NXP Semiconductors MIMX8MN3DVTJZAA

Overview

MIMX8MN3DVTJZAA from NXP Semiconductors is a dual-core Arm® Cortex®-A53 + Cortex®-M7 applications processor in 14 × 14 mm FCBGA (486-ball), operating at 1.5 GHz, supporting LPDDR4-3200, MIPI DSI/CSI, and USB 2.0 OTG - deployed in cost-sensitive industrial HMIs and smart audio endpoints requiring real-time M7 co-processing and display capability without GPU acceleration.

For engineers reviewing the MIMX8MN3DVTJZAA datasheet, MIMX8MN3DVTJZAA pinout, MIMX8MN3DVTJZAA application, or MIMX8MN3DVTJZAA equivalent, key selection criteria include confirmed dual A53 core count, absence of GC7000UL GPU, presence of MIPI DSI interface, 14×14 mm FCBGA package with 0.5 mm pitch, and consumer-grade temperature range (0–95°C).

Technical Context

The MIMX8MN3DVTJZAA implements two Arm Cortex-A53 cores (1.5 GHz) and one Cortex-M7 core (750 MHz), with 512 KB L2 cache, 512 KB on-chip RAM, and dedicated security modules including CAAM, TrustZone, and Secure JTAG. It supports boot from eMMC 5.1, SD 3.0, NAND Flash (BCH62 ECC), and QuadSPI.

Its I/O subsystem includes four UARTs, four I²C modules, three SPI interfaces, five SAI audio modules (supporting I²S/AC97/TDM/S/PDIF), Gigabit Ethernet with IEEE 1588, and a 4-lane MIPI DSI interface - all enabled per Table 2 and Table 3 of IMX8MNCEC Rev. 5, while GPU and Immersiv3D features are explicitly disabled for this variant.

Key Specifications

Pinout & Package

Package: Plastic FCBGA, 14 × 14 mm body, 0.5 mm ball pitch, 486-ball layout. Ball map defined in Section 5.1 (pages 79–94) of IMX8MNCEC Rev. 5. Pin functions follow IOMUXC-controlled multiplexing; critical interface groups include MIPI_DSI, DDR, USB1, uSDHC, and SAI.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core applications processor applications.

Compared with MIMX8MN3DVTJZAA, MIMX8MN4DVTJZAA adds GPU capability at identical package and pinout - enabling drop-in upgrade for graphics-intensive UIs - while MIMX8MN3DVPIZAA trades MIPI DSI and 1.5 GHz speed for footprint reduction, making it a true alternative only when display interface is omitted.

Availability

MIMX8MN3DVTJZAA is available at Aetrix Electronics and suitable for industrial HMIs, smart audio endpoints, and secure IoT gateways requiring stable component supply, long-term manufacturability, and NXP's consumer-qualified lifecycle support.

Supply support for MIMX8MN3DVTJZAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets.

The i.MX 8M Nano family - including MIMX8MN3DVTJZAA - was designed specifically for cost-optimized, display-enabled edge devices requiring Linux support, real-time responsiveness, and hardware security, without GPU overhead.

FAQ

What is the maximum supported DDR memory type and speed for MIMX8MN3DVTJZAA?

MIMX8MN3DVTJZAA supports LPDDR4-3200 (data rate up to 3200 MT/s), DDR4-2400, and DDR3L-1600 memory interfaces. The DDR PHY is compliant with JEDEC standards and supports up to 8 GB addressable space. LPDDR4 operation requires VDD_DRAM = 1.1 V ±3%, and layout must meet strict signal integrity requirements per Section 3.8 of IMX8MNCEC Rev. 5.

Does MIMX8MN3DVTJZAA include a GPU, and what graphics capabilities does it support?

No, MIMX8MN3DVTJZAA does not include the GC7000UL GPU. As confirmed in Table 2 of IMX8MNCEC Rev. 5, the DualLite sub-family (3DVT) explicitly omits GPU functionality. Graphics output relies solely on the LCDIF display controller driving MIPI DSI panels via CPU-managed framebuffer - suitable for 2D UIs, text, and static overlays, but not hardware-accelerated 3D rendering.

What boot devices are supported by MIMX8MN3DVTJZAA, and how is boot mode configured?

MIMX8MN3DVTJZAA supports boot from eMMC 5.1, SD/SDIO 3.0, NAND Flash (with BCH62 ECC), and QuadSPI NOR Flash. Boot mode is selected via four dedicated BOOT_MODE[3:0] pins sampled at reset release; their logic levels determine boot source priority and configuration. Strapping resistors must be placed per Figure 4-1 and Table 4-1 in IMX8MNCEC Rev. 5.

Is MIPI CSI supported on MIMX8MN3DVTJZAA, and what is its maximum data rate?

Yes, MIMX8MN3DVTJZAA includes a 4-lane MIPI CSI interface capable of up to 1.5 Gbps per lane (6 Gbps aggregate), as specified in Section 1.1 and Table 4 of IMX8MNCEC Rev. 5. This enables connection to high-resolution image sensors for machine vision or video capture applications, independent of GPU presence.

What security features are implemented in MIMX8MN3DVTJZAA, and how are they activated?

MIMX8MN3DVTJZAA integrates Arm TrustZone, CAAM (with RSA/ECC/PKHA), High Assurance Boot (HAB), Secure Non-Volatile Storage (SNVS), and Secure JTAG Controller. Activation requires fusing specific eFUSE bits (e.g., SRK hash in OCOTP) and configuring RDC domains during boot. All security blocks are silicon-verified and documented in Chapters 4 and 7 of the i.MX 8M Nano Reference Manual (IMX8MNRM).