NXP Semiconductors MIMX8MN5CVPIZAA
- Part No.:
- MIMX8MN5CVPIZAA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 306-TFBGA
- Datasheet:
-
MIMX8MN5CVPIZAA.pdf
- Description:
- IC MPU I.MX8MN 1.4GHZ 306TFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:104
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Product details
Overview
MIMX8MN5CVPIZAA from NXP Semiconductors is an industrial-grade i.MX 8M Nano UltraLite Quad application processor featuring four Arm Cortex-A53 cores (1.4 GHz), one Cortex-M7 core (750 MHz), no GPU, and no MIPI DSI interface. It integrates LPDDR4-3200/DDR4-2400 memory support, dual uSDHC controllers, Gigabit Ethernet with IEEE 1588, five SAI audio interfaces, and hardware cryptographic acceleration (CAAM) for secure boot and DRM. It targets compact, power-constrained edge AI and industrial HMI applications requiring high CPU throughput without display output.
For engineers reviewing the MIMX8MN5CVPIZAA datasheet, MIMX8MN5CVPIZAA pinout, MIMX8MN5CVPIZAA application, or MIMX8MN5CVPIZAA equivalent, key selection criteria include its 11 × 11 mm FCBGA306 package, absence of GPU and MIPI DSI, industrial temperature range (−40°C to +105°C), quad-core A53 performance at 1.4 GHz, and integrated security modules (TrustZone, HAB, CAAM) - all critical for embedded Linux-based control systems with strict BOM size and thermal constraints.
Technical Context
The MIMX8MN5CVPIZAA implements a heterogeneous dual-domain architecture: the quad-core Cortex-A53 cluster handles rich OS execution (Linux/Android), while the dedicated Cortex-M7 core manages real-time tasks, low-power sensor aggregation, and ML inference offload. Its memory subsystem supports 16-bit LPDDR4-3200 (up to 4 GB) and includes 512 KB L2 cache, 512 KB on-chip RAM, and 256 KB TCM for the M7.
Peripherals are optimized for industrial connectivity: one Gigabit Ethernet MAC with AVB/EEE/1588, three SPI, four I²C, four UART, five SAI (supporting I²S/TDM/AC97 up to 384 kHz), and dual uSDHC (MMC 5.1/SD 3.0 compliant). Security is enforced via Arm TrustZone, Resource Domain Controller (RDC), CAAM with PKHA/RNG/RTIC, and Secure JTAG with eFUSE-controlled access modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | 4× Arm Cortex-A53 @ 1.4 GHz + 1× Cortex-M7 @ 750 MHz - enables concurrent Linux application execution and deterministic real-time firmware control without OS interference. |
| Memory Interface | 16-bit LPDDR4-3200 / DDR4-2400 / DDR3L-1600 - supports up to 4 GB DRAM with sub-20 ns latency for high-throughput data pipelines in industrial gateways. |
| Security Features | Arm TrustZone, High Assurance Boot (HAB), CAAM with RSA/ECC/PKHA, 32 KB secure RAM - provides hardware-enforced secure boot, encrypted storage, and content protection for certified industrial deployments. |
| Audio Interfaces | 5× Synchronous Audio Interface (SAI) modules - delivers full-duplex I²S/TDM/AC97 with ASRC supporting 32-channel, 8–384 kHz sample rate conversion for multi-mic voice processing or audio analytics. |
| Connectivity | 1× Gigabit Ethernet (IEEE 1588/AVB/EEE), 3× uSDHC (MMC 5.1/SD 3.0), 3× SPI, 4× I²C, 4× UART - enables time-synchronized industrial networking, local flash storage, and sensor/actuator bus integration in a single SoC. |
| Package & Temp | FCBGA306, 11 × 11 mm, 0.5 mm pitch; −40°C to +105°C junction - reduces PCB area by 45% vs. 14 × 14 mm variants while maintaining industrial thermal reliability for fanless enclosures. |
| Power Management | Flexible domain partitioning with internal power switches, programmable temperature sensor trip points - allows dynamic core gating and thermal throttling in battery-powered or thermally constrained edge nodes. |
Pinout & Package
Package: FCBGA306 (11 × 11 mm, 0.5 mm pitch), RoHS-compliant, 306-ball layout with defined power/ground ball map per NXP IMX8MNIEC Rev. 5, Section 5.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core supply for Cortex-A53/M7 | 1.0 V ± 3% regulated input; powers both CPU clusters and must be filtered per IMX8MNIEC Section 3.2 to prevent timing violations. |
| NVCC_DRAM | DDR I/O supply voltage | 1.1 V for LPDDR4 or 1.2 V for DDR4; sets signal swing and termination for 16-bit DRAM interface; requires separate low-noise regulation. |
| USB1_DP / USB1_DN | Differential USB 2.0 data pair | Full-speed (12 Mbps) or high-speed (480 Mbps) signaling; requires 90 Ω differential impedance routing and ESD protection per USB spec. |
| ENET1_TXD[3:0] / RXD[3:0] | Gigabit Ethernet data lanes | RMII/RGMII-capable; RGMII mode requires precise 1.6 ns skew control between TXD/RXD and clock signals for error-free 1 Gbps operation. |
| MIPI_CSI_CLK_P/N | MIPI CSI clock differential pair | Supports camera input up to 1.5 Gbps; unused in MIMX8MN5CVPIZAA per Table 2 and Section 5.2 - balls must be tied to ground as specified in Table 8. |
Key Features
| Feature | Design Value |
|---|---|
| Quad Cortex-A53 + Cortex-M7 heterogenous compute | Enables Linux-based application layer (A53) and deterministic real-time firmware (M7) to coexist without hypervisor overhead or context-switch latency. |
| Hardware cryptographic acceleration (CAAM) | Offloads AES/3DES/RSA/ECC operations from CPU, enabling <50 µs signature verification and secure OTA updates without software crypto bottlenecks. |
| 5× SAI with ASRC and PDM support | Processes 32 independent audio channels with sample-rate conversion (1/16× to 8×), enabling multi-zone voice assistants or industrial acoustic monitoring with synchronized mic arrays. |
| Industrial temperature qualification (−40°C to +105°C) | Validated across full junction range per JEDEC JESD22-A104; eliminates derating calculations for outdoor or factory-floor deployments. |
| uSDHC with HS400 DDR and eMMC 5.1 support | Delivers up to 400 MB/s read bandwidth for local firmware storage and log buffering - sufficient for continuous 1080p video recording or sensor fusion data capture. |
Applications
| Industrial Edge Gateway | Smart Building Controller |
|---|---|
|
Use Scenario: Aggregating Modbus RTU, CAN, and BACnet MS/TP fieldbus data into MQTT/OPC UA cloud uplinks in HVAC or lighting systems. IC Role / Device Role / Timing Role: Primary application processor running Yocto Linux, managing protocol translation, TLS-secured comms, and local rule engine execution. Use Value: Quad A53 delivers >2.1 DMIPS/MHz for concurrent protocol stacks; integrated Ethernet 1588 enables sub-1 µs time synchronization across distributed sensors. |
Use Scenario: Occupancy-aware lighting and climate control using PDM microphone arrays and temperature/humidity sensors. IC Role / Device Role / Timing Role: Real-time audio analytics host (Cortex-M7) and UI/application processor (Cortex-A53) in a single chip. Use Value: Five SAIs and ASRC enable simultaneous 8-mic beamforming and multi-room audio classification; 11 × 11 mm package fits into slim wall-mounted enclosures. |
| Secure Industrial HMI | Low-Power Edge AI Node |
|
Use Scenario: Operator interface for PLC-controlled machinery with secure firmware updates and tamper-evident boot logs. IC Role / Device Role / Timing Role: Trusted execution environment (TrustZone + HAB) enforcing signed UI binaries and encrypted display frame buffers. Use Value: CAAM accelerates AES-256 encryption of display data and secure boot validation in <100 ms - meeting IEC 62443-3-3 SL2 requirements. |
Use Scenario: Predictive maintenance node analyzing vibration spectra from MEMS accelerometers using lightweight neural networks. IC Role / Device Role / Timing Role: Cortex-M7 executes quantized TensorFlow Lite Micro models; Cortex-A53 handles data preprocessing and wireless telemetry. Use Value: 256 KB TCM enables zero-wait-state inference kernels; LPDDR4-3200 bandwidth supports real-time FFT and feature extraction on streaming sensor data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8MN5CVTIZAA | Same quad-core A53/M7 configuration but in 14 × 14 mm FCBGA486 package with MIPI DSI enabled; includes GPU (GC7000UL). | Required for designs needing direct MIPI DSI display output (e.g., 1080p panels); larger footprint and higher thermal envelope. | Select when display interface is mandatory and PCB space/thermal budget permits larger package. |
| MIMX8MN3CVPIZAA | Dual-core A53 (1.4 GHz), same 11 × 11 mm package, no GPU, no MIPI DSI; identical security and peripheral set except reduced CPU count. | Suitable for cost-sensitive or lower-throughput applications (e.g., basic gateway or sensor concentrator) where quad-core headroom is unnecessary. | Select to reduce BOM cost and power consumption when application workload fits within two A53 cores. |
Compared with MIMX8MN5CVPIZAA, MIMX8MN5CVTIZAA adds display capability at the expense of board area and thermal design complexity, while MIMX8MN3CVPIZAA trades CPU performance for lower cost and power - making MIMX8MN5CVPIZAA the optimal balance for compact, high-throughput industrial edge nodes requiring maximum CPU density without display output.
Availability
MIMX8MN5CVPIZAA is available at Aetrix Electronics and suitable for industrial edge gateways, smart building controllers, secure HMIs, and low-power edge AI nodes requiring stable component supply, long-term lifecycle assurance, and qualified industrial temperature operation.
Supply support for MIMX8MN5CVPIZAA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and IoT markets, with over 50 years of embedded systems expertise and ISO 9001/TS 16949 certified manufacturing.
The i.MX 8M Nano family was designed specifically for resource-constrained edge devices requiring high CPU performance, industrial reliability, and hardware security - targeting Linux-based industrial automation, smart infrastructure, and voice-enabled edge AI applications.
FAQ
What is the maximum supported LPDDR4 speed for MIMX8MN5CVPIZAA?
MIMX8MN5CVPIZAA supports LPDDR4-3200 (3200 MT/s), meaning it operates with a 1600 MHz clock frequency and delivers up to 25.6 GB/s peak bandwidth across its 16-bit bus. This is confirmed in Table 1 (External memory interface) and Section 3.8 (System modules timing) of the IMX8MNIEC Rev. 5 datasheet. The SoC's DDRC controller and PHY are fully validated for this speed grade under industrial temperature conditions.
Does MIMX8MN5CVPIZAA include a graphics processing unit (GPU)?
No, MIMX8MN5CVPIZAA does not include a GPU. As specified in Table 2 (Modules supported) and Table 3 (Orderable part numbers), the "UltraLite Quad" variant (denoted by '5CVP') explicitly omits the GC7000UL GPU and MIPI DSI interface. This distinguishes it from MIMX8MN5CVTIZAA (which includes GPU) and aligns with its target use case: CPU-intensive, non-display edge applications.
What security features are implemented in MIMX8MN5CVPIZAA?
MIMX8MN5CVPIZAA implements Arm TrustZone, High Assurance Boot (HAB), Cryptographic Acceleration and Assurance Module (CAAM) with PKHA/RNG/RTIC, Resource Domain Controller (RDC), Secure JTAG Controller (SJC), and Secure Non-Volatile Storage (SNVS). These are documented in Sections 1.1 (Block diagram), Table 1 (Features), and Chapter 4 (Security) of IMX8MNIEC Rev. 5 - enabling secure boot, encrypted storage, and runtime integrity checking.
Can MIMX8MN5CVPIZAA support MIPI CSI camera input?
Yes, MIMX8MN5CVPIZAA supports a four-lane MIPI CSI interface (up to 1.5 Gbps per lane), as confirmed in Table 4 (Modules list) and Section 5.2 (11 x 11 mm package information). Although MIPI DSI is disabled in this variant, MIPI CSI remains fully functional - verified by the presence of MIPI_CSI_CLK_P/N and MIPI_CSI_Dx_P/N ball assignments in Table 8 and their grounding instructions for unused states.
What is the recommended power supply sequencing for MIMX8MN5CVPIZAA?
The recommended power supply sequencing for MIMX8MN5CVPIZAA is: 1) Apply all 1.8 V and 3.3 V supplies (e.g., NVCC_* rails), then 2) Apply 1.1 V DRAM supplies (NVCC_DRAM, VDD_DRAM), and finally 3) Apply core supplies (VDD_ARM, VDD_SOC) - per Section 3.2.1 (Power supply sequencing) of IMX8MNIEC Rev. 5. Violating this order risks latch-up or initialization failure, especially during cold start.
MIMX8MN5CVPIZAA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 306-TFBGA
- Series:
- i.MX8MN
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width:
- 4 Core, 64-Bit
- Speed:
- 1.4GHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- DDR3L, DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, MIPI-CSI, MIPI-DSI
- Ethernet:
- GbE
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 306-TFBGA (11x11)
- Additional Interfaces:
- AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
MIMX8MN5CVPIZAA FAQ
1.How can I place an order for MIMX8MN5CVPIZAA through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8MN5CVPIZAA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8MN5CVPIZAA reliable?
The price and inventory of MIMX8MN5CVPIZAA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8MN5CVPIZAA is usually 5 days.
3.What payment methods are accepted for MIMX8MN5CVPIZAA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8MN5CVPIZAA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8MN5CVPIZAA?
MIMX8MN5CVPIZAA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8MN5CVPIZAA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8MN5CVPIZAA?
For technical support, including MIMX8MN5CVPIZAA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8MN5CVPIZAA requirements.
6.How does Aetrix verify that MIMX8MN5CVPIZAA is sourced from the original manufacturer or authorized distributors?
All MIMX8MN5CVPIZAA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8MN5CVPIZAA meets industry standards.
7.What is the process for return or replacement of MIMX8MN5CVPIZAA?
All MIMX8MN5CVPIZAA units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8MN5CVPIZAA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8MN5CVPIZAA part is unused and in its original packaging.
Return procedure for MIMX8MN5CVPIZAA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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