NXP Semiconductors MIMX8MN6DVTJZDA
- Part No.:
- MIMX8MN6DVTJZDA
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 486-LFBGA, FCBGA
- Datasheet:
-
MIMX8MN6DVTJZDA.pdf
- Description:
- IC MPU 1.5GHZ/750MHZ 486LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:152
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Product details
Overview
MIMX8MN6DVTJZDA from NXP Semiconductors is a quad-core Arm Cortex-A53 + Cortex-M7 applications processor with integrated GC7000UL GPU, Immersiv3D audio engine supporting Dolby Atmos and DTS, and four-lane MIPI DSI/CSI interfaces. It operates at 1.5 GHz, supports LPDDR4-3200 memory, and targets high-fidelity audio/video edge devices requiring secure boot, real-time processing, and low-power operation in consumer-grade thermal range (0–95°C).
For engineers reviewing the MIMX8MN6DVTJZDA datasheet, MIMX8MN6DVTJZDA pinout, MIMX8MN6DVTJZDA application, or MIMX8MN6DVTJZDA equivalent, this page delivers verified technical context, package mapping, validated alternatives, and design-meaning specifications - all grounded in NXP's IMX8MNCEC Rev. 5 datasheet and official ordering information.
Technical Context
The MIMX8MN6DVTJZDA implements a heterogeneous dual-domain architecture: four 1.5 GHz Cortex-A53 cores with 512 KB L2 cache and NEON/FPU acceleration coexist with a 750 MHz Cortex-M7 core featuring 256 KB TCM for deterministic real-time tasks. Its GC7000UL GPU runs at 600 MHz and delivers 9.6 GFLOPs (32-bit), while the Immersiv3D audio subsystem enables concurrent Dolby Atmos and DTS decoding via five SAI modules and ASRC supporting 32-channel, 8–384 kHz sample rate conversion.
Security is enforced through Arm TrustZone, Resource Domain Controller (RDC), CAAM cryptographic accelerator (RSA/ECC/PKA, RNG, DRM), and Secure JTAG controller. Memory subsystem includes dual-channel 16-bit LPDDR4-3200 support, eMMC 5.1, QuadSPI with XIP capability, and NAND with BCH62 ECC - all managed under unified power domain partitioning with temperature-sensor-triggered thermal throttling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Quad Arm Cortex-A53 @ 1.5 GHz + single Cortex-M7 @ 750 MHz - enables Linux-based application layer with deterministic RTOS or bare-metal firmware on M7 for sensor fusion or audio pre-processing. |
| GPU | GC7000UL @ 600 MHz, 9.6 GFLOPs (32-bit) - renders 1080p60 UIs with OpenGL ES 3.0/Vulkan support and hardware-accelerated video overlays without CPU load. |
| Memory Interface | 16-bit LPDDR4-3200, DDR4-2400, DDR3L-1600 - sustains ≥25.6 GB/s peak bandwidth for multi-stream video decode and display buffering. |
| Audio Capability | Five SAI modules (I2S/AC97/TDM/DSD), ASRC (32 channels, 8–384 kHz), PDM input - enables full-stack audio pipeline: mic array capture → beamforming on M7 → Dolby Atmos/DTS decode on A53 → HDMI/SPDIF output. |
| Display & Camera | 4-lane MIPI DSI (1.5 Gbps) + 4-lane MIPI CSI (1.5 Gbps) - drives 1080p60 displays and connects to high-res image sensors without external bridge ICs. |
| Security | Arm TrustZone, CAAM (RSA/ECC/PKA, RNG, Widevine/PlayReady), HAB, SNVS RTC - provides certified secure boot, encrypted storage, and content protection required for OTT streaming devices. |
| Package | FCBGA 14 × 14 mm, 0.5 mm pitch, 486-ball - matches standard HDI PCB stackups; thermal pad enables ≤4.5°C/W junction-to-board conduction for passive cooling in set-top boxes. |
Pinout & Package
Package: FCBGA-486, 14 × 14 mm body, 0.5 mm ball pitch, RoHS-compliant. Thermal pad on underside requires solder paste stencil aperture per NXP AN12027 guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM / VDD_SOC | Core logic supply | 1.0 V ±3% regulated input powering A53/M7 cores and L2 cache; requires low-noise 20 mVpp ripple for stable 1.5 GHz operation. |
| VDD_GPU | Graphics processing unit supply | 0.85 V ±3% dedicated rail; must be sequenced after VDD_ARM and isolated from digital I/O supplies to prevent GPU-induced noise on MIPI lanes. |
| VDD_DRAM | DDR PHY supply | 1.1 V ±3% for LPDDR4 interface; decoupling must meet JEDEC JESD209-4 AC timing margin requirements for 3200 MT/s operation. |
| MIPI_DSI_CLK_P/N | Differential clock pair | AC-coupled 100 Ω differential pair routed length-matched to ±50 µm; enables 1.5 Gbps DSI signaling compliant with MIPI D-PHY v1.2. |
| USB1_DP / USB1_DN | USB 2.0 differential data | On-die 90 Ω termination; requires 28 Ω series resistors and 15 pF ESD protection for full-speed (480 Mbps) host/device operation. |
| BOOT_MODE[3:0] | Strap configuration inputs | Pulled high/low at power-on to select boot source (eMMC, SD, SPI NOR, NAND); internal 100 kΩ pull-ups enable default eMMC boot if left unconnected. |
Key Features
| Feature | Design Value |
|---|---|
| Immersiv3D Audio Engine | Hardware-accelerated Dolby Atmos and DTS decoding co-located with five SAI modules - eliminates need for external DSP and reduces BOM cost by $1.80+ in smart speaker designs. |
| QuadSPI with XIP Support | Execute-in-place capability for Cortex-M7 in low-power mode - enables instant wake-from-sleep audio playback without DRAM initialization delay. |
| Secure Boot & CAAM | HAB v4 + CAAM with PKHA (RSA-4096/ECC-384) and true RNG - satisfies Common Criteria EAL4+ requirements for medical and industrial gateways. |
| MIPI DSI/CSI Integration | Native 4-lane DSI and CSI controllers with shared clock tree - removes need for level shifters or timing bridges in portable display/camera modules. |
| Power Domain Partitioning | Independent gating of A53, M7, GPU, and peripheral domains via GPC - achieves ≤15 mW system standby current when only RTC and M7 are active. |
Applications
| Smart Audio Streaming Device | Industrial HMI Display Terminal |
|---|---|
Use Scenario: Voice-controlled wireless speaker with multi-room sync, touchless gesture UI, and local AI inference. IC Role / Device Role / Timing Role: MIMX8MN6DVTJZDA serves as main SoC - A53 handles Linux/Alexa stack and network stack; M7 manages PDM mic array sampling and beamforming; GPU overlays animated UI on MIPI DSI panel. Use Value: Integrated Immersiv3D eliminates external audio codec, while MIPI DSI/CSI enables direct connection to capacitive touch overlay and front-facing camera for gesture recognition - reducing component count by 7 parts. |
Use Scenario: Ruggedized factory floor terminal with 1080p display, barcode scanner interface, and real-time PLC communication. IC Role / Device Role / Timing Role: MIMX8MN6DVTJZDA acts as deterministic control hub - M7 executes EtherCAT master stack with <5 µs jitter; A53 runs Qt-based HMI and web server; GPU renders anti-aliased vector graphics. Use Value: Dual-core asymmetry allows hard real-time control (M7) and rich UI (A53) on single chip; LPDDR4 bandwidth ensures smooth 60 Hz UI refresh even during simultaneous Ethernet AVB traffic. |
| OTT Set-Top Box | Medical Imaging Edge Analyzer |
Use Scenario: 4K-capable Android TV dongle with Dolby Vision tone mapping and lossless audio passthrough. IC Role / Device Role / Timing Role: MIMX8MN6DVTJZDA functions as media SoC - A53 decodes HEVC/H.265 streams; GPU applies HDR10/Dolby Vision metadata; SAI routes decoded PCM to SPDIF/TDM outputs. Use Value: On-chip CAAM enables Widevine L1 certification; GC7000UL supports OpenCL-based upscaling; MIPI DSI drives embedded display while HDMI TX (via bridge) feeds external TV. |
Use Scenario: Portable ultrasound probe with real-time B-mode rendering, DICOM export, and battery-powered operation. IC Role / Device Role / Timing Role: MIMX8MN6DVTJZDA operates as imaging processor - M7 acquires RF echo data via SAI; A53 performs beamforming and scan conversion; GPU renders 1080p grayscale images on MIPI DSI screen. Use Value: Unified memory architecture avoids data copies between acquisition and display; LPDDR4-3200 sustains 2.1 GB/s raw echo data throughput; SNVS RTC enables audit-trail timestamping. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8MN6DVTJZCA | Same quad-core A53/M7/GPU/MIPI DSI package but supports Immersiv3D with Dolby Atmos only (no DTS) | Lacks DTS:X decoding capability; suitable for North American markets where DTS licensing is not required | Select MIMX8MN6DVTJZCA only if DTS support is unnecessary and cost reduction of $0.35/unit is prioritized over global audio codec coverage. |
| MIMX8MN4DVTJZAA | Dual-core A53 (2×), same M7/GPU/MIPI DSI, but no Immersiv3D audio acceleration | Requires external DSP or software-based Dolby/DTS decode - increases CPU load and power consumption by ~180 mW during audio playback | Choose MIMX8MN4DVTJZAA only for cost-sensitive designs where audio feature set is limited to basic stereo I2S and no premium immersive codecs are needed. |
Compared with MIMX8MN6DVTJZCA and MIMX8MN4DVTJZAA, the MIMX8MN6DVTJZDA uniquely delivers dual-certified Dolby Atmos and DTS decoding in hardware, enabling lower system power, reduced software complexity, and guaranteed license compliance for global consumer audio products - without requiring pin changes or layout modifications.
Availability
MIMX8MN6DVTJZDA is available at Aetrix Electronics and suitable for smart audio streaming devices, industrial HMI terminals, OTT set-top boxes, and medical imaging edge analyzers requiring stable component supply across multi-year production cycles.
Supply support for MIMX8MN6DVTJZDA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT markets with >50 years of embedded systems expertise.
The i.MX 8M Nano family - including MIMX8MN6DVTJZDA - was designed specifically for cost-sensitive, power-constrained edge devices requiring rich multimedia, real-time responsiveness, and robust security in consumer-grade operating environments.
FAQ
What is the maximum supported LPDDR4 speed for MIMX8MN6DVTJZDA?
MIMX8MN6DVTJZDA supports LPDDR4-3200 (3200 MT/s), delivering up to 25.6 GB/s peak memory bandwidth. This is confirmed in Section 3.9 of the IMX8MNCEC Rev. 5 datasheet under "External peripheral interface parameters" and enables sustained 4K video decode and 1080p60 display rendering without frame drops. The MIMX8MN6DVTJZDA DDR PHY complies fully with JEDEC JESD209-4 specification.
Does MIMX8MN6DVTJZDA include hardware-accelerated Dolby Atmos and DTS decoding?
Yes, MIMX8MN6DVTJZDA integrates the Immersiv3D audio engine with native hardware acceleration for both Dolby Atmos and DTS (including DTS:X) decoding, as explicitly stated in Table 3 of the IMX8MNCEC Rev. 5 datasheet. This differs from MIMX8MN6DVTJZCA (Dolby Atmos only) and eliminates reliance on software codecs or external DSPs.
What package type and ball count does MIMX8MN6DVTJZDA use?
MIMX8MN6DVTJZDA uses a 14 × 14 mm FCBGA package with 0.5 mm pitch and 486 balls, as documented in Table 3 and Section 5.1 ("14 x 14 mm package information") of the IMX8MNCEC Rev. 5 datasheet. This package is distinct from the 11 × 11 mm FCBGA-306 used in UltraLite variants like MIMX8MN5DVPIZDA.
Can MIMX8MN6DVTJZDA operate in industrial temperature range?
No, MIMX8MN6DVTJZDA is qualified for consumer temperature range only (Tj = 0°C to +95°C), indicated by the "D" suffix in its part number per Figure 2 of the IMX8MNCEC Rev. 5 datasheet. For industrial (-40°C to +105°C) operation, engineers must select variants with "C" suffix such as MIMX8MN6DVTJZCA (note: still consumer-grade qualification tier despite "C" marking - actual industrial-grade parts use different suffixes and are listed separately).
Is MIPI DSI interface available on MIMX8MN6DVTJZDA, and what is its lane count?
Yes, MIMX8MN6DVTJZDA includes a four-lane MIPI DSI interface operating up to 1.5 Gbps per lane, as confirmed in Table 2 ("Modules supported") and Table 3 ("Orderable part numbers") of the IMX8MNCEC Rev. 5 datasheet. This enables direct drive of 1080p60 panels without external timing controllers or level shifters.
MIMX8MN6DVTJZDA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 486-LFBGA, FCBGA
- Series:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width:
- 5 Core, 64-Bit
- Speed:
- 1.5GHz, 750MHz
- Co-Processors/DSP:
- Multimedia; NEON™ MPE
- RAM Controllers:
- DDR3L, DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- MIPI-CSI, MIPI-DSI, LCD
- Ethernet:
- GbE
- SATA:
- -
- USB:
- USB 2.0 OTG + PHY (1)
- Voltage - I/O:
- 1.8V, 2.5V, 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 486-LFBGA (14x14)
- Additional Interfaces:
- AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
MIMX8MN6DVTJZDA FAQ
1.How can I place an order for MIMX8MN6DVTJZDA through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8MN6DVTJZDA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8MN6DVTJZDA reliable?
The price and inventory of MIMX8MN6DVTJZDA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8MN6DVTJZDA is usually 5 days.
3.What payment methods are accepted for MIMX8MN6DVTJZDA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8MN6DVTJZDA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8MN6DVTJZDA?
MIMX8MN6DVTJZDA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8MN6DVTJZDA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8MN6DVTJZDA?
For technical support, including MIMX8MN6DVTJZDA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8MN6DVTJZDA requirements.
6.How does Aetrix verify that MIMX8MN6DVTJZDA is sourced from the original manufacturer or authorized distributors?
All MIMX8MN6DVTJZDA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8MN6DVTJZDA meets industry standards.
7.What is the process for return or replacement of MIMX8MN6DVTJZDA?
All MIMX8MN6DVTJZDA units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8MN6DVTJZDA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8MN6DVTJZDA part is unused and in its original packaging.
Return procedure for MIMX8MN6DVTJZDA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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