure HMI Controller |
|
Use Scenario: On-device ML inference for predictive maintenance on motor vibration signatures using TensorFlow Lite Micro. IC Role / Device Role / Timing Role: Cortex-M7 executes quantized neural net inference with NEON-assisted math; A53 handles model loading, telemetry upload, and OTA coordination. Use Value: No GPU reduces thermal design complexity; 512 KB L2 cache and TCM enable fast inference kernels; TrustZone isolates model weights in secure memory. |
Use Scenario: Local operator interface for HVAC control panel with touch input, LED status, and encrypted parameter storage. IC Role / Device Role / Timing Role: A53 runs Qt-based UI framework; M7 manages capacitive touch scanning, PWM dimming, and secure key derivation from SNVS. Use Value: GPIO and I²C peripherals directly drive displays and sensors; SNVS provides tamper-evident RTC and secure non-volatile key storage - no external secure element required. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8MN4CVTIZAA | Includes GC7000UL GPU and MIPI DSI interface; same dual A53 + M7 core count and package. | Required for 1080p60 display output via MIPI DSI; adds ~300 mW active power and display driver BOM. | Select when GUI rendering or camera preview is needed; otherwise MIMX8MN3CVTIZAA reduces cost and thermal load. |
| MIMX8MN5CVTIZAA | Quad A53 + M7, same package and industrial rating, but no GPU or MIPI DSI - higher compute throughput than MIMX8MN3CVTIZAA. | Suitable for multi-service edge nodes requiring concurrent containerized workloads or virtualized control planes. | Choose for scalable performance headroom; MIMX8MN3CVTIZAA better fits single-purpose deterministic applications with tighter BOM constraints. |
Compared with MIMX8MN4CVTIZAA, MIMX8MN3CVTIZAA removes GPU/DSI to lower cost and power for headless use cases; versus MIMX8MN5CVTIZAA, it trades two A53 cores for reduced silicon area and thermal density - both alternatives retain identical security, memory, and peripheral compatibility.
Availability
MIMX8MN3CVTIZAA is available at Aetrix Electronics and suitable for industrial gateways, smart sensor hubs, headless edge AI appliances, and secure HMI controllers requiring stable component supply across extended product lifecycles.
Supply support for MIMX8MN3CVTIZAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with deep expertise in Arm-based application processors and edge AI acceleration.
The i.MX 8M Nano family - including MIMX8MN3CVTIZAA - was designed specifically for cost-sensitive, power-constrained industrial edge devices requiring Linux capability, real-time responsiveness, and hardware-enforced security without display subsystem overhead.
FAQ
What is the maximum operating frequency of the Cortex-A53 cores in the MIMX8MN3CVTIZAA?
The MIMX8MN3CVTIZAA features two Arm Cortex-A53 cores rated for operation up to 1.4 GHz under industrial temperature conditions (−40°C to +105°C). This frequency is guaranteed across the full voltage and temperature range specified in the IMX8MNIEC datasheet Section 3.1, with dynamic voltage and frequency scaling (DVFS) supported via the CCM module for power optimization.
Does the MIMX8MN3CVTIZAA support LPDDR4 memory, and what is the maximum data rate?
Yes, the MIMX8MN3CVTIZAA supports LPDDR4-3200 (3200 MT/s) via its 16-bit DRAM interface. This enables up to 6.4 GB/s peak bandwidth when configured with dual-rank LPDDR4, meeting requirements for real-time video analytics preprocessing and high-throughput sensor fusion - as validated in the Electrical Characteristics section (3.9) of the IMX8MNIEC datasheet.
Is the MIMX8MN3CVTIZAA pin-compatible with other i.MX 8M Nano variants in the same package?
MIMX8MN3CVTIZAA shares the identical FCBGA-486 (14 × 14 mm, 0.5 mm pitch) package and ball map with MIMX8MN4CVTIZAA, MIMX8MN5CVTIZAA, and MIMX8MN6CVTIZAA. All share the same power, ground, DDR, and core I/O pin assignments; however, unused interface balls (e.g., MIPI DSI, GPU supplies) are NC or require specific termination per Table 7 of IMX8MNIEC Rev. 5.
What security features are implemented in hardware on the MIMX8MN3CVTIZAA?
The MIMX8MN3CVTIZAA integrates Arm TrustZone, Resource Domain Controller (RDC), Cryptographic Acceleration and Assurance Module (CAAM) with RSA/ECC engines, High Assurance Boot (HAB), Secure Non-Volatile Storage (SNVS), and Secure JTAG Controller (SJC). These are confirmed in Sections 1.1 (Block Diagram), Table 1 (Features), and Chapter 4 of IMX8MNIEC Rev. 5 - enabling secure boot, encrypted storage, and runtime integrity verification.
Can the Cortex-M7 core in the MIMX8MN3CVTIZAA execute code directly from external QuadSPI flash?
Yes, the MIMX8MN3CVTIZAA supports Execute-in-Place (XIP) from QuadSPI flash for the Cortex-M7 core, as documented in Section 3.9 and Table 1 of IMX8MNIEC Rev. 5. This allows the M7 to run firmware directly from flash in low-power modes, eliminating SRAM usage and reducing wake-up latency - critical for battery-operated sensor nodes.
MIMX8MN3CVTIZAA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 486-LFBGA, FCBGA
- Series:
- i.MX8MN
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 2 Core, 64-Bit
- Speed:
- 1.4GHz
- Co-Processors/DSP:
- ARM® Cortex®-M7
- RAM Controllers:
- DDR3L, DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, MIPI-CSI, MIPI-DSI
- Ethernet:
- GbE
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 486-LFBGA (14x14)
- Additional Interfaces:
- I2C, PCIe, SDHC, SPI, UART
MIMX8MN3CVTIZAA FAQ
1.How can I place an order for MIMX8MN3CVTIZAA through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8MN3CVTIZAA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8MN3CVTIZAA reliable?
The price and inventory of MIMX8MN3CVTIZAA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8MN3CVTIZAA is usually 5 days.
3.What payment methods are accepted for MIMX8MN3CVTIZAA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8MN3CVTIZAA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8MN3CVTIZAA?
MIMX8MN3CVTIZAA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8MN3CVTIZAA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8MN3CVTIZAA?
For technical support, including MIMX8MN3CVTIZAA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8MN3CVTIZAA requirements.
6.How does Aetrix verify that MIMX8MN3CVTIZAA is sourced from the original manufacturer or authorized distributors?
All MIMX8MN3CVTIZAA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8MN3CVTIZAA meets industry standards.
7.What is the process for return or replacement of MIMX8MN3CVTIZAA?
All MIMX8MN3CVTIZAA units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8MN3CVTIZAA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8MN3CVTIZAA part is unused and in its original packaging.
Return procedure for MIMX8MN3CVTIZAA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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