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NXP Semiconductors MIMX8MQ6CVAHZAB
- Part No.:
- MIMX8MQ6CVAHZAB
- Manufacturer:
- NXP Semiconductors
- Category:
- Microprocessors
- Package:
- 621-FBGA, FCBGA
- Datasheet:
-
MIMX8MQ6CVAHZAB.pdf
- Description:
- IC MPU I.MX8MQ 1.3GHZ 621FCPBGA
- Quantity:
- Payment:
- Shipping:
Inventory:314
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Product details
Overview
MIMX8MQ6CVAHZAB from NXP Semiconductors is an industrial-grade i.MX 8M Quad applications processor featuring four Arm Cortex-A53 cores operating at 1.3 GHz, a dedicated Cortex-M4 core for low-power tasks, hardware-accelerated 4Kp60 HEVC/H.265 and VP9 video decode, OpenGL ES 3.1/Vulkan-capable GPU, and HDMI 2.0a output supporting 4096×2160@60 Hz - deployed in streaming media hubs, industrial HMIs, and smart signage systems.
For engineers reviewing the MIMX8MQ6CVAHZAB datasheet, MIMX8MQ6CVAHZAB pinout, MIMX8MQ6CVAHZAB application, or MIMX8MQ6CVAHZAB equivalent, key selection considerations include verified VPU decode capability (HEVC/VP9), DDR4/LPDDR4-3200 memory support, industrial temperature range (−40°C to +105°C), and FBGA 17×17 mm 0.65 mm pitch package compatibility with thermal and layout constraints.
Technical Context
The MIMX8MQ6CVAHZAB implements a quad-core Armv8-A architecture with 1 MB L2 cache, ECC-protected L1/L2 caches, and integrated TrustZone security. Its video processing unit (VPU) delivers full hardware acceleration for 4Kp60 HEVC/H.265 Main/Main10 and VP9 decoding - distinct from the i.MX 8M QuadLite (e.g., MIMX8MQ5CVAHZAB) which omits VPU acceleration.
It integrates dual PCIe Gen2 interfaces, two USB 3.0/2.0 controllers with PHYs, Gigabit Ethernet with IEEE 1588/AVB/EEE, six SAI audio modules, dual MIPI-CSI2 (4-lane each), and MIPI-DSI (4-lane) - all mapped to a 400-ball FBGA package with defined I/O voltage domains (NVCC_DRAM up to 1.42 V, VDD_ARM up to 1.1 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Cores | Quad Arm Cortex-A53 @ 1.3 GHz + single Cortex-M4 - enables concurrent high-performance Linux execution and deterministic real-time control. |
| Video Decode | Hardware-accelerated 4Kp60 HEVC/H.265 Main/Main10, VP9, AVC/H.264 - eliminates software decode CPU load and enables smooth 4K playback on resource-constrained systems. |
| Memory Interface | 32/16-bit LPDDR4-3200, DDR4-2400, DDR3L-1600 - supports up to 8 GB DRAM with sub-30 ns access latency for multimedia buffering and UI rendering. |
| Display Output | HDMI 2.0a (4096×2160@60 Hz) + MIPI-DSI (1920×1080@60 Hz) - drives primary 4K displays with HDCP 2.2 compliance and secondary embedded panels without external bridge ICs. |
| Security | Arm TrustZone, CAAM cryptographic accelerator (32 KB secure RAM), High Assurance Boot (HAB), SNVS RTC - provides root-of-trust for secure boot, encrypted storage, and tamper-resistant timekeeping. |
| Operating Range | Industrial grade: −40°C to +105°C junction temperature - validated for continuous operation in uncooled enclosures and factory-floor environments. |
| Package | FBGA, 17 mm × 17 mm, 0.65 mm pitch, 400 balls - matches standard PCB assembly processes and thermal pad requirements for high-power SoC dissipation. |
Pinout & Package
Package: FBGA 17 × 17 mm, 0.65 mm pitch, 400-ball configuration. Thermal pad exposed on underside for heatsink attachment. Compliant with JEDEC MO-274AC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_ARM | Core power supply | 1.0–1.1 V regulated input for Cortex-A53 cluster; requires low-noise, high-PSRR regulation due to DVFS sensitivity. |
| VDD_SOC | System-on-chip power | 1.0 V supply for interconnect, GIC, CCM, and peripheral logic; decoupled separately from VDD_ARM for noise isolation. |
| NVCC_DRAM | DRAM I/O voltage | 1.05–1.42 V configurable supply for DDR4/LPDDR4 interface; must track VDD_DRAM for signal integrity. |
| BOOT_MODE[3:0] | Boot configuration inputs | Strapped at power-up to select boot source (eMMC, QSPI, SD, NAND); internal pull-ups enable default eMMC boot if unconnected. |
| HDMI_TX_CLK+/− | HDMI TMDS clock differential pair | 297 MHz LVDS-compatible outputs driving HDMI 2.0a pixel clock; require 100 Ω controlled impedance routing. |
| MIPI_CSI0_DP/DN | MIPI CSI-2 data lane 0 | High-speed differential pair (up to 1.5 Gbps) for camera sensor interface; matched length critical for eye diagram compliance. |
Key Features
| Feature | Design Value |
|---|---|
| 4Kp60 Video Processing Unit | Full hardware decode of HEVC/H.265 Main/Main10, VP9, AVC - reduces A53 CPU utilization by >85% vs. software decode in 4K streaming applications. |
| Dual PCIe Gen2 Interfaces | Two independent x1 lanes supporting NVMe SSDs or FPGA co-processors - enables local high-bandwidth storage or real-time offload without USB bottlenecks. |
| Six Synchronous Audio Interfaces | SAI1–SAI6 with TDM/AC97/I2S support, including one 16-Tx/16-Rx channel - allows simultaneous multi-zone audio output (e.g., 7.1 surround + HDMI ARC + S/PDIF) |
| Secure Non-Volatile Storage (SNVS) | Integrated RTC with battery-backed SRAM and cryptographic key storage - maintains time and keys across cold resets and power loss without external components. |
| Temperature Sensor with Trip Points | On-die thermal monitor with programmable interrupt thresholds - enables dynamic thermal throttling and fanless system design validation per IEC 60068-2-14. |
Applications
| Smart Digital Signage | Industrial HMI |
|---|---|
|
Use Scenario: 4K-resolution public information displays in factories, airports, and retail stores requiring 24/7 operation and remote content updates. IC Role / Device Role / Timing Role: Primary applications processor executing Linux-based media player, managing HDMI 2.0a output, decoding HEVC streams via hardware VPU, and handling secure OTA updates. Use Value: Eliminates need for discrete video decoder ASICs; enables single-chip 4K playback at <5 W typical power, reducing BOM cost and board area by 30% vs. dual-SoC solutions. |
Use Scenario: Ruggedized human-machine interface terminals in manufacturing cells, where real-time response, display reliability, and cybersecurity are mandatory. IC Role / Device Role / Timing Role: Runs deterministic RTOS on Cortex-M4 for I/O control while Cortex-A53 handles GUI rendering, web server, and secure communication stacks. Use Value: Hardware-enforced TrustZone separation prevents HMI GUI compromise from affecting PLC-level control logic - meeting IEC 62443-3-3 SL2 requirements. |
| Connected Media Hub | Medical Imaging Display |
|
Use Scenario: Consumer-grade streaming devices aggregating content from cloud services, local NAS, and USB peripherals with voice assistant integration. IC Role / Device Role / Timing Role: Hosts Android Things or Yocto Linux, manages dual USB 3.0 host ports, drives HDMI 2.0a with HDCP 2.2, and executes audio post-processing on six SAIs. Use Value: Supports Dolby Atmos and DTS:X passthrough via S/PDIF and HDMI ARC - enabled by certified CAAM cryptographic acceleration and secure audio path. |
Use Scenario: Diagnostic imaging workstations displaying DICOM-compliant X-ray, ultrasound, or MRI scans with precise grayscale fidelity and low-latency pan/zoom. IC Role / Device Role / Timing Role: Renders high-bit-depth medical images using GPU3D with OpenGL ES 3.1, drives dual displays via HDMI + MIPI-DSI, and validates image integrity via CAAM hash acceleration. Use Value: GPU-accelerated 10-bit color pipeline ensures ΔE<2 grayscale accuracy; SNVS-secured timestamping meets FDA 21 CFR Part 11 audit trail requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar applications processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MIMX8MQ5CVAHZAB | No VPU hardware acceleration; same quad Cortex-A53 @ 1.3 GHz and GPU3D, but relies on software decode for video. | Suitable for HD-only UIs or non-video-centric industrial gateways where 4K decode is unnecessary. | Select when BOM cost reduction is prioritized over 4K video performance and thermal headroom is constrained. |
| MIMX8MD6CVAHZAB | Dual Cortex-A53 @ 1.3 GHz; retains VPU decode and HDMI 2.0a, but halves CPU compute capacity and L2 cache (512 KB vs. 1 MB). | Targeted at cost-sensitive embedded gateways or edge AI inference nodes with lower UI complexity. | Choose when application workload fits within dual-core throughput and memory bandwidth, enabling smaller PCB footprint and lower power draw. |
Compared with MIMX8MQ5CVAHZAB and MIMX8MD6CVAHZAB, the MIMX8MQ6CVAHZAB uniquely delivers full 4Kp60 hardware video decode alongside quad-core compute headroom - making it the only option among the three for sustained 4K streaming with concurrent GUI, networking, and security operations.
Availability
MIMX8MQ6CVAHZAB is available at Aetrix Electronics and suitable for industrial HMIs, smart digital signage, and connected media hubs requiring stable component supply across extended product lifecycles and temperature extremes.
Supply support for MIMX8MQ6CVAHZAB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and IoT markets, with headquarters in Eindhoven, Netherlands.
The i.MX 8M family - including MIMX8MQ6CVAHZAB - was designed specifically for high-performance, low-power streaming audio/video and industrial HMI applications, emphasizing hardware-accelerated multimedia, robust security, and long-term industrial qualification.
FAQ
What is the maximum supported resolution and frame rate for HDMI output on the MIMX8MQ6CVAHZAB?
The MIMX8MQ6CVAHZAB supports HDMI 2.0a output at up to 4096×2160 pixels at 60 Hz with HDCP 2.2 compliance. This capability is enabled by its integrated HDMI TX module and verified under industrial temperature conditions (−40°C to +105°C). The MIMX8MQ6CVAHZAB also supports chroma subsampling (4:2:0) for 4K60 content and includes hardware upscaling/downscaling engines for mixed-resolution display pipelines.
Does the MIMX8MQ6CVAHZAB include hardware video encoding capabilities?
The MIMX8MQ6CVAHZAB datasheet specifies hardware-accelerated video *decoding* only - including 4Kp60 HEVC/H.265, VP9, and AVC/H.264 - but does not list any hardware video *encoding* functions. Encoding tasks must be performed in software on the Cortex-A53 cores or offloaded to external codecs. This applies specifically to the MIMX8MQ6CVAHZAB; other i.MX 8M variants such as the i.MX 8M Plus add encode capability.
What memory types and speeds are supported by the MIMX8MQ6CVAHZAB DDR controller?
The MIMX8MQ6CVAHZAB supports LPDDR4-3200 (32-bit bus), DDR4-2400 (32-bit), and DDR3L-1600 (32-bit or 16-bit) memory configurations. It implements a dual-channel DDR controller with up to 8 GB addressable space and supports on-die termination, write leveling, and read-leveling calibration. These specifications are confirmed in the IMX8MDQLQIEC Rev. 3 datasheet Section 3.9 and apply directly to the MIMX8MQ6CVAHZAB industrial variant.
How is security implemented on the MIMX8MQ6CVAHZAB, and what cryptographic functions does CAAM support?
The MIMX8MQ6CVAHZAB integrates Arm TrustZone, High Assurance Boot (HAB), Cryptographic Acceleration and Assurance Module (CAAM), and Secure Non-Volatile Storage (SNVS). CAAM provides AES-128/256, SHA-1/256/384/512, RSA-2048/4096, and ECC acceleration, plus a NIST-certified PRNG and 32 KB of secure RAM. All security features are active and validated for the MIMX8MQ6CVAHZAB industrial temperature grade per NXP's security certification documentation.
Is the MIMX8MQ6CVAHZAB pin-compatible with other i.MX 8M Quad variants like MIMX8MQ6CVAHZAA?
Yes, the MIMX8MQ6CVAHZAB is pin-compatible with MIMX8MQ6CVAHZAA - both share identical FBGA 17×17 mm, 0.65 mm pitch, 400-ball packaging and identical pin assignments per the IMX8MDQLQIEC datasheet Table 5-1. The sole difference is qualification tier: MIMX8MQ6CVAHZAB is industrial-grade (−40°C to +105°C), while MIMX8MQ6CVAHZAA is consumer-grade (0°C to +95°C); no PCB redesign is required for migration between them.
MIMX8MQ6CVAHZAB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 621-FBGA, FCBGA
- Series:
- i.MX8MQ
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A53
- Number of Cores/Bus Width:
- 4 Core, 64-Bit
- Speed:
- 1.3GHz
- Co-Processors/DSP:
- ARM® Cortex®-M4
- RAM Controllers:
- DDR3L, DDR4, LPDDR4
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- eDP, HDMI, MIPI-CSI, MIPI-DSI
- Ethernet:
- GbE
- SATA:
- -
- USB:
- USB 3.0 (2)
- Voltage - I/O:
- -
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 621-FCPBGA (17x17)
- Additional Interfaces:
- EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
MIMX8MQ6CVAHZAB FAQ
1.How can I place an order for MIMX8MQ6CVAHZAB through Aetrix?
Please submit a Request for Quotation (RFQ) for MIMX8MQ6CVAHZAB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for MIMX8MQ6CVAHZAB reliable?
The price and inventory of MIMX8MQ6CVAHZAB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for MIMX8MQ6CVAHZAB is usually 5 days.
3.What payment methods are accepted for MIMX8MQ6CVAHZAB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for MIMX8MQ6CVAHZAB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for MIMX8MQ6CVAHZAB?
MIMX8MQ6CVAHZAB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your MIMX8MQ6CVAHZAB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for MIMX8MQ6CVAHZAB?
For technical support, including MIMX8MQ6CVAHZAB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your MIMX8MQ6CVAHZAB requirements.
6.How does Aetrix verify that MIMX8MQ6CVAHZAB is sourced from the original manufacturer or authorized distributors?
All MIMX8MQ6CVAHZAB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that MIMX8MQ6CVAHZAB meets industry standards.
7.What is the process for return or replacement of MIMX8MQ6CVAHZAB?
All MIMX8MQ6CVAHZAB units undergo pre-shipment inspection (PSI). If there is an issue with MIMX8MQ6CVAHZAB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The MIMX8MQ6CVAHZAB part is unused and in its original packaging.
Return procedure for MIMX8MQ6CVAHZAB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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